Patents by Inventor Yi Lin

Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240081002
    Abstract: An electronic device having a function of automatically switching operation modes includes a circuit board, a first case, a second case, and a connector. The second case is assembled with the first case to form an accommodating space. The circuit board is disposed inside the accommodating space. The connector is disposed on the first case and applied for the circuit board. The connector can include a first contacting portion and a second contacting portion. The second contacting portion is equipped with the first contacting portion. The first contacting portion is pressed by the second case and drive deformation of the second contacting portion, and the second contacting portion contacts the circuit board to keep in a first operation mode. When the second case is removed from the first case, the second contacting portion is resiliently recovered and the circuit board is switched to a second operation mode.
    Type: Application
    Filed: April 19, 2023
    Publication date: March 7, 2024
    Applicant: QISDA CORPORATION
    Inventor: Ting-Yi Lin
  • Publication number: 20240079439
    Abstract: A pixel of an image sensor includes: a semiconductor material substrate; a photosensitive region formed in the substrate, the photosensitive region generating photo-induced electrical charge in response to illumination with light; a storage node formed in the substrate proximate to the photosensitive region, the storage node selectively receiving and storing photo-induced electrical charge generated by the photosensitive region; and a shield formed over the storage node which inhibits light from reaching the storage node, the shield including an extension which protrudes into the substrate and surrounds an outer periphery of the storage node.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 7, 2024
    Inventors: Chung-Yi Lin, Yueh-Chuan Lee, Chia-Chan Chen
  • Publication number: 20240079357
    Abstract: An integrated circuit (IC) device includes a redistribution line over a substrate, wherein a first angle between a topmost surface of the redistribution line and a sidewall of the redistribution line is within a first angle range, a second angle between a bottommost surface of the redistribution line and the sidewall of the redistribution line is within a second angle range, and the second angle range is different from the first angle range. The IC device further includes a passivation layer over the redistribution line, wherein a bottommost surface of the passivation layer is below the bottommost surface of the redistribution line.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Yi-An LIN, Alan KUO, C. C. CHANG, Yu-Lung SHIH
  • Publication number: 20240076797
    Abstract: A susceptor assembly for supporting a crucible during a crystal growth process includes a susceptor base, a tubular sidewall connected to the susceptor base, and a removable sacrifice ring interposed between the susceptor base and the sidewall. Each of the susceptor base and the sidewall is formed of a carbon-containing material. The susceptor base has an annular wall and a shoulder extending radially outward from an outer surface of the annular wall. The sidewall has a first end that receives the annular wall to connect the sidewall to the susceptor base. The sacrifice ring has a first surface that faces the outer surface of the annular wall, a second surface that faces an interior surface of the sidewall, and a ledge extending outward from the second surface that engages the first end of the sidewall.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Hong-Huei Huang, Benjamin Michael Meyer, Chun-Sheng Wu, Wei-Chen Chou, Chen-Yi Lin, Feng-Chien Tsai
  • Patent number: 11923353
    Abstract: A method includes forming a release film over a carrier, forming a polymer buffer layer over the release film, forming a metal post on the polymer buffer layer, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, and decomposing a first portion of the release film. A second portion of the release film remains after the decomposing. An opening is formed in the polymer buffer layer to expose the metal post.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu
  • Patent number: 11921474
    Abstract: A virtual metrology method using a convolutional neural network (CNN) is provided. In this method, a dynamic time warping (DTW) algorithm is used to delete unsimilar sets of process data, and adjust the sets of process data to be of the same length, thereby enabling the CNN to be used for virtual metrology. A virtual metrology model of the embodiments of the present invention includes several CNN models and a conjecture model, in which plural inputs of the CNN model are sets of time sequence data of respective parameters, and plural outputs of the CNN models are inputs to the conjecture model.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: March 5, 2024
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Fan-Tien Cheng, Yu-Ming Hsieh, Tan-Ju Wang, Li-Hsuan Peng, Chin-Yi Lin
  • Patent number: 11922578
    Abstract: A method for adjusting point cloud density, an electronic device, and a storage medium are provided. In the method an initial point cloud map and a distance determination threshold of a robot are obtained. A plurality of target regions in the initial point cloud map are determined, and an environmental complexity value of each target region is calculated. The initial point cloud map is divided into submaps, and a point cloud density coefficient of each submap is determined. The initial point cloud map is adjusted according to the point cloud density coefficient and the target point cloud map is obtained. By utilizing such method, adjustment efficiency and an accuracy of point cloud density can be improved.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: March 5, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jung-Yi Lin, Chieh Lee
  • Publication number: 20240065386
    Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Dragan Jurkovic, Ming-Feng Jean, Chin-Yi Lin, Chun-Chi Lin
  • Publication number: 20240066319
    Abstract: A dose control system, including a processing device configured to obtain the real drug concentration in plasma of a patient. The processing device is further configured to calculate the corrected dose rate distribution datum based on the real drug concentration in plasma and a set of correction coefficients. The processing device is further configured to calculate the irradiation time based on the corrected dose rate distribution datum and the prescribed dose distribution datum. The processing device is further configured to control the irradiation device to irradiate the patient for the irradiation time.
    Type: Application
    Filed: February 3, 2023
    Publication date: February 29, 2024
    Applicant: Heron Neutron Medical Corp.
    Inventor: Tzung-Yi LIN
  • Publication number: 20240071950
    Abstract: Integrated circuit packages and methods of forming the same are discussed. In an embodiment, a device includes: a package substrate; a semiconductor device attached to the package substrate; an underfill between the semiconductor device and the package substrate; and a package stiffener attached to the package substrate, the package stiffener includes: a main body extending around the semiconductor device and the underfill in a top-down view, the main body having a first coefficient of thermal expansion; and pillars in the main body, each of the pillars extending from a top surface of the main body to a bottom surface of the main body, each of the pillars physically contacting the main body, the pillars having a second coefficient of thermal expansion, the second coefficient of thermal expansion being less than the first coefficient of thermal expansion.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Wen-Yi Lin, Kuang-Chun Lee, Chien-Chen Li, Chien-Li Kuo, Kuo-Chio Liu
  • Publication number: 20240071854
    Abstract: Some implementations described herein a provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, which may correspond to a dome-shaped structure, may be on a surface of the system-on-chip integrated circuit die and enveloped by an underfill material between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, in combination with the underfill material, may be a portion of a thermal circuit having one or more thermal conductivity properties to quickly spread and transfer heat within the multi-die package so that a temperature of the system-on-chip integrated circuit die satisfies a threshold.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Wen-Yi LIN, Kuang-Chun LEE, Chien-Chen LI, Chien-Li KUO, Kuo-Chio LIU
  • Publication number: 20240069295
    Abstract: An optical transceiver includes housing, connector coupler and internal optical connector. Opening of housing is located on a side of housing and connected to accommodation space of housing. Connector coupler includes positioning frame and at least one elastic holding arm. Elastic holding arm protrudes from positioning frame and forms holding space. Positioning frame is located between at least a part of elastic holding arm and opening. Positioning frame is disposed in accommodation space. Positioning recess is located on a side of positioning frame close to opening and connected to holding space. At least a part of internal optical connector is located in holding space to be held in position by elastic holding arm. Positioning recess is configured to position external optical connector so as to allow internal optical connector to be plugged with and optically coupled to external optical connector.
    Type: Application
    Filed: December 6, 2022
    Publication date: February 29, 2024
    Inventors: Gaofei YAO, Qilin HONG, Yi LIN, PengBin LIN
  • Publication number: 20240070451
    Abstract: A computer-program product storing instructions which, when executed by a computer, cause the computer to receive an input data from a sensor, generate a training data set utilizing the input data, wherein the training data set is created by creating one or more copies of the input data and adding noise to the one or more copies, send the training data set to a diffusion model, wherein the diffusion model is configured to reconstruct and purify the training data set by removing noise associated with the input data and reconstructing the one or more copies of the training data set to create a modified input data set, send the modified input data set to a fixed classifier, and output a classification associated with the input data in response to a majority vote of the classification obtained by the fixed classifier of the modified input data set.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Jingyang ZHANG, Chaithanya Kumar MUMMADI, Wan-Yi LIN, Ivan BATALOV, Jeremy KOLTER
  • Publication number: 20240069912
    Abstract: A method for identifying hard-coded strings in source code is disclosed. In one embodiment, such a method parses source code and associated localization resource files to identify hard-coded strings and their associated context. The method provides a confidence score for each hard-coded string that indicates whether the hard-coded string is translatable or non-translatable. Based on the confidence score for each hard-coded string, the method transforms each hard-coded string into a single equivalence word. The method then prepares training data by tagging the hard-coded strings in the source code and associated localization resource files as one of translatable and non-translatable. The method then trains a parts-of-speech (POS) tagging model using the training data. At runtime, the method fetches potential hard-coded strings and tags each hard-coded string as one of translatable and non-translatable using the POS tagging model. A corresponding system and computer program product are also disclosed.
    Type: Application
    Filed: August 27, 2022
    Publication date: February 29, 2024
    Applicant: International Business Machines Corporation
    Inventors: Jin Shi, Chih-Yuan Lin, Shu-Chih Chen, Pei-Yi Lin, Chao Yuan Huang
  • Publication number: 20240070416
    Abstract: A reading method and a reading device for a two-dimensional code. The method includes: capturing a two-dimensional code image through an image capturing device; detecting an outer frame and a position mark of a two-dimensional code in a skewed state in the two-dimensional code image; restoring the two-dimensional code in the skewed state to a default state; and performing a default operation according to the two-dimensional code in the default state.
    Type: Application
    Filed: November 15, 2022
    Publication date: February 29, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chin-Hao Yeh, Chin-Wen Lin, Hung-Yi Lin
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Patent number: 11917795
    Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: February 27, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Yuan-Yi Lin, Fu-Kuei Chang
  • Patent number: 11908910
    Abstract: Methods and devices that provide a first fin structure, a second fin structure, and a third fin structure disposed over a substrate. A dielectric fin is formed between the first fin structure and the second fin structure, and a conductive line is formed between the second fin structure and the third fin structure.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Chuan Yang, Jing-Yi Lin, Hsin-Wen Su, Shih-Hao Lin
  • Publication number: 20240052097
    Abstract: Methods for synthesizing a hydrogel having tunable hydrolylic degradation kinetics according to certain embodiments include synthesizing a norborene-functionalized polyethylene glycol macromer having an ester linkage between a polyethylene glycol domain of the macromer and a norbornene domain of the macromer and having a carboxyl group on the norbornene; and reacting a quantity of such macromers with a quantity of dithiol molecules by an ultraviolet-initiated photo-gelation reaction to yield a hydrogel. Such macromers and such hydrogels form additional aspects of the disclosure, as do a wide variety of methods for tuning and for using such hydrogels.
    Type: Application
    Filed: February 4, 2022
    Publication date: February 15, 2024
    Inventors: Chien-Chi Lin, Fang-Yi Lin
  • Publication number: 20240055805
    Abstract: An electrical connector includes an insulation body, a terminal assembly mounted in the insulation body, and two shielding pieces. The terminal assembly includes a plurality of grounding terminals, a plurality of signal terminals and two locating blocks. The plurality of the grounding terminals and the plurality of the signal terminals are mounted in the two locating blocks. The two locating blocks together with the plurality of the grounding terminals and the signal terminals are arranged in two rows. The two shielding pieces are disposed at an upper surface and a lower surface of a front end of the insulation body. Each shielding piece has a fixing piece. Two sides of a rear edge of the fixing piece extend rearward to form two first shielding portions. The first shielding portions of the two shielding pieces shield the signal terminals of two sides of the terminal assembly.
    Type: Application
    Filed: February 1, 2023
    Publication date: February 15, 2024
    Inventors: PEI-YI LIN, CHUAN-HUNG LIN, SHENG-NAN YU