Abstract: A flexible circuit board designed for chip integration is provided. The flexible circuit board includes an insulating substrate, a conductive copper layer, a first tin layer, a second tin layer, and a first solder resist layer. The first tin layer has a first tin thickness, and the second tin layer has a greater second tin thickness. A first tin surface of the first tin layer and a second tin surface of the second tin layer are substantially level.

Abstract: An inner lead structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer. A chip mounting area defined on the flexible substrate is provided for a chip, contacting locations defined within the chip mounting area are provided for conductive elements of the chip. The circuit layer includes inner leads, ends of the inner leads are arranged on the contacting locations and provided to be electrically connected to the conductive elements. At least one of first dummy lines of the dummy circuit layer is arranged in a space between the adjacent inner leads. The space having a distance greater than 50 um is divided into multiple spaces having distances not greater than 50 um. Proportion of the spaces without the first dummy lines and having a distance greater than 50 um is less than 0.5% in all spaces.

Abstract: A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the first inner leads is less than a second distance between the second inner leads. One of dummy leads of the dummy circuit layer is located between the first and second inner leads, another dummy lead is located between the second inner leads. The dummy leads are provided to allow lead spaces on both sides of the inverted U-shape connection line is the same. Thus, etching solution will not flow laterally in an etching space between the inverted U-shape connection line and the horizontal inner lead.

Abstract: Provided herein are methods and kits for detecting the presence of DNA and/or RNA mutations associated with cancer (e.g., lung cancer). The methods and kits employ microcarriers, each with a probe specific for a DNA or RNA mutation and an identifier unique to the probe sequence. Upon isolation and amplification of nucleic acids from a sample, hybridization of amplified DNA with a probe, specific for a DNA or RNA mutation, that is coupled to a microcarrier indicates the presence of the mutation in the sample. Since each microcarrier can be identified through detection of the identifier, multiplex screening assays are provided. Representative genes that can be screened for mutations include, e.g., KRAS, NRAS, PIK3CA, BRAF, EGFR, AKT1, MEK1, and HER2 for DNA mutations and/or ALK, ROS, RET, NTRK1, and cMET for RNA mutations.

Abstract: A flexible circuit board includes a flexible substrate, an electronic component and a heat spreader. The electronic component and the heat spreader are disposed on a top surface and a bottom surface of the flexible substrate, respectively. The heat spreader includes a copper layer which contains more than or equal to 50% copper grains by volume with (1,0,0) crystallographic orientation.

Abstract: The invention discloses a vehicular communication system and a routing method thereof. The routing method includes the following steps. When a first relay node of the relay nodes, which locates in a last road slot of each of the road section, receives the route reply packet, the first relay node is configured to obtain a plurality of moving traces of a plurality of specific relay nodes according to the route reply packet; estimate at least one connection life period related to a plurality of specific road slots according to the moving traces; estimate at least one connection available interval of the specific road section according to the at least one connection life period; and append the at least one connection available interval to the route reply packet and forward the route reply packet.

Abstract: The present disclosure also provides a photolithography mask. The photolithography mask includes a substrate that contains a low thermal expansion material (LTEM). A reflective structure is disposed over the substrate. A capping layer is disposed over the reflective structure. An absorber layer is disposed over the capping layer. The absorber layer contains an indium tin oxide (ITO) material. In some embodiments, the ITO material has a SnO6 crystalline structure.

Abstract: The present disclosure also provides a photolithography mask. The photolithography mask includes a substrate that contains a low thermal expansion material (LTEM). A reflective structure is disposed over the substrate. A capping layer is disposed over the reflective structure. An absorber layer is disposed over the capping layer. The absorber layer contains an indium tin oxide (ITO) material. In some embodiments, the ITO material has a SnO6 crystalline structure.

Abstract: The invention discloses a vehicular communication system and a routing method thereof. The routing method includes the following steps. When a first relay node of the relay nodes, which locates in a last road slot of each of the road section, receives the route reply packet, the first relay node is configured to obtain a plurality of moving traces of a plurality of specific relay nodes according to the route reply packet; estimate at least one connection life period related to a plurality of specific road slots according to the moving traces; estimate at least one connection available interval of the specific road section according to the at least one connection life period; and append the at least one connection available interval to the route reply packet and forward the route reply packet.