Abstract: A manufacturing method of group III-V semiconductor package is provided. The manufacturing method includes the following steps. A wafer comprising group III-V semiconductor dies therein is provided. A chip probing (CP) process is performed to the wafer to determine reliabilities of the group III-V semiconductor dies, wherein the CP process comprises performing a multi-step breakdown voltage testing process to the group III-V semiconductor dies to obtain a first portion of dies of the group III-V semiconductor dies with breakdown voltages to be smaller than a predetermined breakdown voltage. A singulation process is performed to separate the group III-V semiconductor dies from the wafer. A package process is performed to form group III-V semiconductor packages including the group III-V semiconductor dies. A final testing process is performed on the group III-V semiconductor packages.

Abstract: Ruthenium of a metal gate (MG) and/or a middle end of line (MEOL) structure is annealed to reduce, or even eliminate, seams after the ruthenium is deposited. Because the annealing reduces (or removes) seams in deposited ruthenium, electrical performance is increased because resistivity of the MG and/or the MEOL structure is decreased. Additionally, for MGs, the annealing generates a more even deposition profile, which results in a timed etching process producing a uniform gate height. As a result, more of the MGs will be functional after etching, which increases yield during production of the electronic device.

Abstract: A furniture assembly includes a first object, a second object, a self-closing device, an aiding member, an interlock mechanism and an actuating part. The second object is displaceable relative to the first object. The self-closing device is arranged on the first object and includes a base, a working member and a resilient member. The working member and the aiding member are movable relative to the base. The interlock mechanism is arranged on the first object. The actuating part is arranged on the second object. When the second object is located at the extended position and the working member returns to an initial position from an engaging position in response to a self-closing resilient force provided by the resilient member, the aiding member is located at a predetermined position to retain at least one locking member of the interlock mechanism at a locking position.

Abstract: An electronic device includes a memory usage identification circuit and a system-level cache (SLC). The memory usage identification circuit obtains a memory usage indicator that depends on memory usage of a storage space allocated in a system memory at which memory access is requested by a physical address. The SLC includes a cache memory and a cache controller. The cache controller performs cache management upon the cache memory according to the physical address and the memory usage indicator.

Abstract: A display panel includes a circuit substrate, a first supporting structure, a glue layer residue and light-emitting diodes. The circuit substrate has electrodes. The first supporting structure is located outside the electrodes on the circuit substrate. The glue layer residue is located on the first supporting structure. The light-emitting diodes are electrically connected to the electrodes.

Abstract: A modified polyurethane carrier substrate is provided. The modified polyurethane carrier substrate is formed from a modified polyurethane. The modified polyurethane includes a soft segment and a hard segment. The soft segment is formed from a polyol. The hard segment is formed from diisocyanate and a chain extender. The chain extender is dianhydride. A common logarithm of a ratio of a storage modulus of the modified polyurethane carrier substrate at ?30° C. to a storage modulus of the modified polyurethane carrier substrate at 150° C. ranges from 0.40 to 1.30.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: Embodiments of the present disclosure provide a cryogenic pump for semiconductor processing, including a body having a flange, configured to be coupled to a process chamber, and an opening defined at a first end of the body; one or more capture plate modules disposed in the body; and a cold header thermally coupled to the one or more capture plate modules. A longitudinal axis of the body is defined from the first end of the body to a second end of the body. A first lateral dimension of the opening is less than a second lateral dimension of the body, the first and second lateral dimensions being defined perpendicular to the longitudinal axis. The second lateral dimension is defined at a position between the opening and the second end.

Abstract: The present disclosure discloses a low dropout regulator apparatus having noise-suppression mechanism. An operational amplifier circuit includes a differential input circuit, an amplifying output circuit and a first and a second resistive components. The differential input circuit is coupled between first connection nodes and a ground terminal to receive a reference voltage and a feedback voltage. The amplifying output circuit includes a first and a second transistor pair circuits. The first transistor pair circuit is coupled between a power supply and second connection nodes. The second transistor pair is coupled between the second connection nodes and the ground terminal and has an amplifying output terminal generating an amplified voltage. The first and the second resistive components are coupled between the first and the second connection nodes.

Abstract: An adjustment device of a slide rail mechanism includes a base, a driving member and an adjusting member. The adjusting member is arranged on the base. The adjusting member is configured to be adjusted for moving the driving member. The adjustment device can be used with a working member to form an interlock mechanism. The interlock mechanism only allows a rail of one of the slide rail assemblies of the slide rail mechanism to be opened.

Abstract: A semiconductor device includes a bonding structure having a top, a back opposite the top, a first side and a second side opposite the first side, wherein the first side and the second side between the top and the back; and columnar structures over the back of the bonding structure. The columnar structures include a first columnar structure nearest to the first side and a second columnar structure nearest to the second side. The semiconductor device further includes a first electrode disposed over at least portion of the columnar structures and electrically connected to at least one of the columnar structures, and a second electrode disposed over at least portion of the back of the bonding structure and electrically connected to at least one of the columnar structures.

Abstract: A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.

Abstract: The present invention provides a use of platelet dry powder (PDP) for relieving inflammation or injury in an airway portion, wherein per gram of platelet dry powder (PDP) comprises at least 100,000 platelets.

Abstract: A slide rail mechanism is configured to a cabinet. The cabinet includes a wall with a first side and a second side opposite to the first side. The slide rail mechanism includes a first slide rail assembly, a second slide rail assembly and a working member. When a second rail of the first slide rail assembly is opened with respect to a first rail, the second rail is able to drive the working member for preventing a fourth rail of the second slide rail assembly to be opened with respect to a third rail.

Abstract: A slide rail mechanism is configured to a cabinet. The slide rail mechanism includes a first rail assembly, a second rail assembly and a working member. The first and second assemblies are arranged on the cabinet. The working member is shiftable with respect to the cabinet. When a second rail of the first rail assembly is opened with respect to a first rail, the working member is moved in a transverse direction for preventing a fourth rail of the second rail assembly to be opened from a retracted position with respect to a third rail.

Abstract: A flatness sensing device includes a pressure sensing unit and a controller. The pressure sensing unit includes a plate portion, and a pressure sensor fixed and exposed at an edge of the plate portion. A sensing surface of the pressure sensor is flush with the bottom surface of the plate portion. The pressure sensor senses a pressure or lack of pressure of an object to be tested when it touches the object to be tested. The controller receives the pressure value output from the pressure sensor and determines a flatness of the object to be tested, the controller can issue an alarm on finding non-flatness and cause the degree of flatness to be displayed to a user.

Abstract: A flatness sensing device includes a pressure sensing unit and a controller. The pressure sensing unit includes a plate portion, and a pressure sensor fixed and exposed at an edge of the plate portion. A sensing surface of the pressure sensor is flush with the bottom surface of the plate portion. The pressure sensor senses a pressure or lack of pressure of an object to be tested when it touches the object to be tested. The controller receives the pressure value output from the pressure sensor and determines a flatness of the object to be tested, the controller can issue an alarm on finding non-flatness and cause the degree of flatness to be displayed to a user.

Abstract: A method of measuring hematocrit (HCT) and a measurement device using in the method and depends on an electrode test specimen to create a capacitor charging effect and consequential change in discharge current for measurement of hematocrit. The method of measuring hematocrit comprises steps as follows: (a) Instill blood into a pair of test electrodes which is installed in the present invention and apply a voltage to the pair of test electrodes; (b) Remove the voltage applied to the pair of test electrodes and measure a discharge current value; (c) Refer to a predetermined decision rule and the discharge current to obtain a hematocrit value for blood. As such, the present invention which relies on an electrode test specimen in measurement of hematocrit corresponding to a discharge current value during electric discharge contributes to precision and reliability in contrast to conventional hematocrit tests.

Abstract: Systems for activating glucometers are provided. The systems comprise a strip and a glucometer. Furthermore, the strip comprises at least two pins configured at different locations from the bottom edge of the strip. Once the strip is placed into the glucometer, the two pins electrically connect to at least two pads configured in the glucometer and lead to a short circuit between the two pads. The short circuit is identified as an activation signal to activate the glucometer. Accordingly, the pins provide a security mechanism to ensure that the glucometer is activated when electrical connections are properly accomplished.

Abstract: An electrode reaction area testing method of biosensor test strip includes: (1) preparing a semi-finished or finished test strip product having at least one sensing window corresponding to an electrode reaction area; a plural electrodes exposed from the electrode reaction area; (2) detecting the electrode reaction current of the electrode reaction area to obtain a first electrode reaction current and a third electrode reaction current; (3) calculating a current ratio of the first electrode reaction current to the third electrode reaction current; (4) determining the current ratio; (5) completing the detection of the electrode reaction area to determine whether the semi-finished or finished test strip product is good or defective, so as to test the accuracy of the separating plate attaching position or the insulating position and the applicability of the electrode reaction area in the manufacture of the test strip.