Patents by Inventor Yi-Lung Chiang

Yi-Lung Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation structures
    Publication number: 20080171194
    Abstract: A heat dissipation structure is provided. The heat dissipation structure comprises a carbon substrate and a metal layer which at least partially covers the sidewall of the carbon substrate. The metal layer covering the carbon substrate can not only increase the heat dissipation efficiency of the carbon substrate but can also eliminate the short circuiting of the elements when dust accumulates on them.
    Type: Application
    Filed: May 30, 2007
    Publication date: July 17, 2008
    Applicant: FENG CHIA UNIVERSITY
    Inventors: Tse-Hao Ko, Wen-Shyong Kuo, Hsin-Fang Lu, Su-Ching Yen, Yi-Lung Chiang
  • Carbon nanotube substrate structure
    Publication number: 20050212394
    Abstract: A carbon nanotube substrate structure including a substrate and a conductive layer disposed thereon. The carbon nanotube layer or the conductive layer has numerous support particles with a diameter smaller than the length of the carbon nanotube of the carbon nanotube layer. The carbon nanotubes, the conductive layer and the support particles are adhered to each other by means of a glue. The carbon nanotubes lean on the support particles, whereby the carbon nanotubes can stand and protrude from the surface of the carbon nanotube layer to serve as field emission sources.
    Type: Application
    Filed: March 29, 2005
    Publication date: September 29, 2005
    Inventors: Jing-Shie Lin, Yi-Lung Chiang, Chin-Tien Hsiao, Chia-Chih Chuang