Patents by Inventor Yi-Lung Fang

Yi-Lung Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and assembly thereof
    Patent number: 7208835
    Abstract: An integrated circuit (IC) package and IC assembly. The IC assembly comprises the IC package, an insulating substrate and an adhesive film. The IC package comprises a chip body and a plurality of bumps. The bumps are disposed on a first surface of the chip body, each bump having a patterned pressing surface. The insulating substrate comprises a plurality of electrode pads corresponding to the bumps. Each electrode pad has a second surface pressed on the pressing surface of each bump. The adhesive film is disposed between the IC package and the insulating substrate, for covering the bumps and the electrode pads.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: April 24, 2007
    Assignee: AU Optronics Corp.
    Inventors: Yu-Jen Tsou, Yi-Lung Fang
  • Integrated circuit package and assembly thereof
    Publication number: 20060108685
    Abstract: An integrated circuit (IC) package and IC assembly. The IC assembly comprises the IC package, an insulating substrate and an adhesive film. The IC package comprises a chip body and a plurality of bumps. The bumps are disposed on a first surface of the chip body, each bump having a patterned pressing surface. The insulating substrate comprises a plurality of electrode pads corresponding to the bumps. Each electrode pad has a second surface pressed on the pressing surface of each bump. The adhesive film is disposed between the IC package and the insulating substrate, for covering the bumps and the electrode pads.
    Type: Application
    Filed: March 7, 2005
    Publication date: May 25, 2006
    Inventors: Yu-Jen Tsou, Yi-Lung Fang