Abstract: A light-emitting housing is disclosed. The light-emitting housing includes a light-emitting module and a housing. The light-emitting module includes a light guide plate and at least one light-emitting unit. The light guide plate includes an upper surface, a lower surface, and a plurality of dot regions, the dot regions are located on the lower surface, and the at least one light-emitting unit provides a plurality of light beams incident to the light guide plate. The housing is disposed above the light-emitting module and located on the upper surface of the light guide plate, and the housing includes at least one transparent region. Some of the light beams emitted by the at least one light-emitting unit are reflected through the dot regions and penetrate the upper surface of the light guide plate and the at least one transparent region.

Abstract: A light-emitting housing is disclosed. The light-emitting housing includes a light-emitting module and a housing. The light-emitting module includes a light guide plate and at least one light-emitting unit. The light guide plate includes an upper surface, a lower surface, and a plurality of dot regions, the dot regions are located on the lower surface, and the at least one light-emitting unit provides a plurality of light beams incident to the light guide plate. The housing is disposed above the light-emitting module and located on the upper surface of the light guide plate, and the housing includes at least one transparent region. Some of the light beams emitted by the at least one light-emitting unit are reflected through the dot regions and penetrate the upper surface of the light guide plate and the at least one transparent region.

Abstract: A 3D printing method and apparatus using the same are provided. The printing method includes: generating a two-dimensional layer information related with multiple layer objects of a three-dimensional object according to a three-dimensional model information, whereas the three-dimensional object has a forming part and an object embedded part; analyzing the two-dimensional layer information to identify a forming region and an object embedded region within each of the layer objects, whereas the forming regions constitute the forming part and the object embedded regions constitute the object embedded part; selecting at least one section of the three-dimensional object as a separation plane; printing the layer objects, layer by layer, with a forming material and a supporting material, to coat the forming material onto the forming region without overlapping with the separation plane, and coat the supporting material onto the forming region overlapping with the separation plane and the object embedded region.

Abstract: A 3D printing method and apparatus using the same are provided. The printing method includes: generating a two-dimensional layer information related with multiple layer objects of a three-dimensional object according to a three-dimensional model information, whereas the three-dimensional object has a forming part and an object embedded part; analyzing the two-dimensional layer information to identify a forming region and an object embedded region within each of the layer objects, whereas the forming regions constitute the forming part and the object embedded regions constitute the object embedded part; selecting at least one section of the three-dimensional object as a separation plane; printing the layer objects, layer by layer, with a forming material and a supporting material, to coat the forming material onto the forming region without overlapping with the separation plane, and coat the supporting material onto the forming region overlapping with the separation plane and the object embedded region.

Abstract: A monitoring system includes at least one light sensor, at least one fastener and at least one controller. The light sensor is configured to detect light emitted by an operation lamp. The fastener wraps around the operation lamp, and it includes a light-shielding body. The light-shielding body has an accommodation groove and an inner surface. The inner surface is adjacent to the operation lamp. The accommodation groove is concavely formed at the inner surface. The light sensor is accommodated in the accommodation groove. The controller is electrically connected with the light sensor for determining a status of the machine according to the light detected by the light sensor.

Abstract: A monitoring system includes at least one light sensor, at least one fastener and at least one controller. The light sensor is configured to detect light emitted by an operation lamp. The fastener wraps around the operation lamp, and it includes a light-shielding body. The light-shielding body has an accommodation groove and an inner surface. The inner surface is adjacent to the operation lamp. The accommodation groove is concavely formed at the inner surface. The light sensor is accommodated in the accommodation groove. The controller is electrically connected with the light sensor for determining a status of the machine according to the light detected by the light sensor.

Abstract: Provided is an active non-contact probe card including a carrier, a support base, a piezoelectric material layer, an active sensor array chip and a control circuit. The support base is disposed on the carrier. The piezoelectric material layer is connected with the support base. The position of the active sensor array chip with respect to the carrier is determined according to the thicknesses of the support base and the thicknesses of the piezoelectric material layer. A control circuit provides a control voltage to the piezoelectric material layer to control the thickness of the piezoelectric material layer, so as to adjust the position of the active sensor array chip with respect to the carrier.

Abstract: Provided is an active non-contact probe card including a carrier, a support base, a piezoelectric material layer, an active sensor array chip and a control circuit. The support base is disposed on the carrier. The piezoelectric material layer is connected with the support base. The position of the active sensor array chip with respect to the carrier is determined according to the thicknesses of the support base and the thicknesses of the piezoelectric material layer. A control circuit provides a control voltage to the piezoelectric material layer to control the thickness of the piezoelectric material layer, so as to adjust the position of the active sensor array chip with respect to the carrier.

Abstract: A light-guiding element cooperates with a light source and includes a light-guiding frame and a scattering material. The light-guiding frame has a light incident surface, a light output surface, and an inclined surface. Light emitted by the light source enters into the light-guiding frame through the light incident surface, and the light is reflected by the inclined surface to be outputted through the light output surface. The scattering material is disposed at the inclined surface. A light-emitting module having the light-guiding element and an electronic device are also disclosed.

Abstract: A test system for testing a device under test (DUT) and a test method thereof. At first, an expected test pattern having a test input signal and an expected output signal is output. Next, the expected test pattern is compressed, and an expected compressed pattern having an expected compressed output signal corresponding to the expected output signal is output and saved. Then, the expected compressed pattern is decompressed, and the test input signal is applied to the DUT for testing the DUT. Next, a real output signal output from the DUT is received and compressed, and then a real compressed output signal is output and saved. At last, the real compressed output signal and the expected compressed output signal are compared to determine the test result.