Patents by Inventor Yi-Min Chin
Yi-Min Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10838144Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.Type: GrantFiled: February 26, 2019Date of Patent: November 17, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Min Chin, Yung-Shun Chang, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung
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Patent number: 10591688Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).Type: GrantFiled: March 11, 2019Date of Patent: March 17, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Ju Lu, Tai-Hsuan Tu, Yi-Min Chin, Wei Lun Wang, Jia-Hao Zhang
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Publication number: 20190204514Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).Type: ApplicationFiled: March 11, 2019Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Tai-Hsuan TU, Yi-Min CHIN, Wei Lun WANG, Jia-Hao ZHANG
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Publication number: 20190187371Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.Type: ApplicationFiled: February 26, 2019Publication date: June 20, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi-Min CHIN, Yung-Shun CHANG, Mei-Ju LU, Jia-Hao ZHANG, Wen-Chi HUNG
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Patent number: 10268002Abstract: A waveguide includes a first layer and a second layer. The first layer comprises a material of a first refractive index. The second layer is surrounded by the first layer and comprises a material of a second refractive index greater than the first refractive index. The second layer comprises a main body, a first fork and a second fork. The main body has a first substantially constant thickness. The first fork is extended from the main body and has a first tapering end exposed by the first layer. The first fork has the first substantially constant thickness. The second fork is extended from the main body and has a second tapering end exposed by the first layer. The second fork has the first substantially constant thickness.Type: GrantFiled: June 6, 2017Date of Patent: April 23, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Ju Lu, Tai-Hsuan Tu, Yi-Min Chin, Wei Lun Wang, Jia-Hao Zhang
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Patent number: 10241264Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.Type: GrantFiled: July 1, 2016Date of Patent: March 26, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Min Chin, Yung-Shun Chang, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung
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Publication number: 20180348454Abstract: A waveguide includes a first layer and a second layer. The first layer comprises a material of a first refractive index. The second layer is surrounded by the first layer and comprises a material of a second refractive index greater than the first refractive index. The second layer comprises a main body, a first fork and a second fork. The main body has a first substantially constant thickness. The first fork is extended from the main body and has a first tapering end exposed by the first layer. The first fork has the first substantially constant thickness. The second fork is extended from the main body and has a second tapering end exposed by the first layer. The second fork has the first substantially constant thickness.Type: ApplicationFiled: June 6, 2017Publication date: December 6, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Tai-Hsuan TU, Yi-Min CHIN, Wei Lun WANG, Jia-Hao ZHANG
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Patent number: 10025033Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.Type: GrantFiled: March 1, 2016Date of Patent: July 17, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei Lun Wang, Yi-Min Chin, Mei-Ju Lu, Jia-Hao Zhang
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Publication number: 20180003894Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Inventors: Yi-Min CHIN, Yung-Shun Chang, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung
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Patent number: 9857532Abstract: A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.Type: GrantFiled: January 13, 2017Date of Patent: January 2, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Min Chin, Jia-Hao Zhang, Chi-Han Chen, Mei-Ju Lu
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Publication number: 20170336561Abstract: A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.Type: ApplicationFiled: January 13, 2017Publication date: November 23, 2017Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi-Min Chin, Jia-Hao Zhang, Chi-Han Chen, Mei-Ju Lu
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Publication number: 20170254956Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.Type: ApplicationFiled: March 1, 2016Publication date: September 7, 2017Inventors: Wei Lun WANG, Yi-Min CHIN, Mei-Ju LU, Jia-Hao ZHANG
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Patent number: D753223Type: GrantFiled: October 29, 2014Date of Patent: April 5, 2016Assignee: UC-LOGIC TECHNOLOGY CORP.Inventor: Yi-Min Chin