Patents by Inventor Yi-Min Fang

Yi-Min Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure
    Patent number: 7551455
    Abstract: A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: June 23, 2009
    Assignee: Cyntec Co., Ltd.
    Inventors: Da-Jung Chen, Yi-Cheng Lin, Bau-Ru Lu, Yi-Min Fang, Chau-Chun Wen, Chun-Tiao Liu
  • Package structure
    Publication number: 20070257377
    Abstract: A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.
    Type: Application
    Filed: July 7, 2006
    Publication date: November 8, 2007
    Inventors: Da-Jung Chen, Yi-Cheng Lin, Bau-Ru Lu, Yi-Min Fang, Chau-Chun Wen, Chun-Tiao Liu