Patents by Inventor Yi-Min Hsieh

Yi-Min Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 10438736
    Abstract: A magnetic component and a manufacturing method thereof are provided. The magnetic component includes a magnetic core, a first winding set and a second winding set. The magnetic core is made of a magnetic powder material and includes two connecting portions connected through three magnetic columns to form a first side and a second side opposite to each other. The first winding set and the second winding set are made by a flat conductive body, and spaced apart on the middle magnetic column at a distance. The first winding set includes two first conducting portions connected through a first horizontal portion. The second winding set includes two second conducting portions connected through a second horizontal portion. The first horizontal portion and the second horizontal portion are exposed to the first side, and the two first conducting portions and the two second conducting portions are extended to the second side.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: October 8, 2019
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Jinping Zhou, Zhangnan Xin, Pengkai Ji, Yi-Min Hsieh
  • Publication number: 20190172629
    Abstract: A magnetic component and a manufacturing method thereof are provided. The magnetic component includes a magnetic core, a first winding set and a second winding set. The magnetic core is made of a magnetic powder material and includes two connecting portions connected through three magnetic columns to form a first side and a second side opposite to each other. The first winding set and the second winding set are made by a flat conductive body, and spaced apart on the middle magnetic column at a distance. The first winding set includes two first conducting portions connected through a first horizontal portion. The second winding set includes two second conducting portions connected through a second horizontal portion. The first horizontal portion and the second horizontal portion are exposed to the first side, and the two first conducting portions and the two second conducting portions are extended to the second side.
    Type: Application
    Filed: January 28, 2019
    Publication date: June 6, 2019
    Inventors: Jinping Zhou, Zhangnan Xin, Pengkai Ji, Yi-Min Hsieh