Patents by Inventor Yi-Ming Chiang

Yi-Ming Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955554
    Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. The plurality of the second type of epitaxial layers is oxidized in the source/drain region. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed in the opening.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
  • Patent number: 11942543
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20230242866
    Abstract: The present disclosure relates to transgenic fungal cells and methods of making the same such that the transgenic fungal cells include one or more exogenous biosynthetic gene clusters integrated into the host genome. The genes of the exogenous biosynthetic gene cluster may be operably linked to a transgenic region of an endogenous biosynthetic gene cluster that includes a native promoter to control expression of the exogenous genes.
    Type: Application
    Filed: December 13, 2022
    Publication date: August 3, 2023
    Inventors: Clay C. WANG, Yi-Ming CHIANG
  • Patent number: 10118945
    Abstract: Modified fungal strains having deleted gene clusters are provided. The modified fungal strains include A. nidulans. The deleted gene clusters are selected from the group of gene clusters responsible for the biosynthesis of sterigmatocystin, emericellamides, asperfuranone, monodictyphenone, terrequinone, F9775A, F9775B, asperthecin, and both portions of the split cluster that makes austinol and dehydroaustinol. Methods for making compounds by culturing the fungus in a growth media and separating the compound from the fungus and/or separating the compound from the growth media are included, as are the compounds and compositions comprising them.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: November 6, 2018
    Assignees: University of Kansas, University of Southern California
    Inventors: Berl Oakley, Manmeet Ahuja, Ruth Entwistle, Christine Oakley, Yi-Ming Chiang, Clay Wang
  • Publication number: 20170121719
    Abstract: Modified fungal strains having deleted gene clusters are provided. The modified fungal strains include A. nidulans. The deleted gene clusters are selected from the group of gene clusters responsible for the biosynthesis of sterigmatocystin, emericellamides, asperfuranone, monodictyphenone, terrequinone, F9775A, F9775B, asperthecin, and both portions of the split cluster that makes austinol and dehydroaustinol. Methods for making compounds by culturing the fungus in a growth media and separating the compound from the fungus and/or separating the compound from the growth media are included, as are the compounds and compositions comprising them.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 4, 2017
    Inventors: Berl Oakley, Manmeet Ahuja, Ruth Entwistle, Christine Oakley, Yi-Ming Chiang, Clay Wang
  • Patent number: 8048860
    Abstract: A method of treating a Th1-mediated disorder includes administering to a subject in need of the treatment an effective amount of a compound of the formula I: wherein R1 is H, alkyl, aryl, or cyclyl; R2 is pyranose; R3 is H or alkyl; m is 2, 3, 4, 5, or 6; n is 0, 1, 2, or 3; o is 0, 1, 2, 3, 4; p is 1, 2, 3, or 4; and the Th1-mediated disorder is non-obese diabetes, Crohn's colitis, autoimmune hemolytic anemia, rheumatoid arthritis, autoimmune encephalitis, multiple sclerosis, or autoimmune myocarditis. Also disclosed is a pharmaceutical composition including a compound of formula I above and a pharmaceutically acceptable carrier.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: November 1, 2011
    Assignee: Academia Sinica
    Inventors: Wen-Chin Yang, Shu-Lin Chang, Lee-Tian Chang, Yi-Ming Chiang, Lie-Fen Shyur
  • Patent number: 7999004
    Abstract: The present invention provides compounds having estrogenic activity selected from the group consisting of RRR-?-tocopherol, hydro-Q9 chromene, coenzyme Q9, cycloartane, 1-Feruloyl glycerol, ?-tocopherol-9, and analogues thereof. The compounds of the present invention activate ER? and ER?, and express high estrogenic activity.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: August 16, 2011
    Assignee: National Taiwan University
    Inventors: Ching-jing Huang, Wei-Yi Cheng, Yueh-Hsiung Kuo, Yi-Ming Chiang
  • Patent number: 7691575
    Abstract: Methods useful, for example, in identifying plant compositions that have immunomodulatory activity. Also disclosed is an Asteraceae plant immunomodulatory composition useful for increasing an immune response, e.g., IFN ? or IL-2 transcription.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: April 6, 2010
    Assignee: Academia Sinica
    Inventors: Wen-Chin Yang, Shu-Lin Chang, Yi-Ming Chiang, Lie-Fen Shyur
  • Publication number: 20090062216
    Abstract: A method of treating a Th1-mediated disorder includes administering to a subject in need of the treatment an effective amount of a compound of the formula I: wherein R1 is H, alkyl, aryl, or cyclyl; R2 is pyranose; R3 is H or alkyl; m is 2, 3, 4, 5, or 6; n is 0, 1, 2, or 3; o is 0, 1, 2, 3, 4; p is 1, 2, 3, or 4; and the Th1-mediated disorder is non-obese diabetes, Crohn's colitis, autoimmune hemolytic anemia, rheumatoid arthritis, autoimmune encephalitis, multiple sclerosis, or autoimmune myocarditis. Also disclosed is a pharmaceutical composition including a compound of formula I above and a pharmaceutically acceptable carrier.
    Type: Application
    Filed: November 3, 2008
    Publication date: March 5, 2009
    Applicant: Academia Sinica
    Inventors: Wen-Chin Yang, Shu-Lin Chang, Lee-Tian Chang, Yi-Ming Chiang, Lie-Fen Shyur
  • Publication number: 20080193432
    Abstract: The present invention provides compounds having estrogenic activity selected from the group consisting of RRR-?-tocopherol, hydro-Q9 chromene, coenzyme Q9, cycloartane, 1-Feruloyl glycerol, ?-tocopherol-9, and analogues thereof. The compounds of the present invention activate ER? and ER?, and express high estrogenic activity.
    Type: Application
    Filed: February 9, 2007
    Publication date: August 14, 2008
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Ching-jang Huang, Wei-Yi Cheng, Yueh-Hsiung Kuo, Yi-Ming Chiang
  • Publication number: 20070053998
    Abstract: A compound of the formula: wherein R1 is H, alkyl, aryl, or cyclyl; R2 is pyranose; R3 is H or alkyl; m is 2, 3, 4, 5, or 6; n is 0, 1, 2, or 3; o is 0, 1, 2, 3, 4; and p is 1, 2, 3, or 4. Also disclosed is use of the compound to inhibit Th1 differentiation, promote Th2 differentiation, and treat certain disorders.
    Type: Application
    Filed: September 2, 2005
    Publication date: March 8, 2007
    Inventors: Wen-Chin Yang, Shu-Lin Chang, Lee-Tian Chang, Yi-Ming Chiang, Lie-Fen Shyur
  • Publication number: 20070048394
    Abstract: Methods useful, for example, in identifying plant compositions that have immunomodulatory activity. Also disclosed is an Asteraceae plant immunomodulatory composition useful for increasing an immune response, e.g., IFN ? or IL-2 transcription.
    Type: Application
    Filed: August 29, 2005
    Publication date: March 1, 2007
    Inventors: Wen-Chin Yang, Shu-Lin Chang, Yi-Ming Chiang, Lie-Fen Shyur