Patents by Inventor Yi-Ming CHOU

Yi-Ming CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955397
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
  • Patent number: 11926266
    Abstract: An installing module includes a seat bracket, a plurality of lower gaskets, a device bracket and an upper gasket. The seat bracket includes a first locking plate and a second locking plate locked to each other. The first locking plate includes a first concave and the second locking plate includes a second concave corresponding to the first concave. The lower gaskets are respectively disposed on the first concave and the second concave. The lower gaskets face each other and jointly define a lower assembly hole and are disposed on a lower side of a head-support fixer of a car seat. The device bracket is locked to the seat bracket and an electronic device is pivotally coupled to the device bracket. The upper gasket is disposed between the device bracket and the head-support fixer, and the head-support fixer is clamped between the upper gasket and the lower gaskets.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: March 12, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Shih-Wei Yeh, Chien-Chih Lin, Yi-Ming Chou, Chun-Chieh Chang
  • Patent number: 11921930
    Abstract: An input device for an information handling system ay detect an adjustment to a position of a damping medium of a linear magnetic ram of the input device. The input device may generate haptic feedback based on the detected adjustment to the position of the damping medium of the linear magnetic ram of the input device.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: March 5, 2024
    Assignee: Dell Products L.P.
    Inventors: Yi-Ming Chou, Chiu-Jung Tsen, Hsu-Feng Lee, Gerald Rene Pelissier
  • Publication number: 20230150438
    Abstract: An installing module includes a seat bracket, a plurality of lower gaskets, a device bracket and an upper gasket. The seat bracket includes a first locking plate and a second locking plate locked to each other. The first locking plate includes a first concave and the second locking plate includes a second concave corresponding to the first concave. The lower gaskets are respectively disposed on the first concave and the second concave. The lower gaskets face each other and jointly define a lower assembly hole and are disposed on a lower side of a head-support fixer of a car seat. The device bracket is locked to the seat bracket and an electronic device is pivotally coupled to the device bracket. The upper gasket is disposed between the device bracket and the head-support fixer, and the head-support fixer is clamped between the upper gasket and the lower gaskets.
    Type: Application
    Filed: August 26, 2022
    Publication date: May 18, 2023
    Applicant: PEGATRON CORPORATION
    Inventors: Shih-Wei Yeh, Chien-Chih Lin, Yi-Ming Chou, Chun-Chieh Chang
  • Publication number: 20220386504
    Abstract: An electronic device includes a housing, a heat conductive portion, a circuit board, a fin set, and a fan. The housing has an accommodating space. The heat conductive portion is disposed in the accommodating space, and divides the accommodating space into a first space and a second space. The circuit board is disposed in the first space and includes a heat source. The heat source generates heat and is thermally coupled to the heat conductive portion. The fin set is disposed in the second space and thermally coupled to the heat conductive portion. The fan is disposed in the second space and located on one side of the fin set. The fan is adapted to guide an airflow through the fin set to discharge the heat generated by the heat source from the housing.
    Type: Application
    Filed: March 28, 2022
    Publication date: December 1, 2022
    Applicant: PEGATRON CORPORATION
    Inventors: Yaw-Song Chen, Yi-Ming Chou
  • Patent number: 10906474
    Abstract: An installing bracket is configured to be assembled to head support rods of a vehicle seat for installing an electronic device. The installing bracket includes a first locking plate and a second locking plate. The first locking plate includes a first locking portion and a first joint portion having first concaves disposed on a first side of the first joint portion. The second locking plate includes a second locking portion and a second joint portion having second concaves disposed on a second side of the second joint portion. The first locking portion is stacked on the second locking portion and locked to each other. The electronic device is locked to the first locking portion and the second locking portion. The first concaves joint with the respective second concaves to define a plurality of assembly holes for the head support rods to penetrate through.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: February 2, 2021
    Assignee: PEGATRON CORPORATION
    Inventors: Yi-Ming Chou, Yaw-Song Chen, Shih-Wei Yeh
  • Publication number: 20190291656
    Abstract: An installing bracket is configured to be assembled to head support rods of a vehicle seat for installing an electronic device. The installing bracket includes a first locking plate and a second locking plate. The first locking plate includes a first locking portion and a first joint portion having first concaves disposed on a first side of the first joint portion. The second locking plate includes a second locking portion and a second joint portion having second concaves disposed on a second side of the second joint portion. The first locking portion is stacked on the second locking portion and locked to each other. The electronic device is locked to the first locking portion and the second locking portion. The first concaves joint with the respective second concaves to define a plurality of assembly holes for the head support rods to penetrate through.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 26, 2019
    Applicant: PEGATRON CORPORATION
    Inventors: Yi-Ming Chou, Yaw-Song Chen, Shih-Wei Yeh
  • Publication number: 20160203353
    Abstract: An electronic device is provided. The electronic device includes a substrate, a first refractive layer, a second refractive layer and an electronic component. The first and the second refractive layers are stacked on the substrate, wherein the first refractive layer is disposed on the second refractive layer. The first refractive layer has a refractive index n11 at a wavelength of visible light and a refractive index n12 at a wavelength of UV light, and the second refractive layer has a refractive index n21 at the wavelength of visible light and a refractive index n22 at the wavelength of UV light. The electronic component includes a semiconductor layer disposed on the first refractive layer. The refractive indexes n11, n12, n21, and n22 satisfy the following equation: |n22?n21|>|n12?n11|.
    Type: Application
    Filed: December 15, 2015
    Publication date: July 14, 2016
    Applicant: Innolux Corporation
    Inventors: I-Che LEE, Chen-Chia HSU, Yi-Ming CHOU, Yu-Tsung LIU, Te-Yu LEE