Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first dielectric layer over the substrate. The semiconductor device structure also includes a first metal gate stack and a second metal gate stack over the substrate and the first dielectric layer. The semiconductor device structure further includes a second dielectric layer beside the first metal gate stack and an insulating structure over the substrate. A portion of the insulating structure is between the first metal gate stack and the second metal gate stack. The insulating structure penetrates into the second dielectric layer.

Abstract: A temperature adjustment apparatus for a high temperature oven, comprising: an oven comprising an oven cavity, at least one intake manifold, at least one exhaust manifold, an inner casing cover, at least one heating element, and a chamber door; wherein a processing chamber is formed inside the oven cavity; the inner casing cover is disposed around an inner wall of the oven cavity; the inner casing cover is heated by at least one of the heating elements, and the processing chamber is heated by the inner casing cover in the form of thermal radiation; and a gas reprocessing device comprising a gas recovery device, wherein a gas in the processing chamber is sucked into the gas reprocessing device by using the gas recovery device, and the sucked gas can be directly discharged from the gas reprocessing device or reprocessed and flows back to the processing chamber.

Abstract: A temperature adjustment apparatus for a high temperature oven, comprising: an oven comprising an oven cavity, at least one intake manifold, at least one exhaust manifold, an inner casing cover, at least one heating element, and a chamber door; wherein a processing chamber is formed inside the oven cavity; the inner casing cover is disposed around an inner wall of the oven cavity; the inner casing cover is heated by at least one of the heating elements, and the processing chamber is heated by the inner casing cover in the form of thermal radiation; and a gas reprocessing device comprising a gas recovery device, wherein a gas in the processing chamber is sucked into the gas reprocessing device by using the gas recovery device, and the sucked gas can be directly discharged from the gas reprocessing device or reprocessed and flows back to the processing chamber.

Abstract: A temperature adjustment apparatus for a high temperature oven, comprising: an oven comprising an oven cavity, at least one intake manifold, at least one exhaust manifold, an inner casing cover, at least one heating element, and a chamber door; wherein a processing chamber is formed inside the oven cavity; the inner casing cover is disposed around an inner wall of the oven cavity; the inner casing cover is heated by at least one of the heating elements, and the processing chamber is heated by the inner casing cover in the form of thermal radiation; and a gas reprocessing device comprising a gas recovery device, wherein a gas in the processing chamber is sucked into the gas reprocessing device by using the gas recovery device, and the sucked gas can be directly discharged from the gas reprocessing device or reprocessed and flows back to the processing chamber.

Abstract: A high-pressure burn-in test apparatus comprises a burn-in furnace including a high-pressure burn-in furnace cavity equipped with a driving motor, at least one intake manifold, at least one extension manifold equipped with a nozzle, a communicating tube connected to the intake manifold, and a fan. A processing chamber having a test board is formed inside the high-pressure burn-in furnace cavity. The periphery of at least one of the intake manifold is connected to the at least one extension manifold. At least one component to be tested is placed on the test board. High-pressure gas is ejected through the nozzle to disturb the gas around the component to be tested. The fan is installed in the processing chamber. The driving motor drives the fan to rotate, so that the gas in the processing chamber generates convection, to improve the uniformity of gas temperature distribution.

Abstract: A high-pressure burn-in test apparatus comprises a burn-in furnace including a high-pressure burn-in furnace cavity equipped with a driving motor, at least one intake manifold, at least one extension manifold equipped with a nozzle, a communicating tube connected to the intake manifold, and a fan. A processing chamber having a test board is formed inside the high-pressure burn-in furnace cavity. The periphery of at least one of the intake manifold is connected to the at least one extension manifold. At least one component to be tested is placed on the test board. High-pressure gas is ejected through the nozzle to disturb the gas around the component to be tested. The fan is installed in the processing chamber. The driving motor drives the fan to rotate, so that the gas in the processing chamber generates convection, to improve the uniformity of gas temperature distribution.

Abstract: A temperature adjustment apparatus for a high temperature oven, comprising: an oven comprising an oven cavity, at least one intake manifold, at least one exhaust manifold, an inner casing cover, at least one heating element, and a chamber door; wherein a processing chamber is formed inside the oven cavity; the inner casing cover is disposed around an inner wall of the oven cavity; the inner casing cover is heated by at least one of the heating elements, and the processing chamber is heated by the inner casing cover in the form of thermal radiation; and a gas reprocessing device comprising a gas recovery device, wherein a gas in the processing chamber is sucked into the gas reprocessing device by using the gas recovery device, and the sucked gas can be directly discharged from the gas reprocessing device or reprocessed and flows back to the processing chamber.