Patents by Inventor Yi Ming Lau
Yi Ming Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11828789Abstract: The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.Type: GrantFiled: April 14, 2022Date of Patent: November 28, 2023Assignee: STAR TECHNOLOGIES, INC.Inventors: Choon Leong Lou, Yi Ming Lau
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Publication number: 20230123340Abstract: The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.Type: ApplicationFiled: April 14, 2022Publication date: April 20, 2023Inventors: CHOON LEONG LOU, YI MING LAU
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Patent number: 11307246Abstract: A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.Type: GrantFiled: September 24, 2019Date of Patent: April 19, 2022Assignee: Star Technologies, Inc.Inventors: Choon Leong Lou, Yi Ming Lau
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Patent number: 11054465Abstract: A method of operating a probing apparatus is disclosed. The method includes providing a chuck configured to support a DUT, a probe card disposed above the DUT and having a probe, and an inspection module configured to determine positions of the DUT and the probe. The method further includes determining a first position of a DUT by an inspection module; moving a probe card to align a first position of a probe with the first position of the DUT; moving a chuck toward the probe; adjusting a temperature of the probe to a predetermined temperature by a temperature-controlling device; determining a second position of the probe by the inspection module after the adjustment of the temperature of the probe; moving the probe card to align the probe with the position of the DUT based on the determination of the second position of the probe; and probing the DUT.Type: GrantFiled: October 21, 2019Date of Patent: July 6, 2021Assignee: STAR TECHNOLOGIES, INC.Inventors: Choon Leong Lou, Yi Ming Lau
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Publication number: 20210116496Abstract: A method of operating a probing apparatus is disclosed. The method includes providing a chuck configured to support a DUT, a probe card disposed above the DUT and having a probe, and an inspection module configured to determine positions of the DUT and the probe. The method further includes determining a first position of a DUT by an inspection module; moving a probe card to align a first position of a probe with the first position of the DUT; moving a chuck toward the probe; adjusting a temperature of the probe to a predetermined temperature by a temperature-controlling device; determining a second position of the probe by the inspection module after the adjustment of the temperature of the probe; moving the probe card to align the probe with the position of the DUT based on the determination of the second position of the probe; and probing the DUT.Type: ApplicationFiled: October 21, 2019Publication date: April 22, 2021Applicant: STAR TECHNOLOGIES, INC.Inventors: CHOON LEONG LOU, YI MING LAU
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Publication number: 20210088581Abstract: A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.Type: ApplicationFiled: September 24, 2019Publication date: March 25, 2021Inventors: CHOON LEONG LOU, YI MING LAU
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Patent number: 10890614Abstract: The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.Type: GrantFiled: April 15, 2019Date of Patent: January 12, 2021Assignee: STAR TECHNOLOGIES, INC.Inventors: Choon Leong Lou, Yi Ming Lau
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Publication number: 20200326366Abstract: The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.Type: ApplicationFiled: April 15, 2019Publication date: October 15, 2020Inventors: CHOON LEONG LOU, YI MING LAU
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Patent number: 8389926Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.Type: GrantFiled: August 16, 2010Date of Patent: March 5, 2013Assignee: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Publication number: 20110063608Abstract: A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device.Type: ApplicationFiled: August 16, 2010Publication date: March 17, 2011Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Publication number: 20110062317Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.Type: ApplicationFiled: August 16, 2010Publication date: March 17, 2011Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Patent number: 7675307Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.Type: GrantFiled: March 18, 2008Date of Patent: March 9, 2010Assignee: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Publication number: 20090237102Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.Type: ApplicationFiled: March 18, 2008Publication date: September 24, 2009Applicant: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen