Patents by Inventor Yi-Ming Liang

Yi-Ming Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230135498
    Abstract: Embodiments of the present disclosure relate to a semiconductor package, a method of forming the package and an electronic device. For example, the semiconductor package may comprise a first substrate assembly comprising a first surface and a second surface opposite the first surface. The semiconductor package may also comprise one or more chips connected or coupled to the first surface of the first substrate assembly by a first thermally and electrically conductive connecting material. In addition, the semiconductor package further comprises a second substrate assembly comprising a third surface and a fourth surface opposite the third surface, the third surface and the first surface being arranged to face each other, and the third surface being connected to one or more chips by a second thermally and electrically conductive connecting material. At least one of the first surface and the third surface is shaped to have a stepped pattern to match a surface of the one or more chips.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 4, 2023
    Applicants: STMICROELECTRONICS S.r.l., SHENZHEN STS MICROELECTRONICS CO., LTD.
    Inventors: Yi Ming LIANG, Roberto TIZIANI, Qian LIU, Feng DING
  • Patent number: 8424422
    Abstract: An adjustable socket structure contains a body including a first groove, a second groove, a first notch, a number of slots; a plurality of paws, each including a sliding block, and the sliding block including a first hole; a number of connecting rods, each being movably fixed in the second groove and including a first axial shank and a second axial shank; a driving shaft including an axial portion and a disk portion, wherein the axial portion includes a square bore, and the disk portion is rotated in the first groove and includes an outer diameter larger that the axial portion and three second holes so that the driving shaft is rotated to actuate the paws to move in the slots respectively by using the connecting rods; a helical retaining ring retained in the first notch to abut against a rear end of the disk portion of the driving shaft.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: April 23, 2013
    Inventor: Yi-Ming Liang
  • Publication number: 20120304834
    Abstract: An adjustable socket structure contains a body including a first groove, a second groove, a first notch, a number of slots; a plurality of paws, each including a sliding block, and the sliding block including a first hole; a number of connecting rods, each being movably fixed in the second groove and including a first axial shank and a second axial shank; a driving shaft including an axial portion and a disk portion, wherein the axial portion includes a square bore, and the disk portion is rotated in the first groove and includes an outer diameter larger that the axial portion and three second holes so that the driving shaft is rotated to actuate the paws to move in the slots respectively by using the connecting rods; a helical retaining ring retained in the first notch to abut against a rear end of the disk portion of the driving shaft.
    Type: Application
    Filed: June 1, 2011
    Publication date: December 6, 2012
    Inventor: Yi-Ming Liang