Abstract: An optical module includes a micro spectrometer. The micro spectrometer includes an optical crystal, a lens, and a photosensitive assembly. The optical crystal is configured to receive detection light and covert the detection light into interference light. The optical crystal is surrounded by a sleeve, the sleeve configured to fix a position of the optical crystal. The lens is configured for receiving the interference light and focusing the interference light. The photosensitive assembly is configured for imaging the interference light into an interference image. The optical module further comprises a controller. The controller is electrically connected to the photosensitive assembly, and the controller is used to convert the interference image into light wavelength signals and light intensity signals.

Abstract: An optical module includes a micro spectrometer. The micro spectrometer includes an optical crystal, a lens, and a photosensitive assembly. The optical crystal is configured to receive detection light and covert the detection light into interference light. The optical crystal is surrounded by a sleeve, the sleeve configured to fix a position of the optical crystal. The lens is configured for receiving the interference light and focusing the interference light. The photosensitive assembly is configured for imaging the interference light into an interference image. The optical module further comprises a controller. The controller is electrically connected to the photosensitive assembly, and the controller is used to convert the interference image into light wavelength signals and light intensity signals.

Abstract: A camera module includes a circuit board, two photosensitive chips fixed on a surface of the circuit board, two lens assemblies respectively mounted over the two photosensitive chips, two filter assemblies each including a visible light filter and an infrared filter, and an infrared projection unit fixed on a surface of the circuit board and projecting patterned infrared light. The filter assemblies respectively correspond to the photosensitive chips and the lens assemblies. The visible light filter and the infrared filter of the filter assemblies are switched to be between the lens assembly and the photosensitive chip. When the visible light filters are between the lenses and the photosensitive chips, the photosensitive chips acquire visible light to form a colored 3D image. When the infrared filters are between the lenses and the photosensitive chips, the photosensitive chips acquire reflected patterned infrared light to form an infrared 3D image.

Abstract: A portable electronic apparatus includes a main body, a camera device, and a supplementary light device. The camera device and the supplementary light device are fixed on the main body. The supplementary light device includes a light module, a lens module, and a motor. The light module includes a circuit board, a light source, and a heat sink opposite to the light source. The lens module includes a lens barrel and a plurality of lenses received in the lens module. The motor drives the lens module to change the intensity distribution of the light from the light module.

Abstract: A shutter for a micro camera module includes a substrate made from silicon wafer and a light absorbing layer covering the surface.

Abstract: A lens includes a central optical portion, a peripheral portion surrounding the central optical portion, a first ZnS coating formed on the central optical portion and the peripheral portion at one side of the lens, and a first MgF2 coating formed the central optical, the peripheral portion being free of MgF2 coating formed thereon. The optical thickness of the first ZnS coating is one quarter of a wavelength of predetermined light passing therethrough. The optical thickness of the first MgF2 coating is one quarter of the wavelength of the predetermined light.

Abstract: A shutter for a micro camera module includes a substrate made from silicon wafer and a light absorbing layer covering the surface.

Abstract: In one embodiment, a MEMS includes a MEMS chip package, a first printed circuit board (PCB), an anisotropic conductive layer, a second PCB and at least one electrical wire. The MEMS chip package includes an exposed connecting portion, and at least one metallic pad formed on the exposed connecting portion. The first PCB is laminated on the connecting portion. The first PCB includes at least one first connecting metallic pad and at least one second connecting metallic pad. The first connecting metallic pad is electrically connected to a corresponding second connecting metallic pad. The anisotropic conductive layer is sandwiched between the metallic pads of the MEMS chip package and the first connecting metallic pads of the first PCB. The metallic pad of the MEMS chip package is electrically connected to the respective first connecting metallic pad of the PCB via the anisotropic conductive layer.

Abstract: A lens includes a central optical portion, and a peripheral supporting portion surrounding the central optical portion. The peripheral supporting portion has a first surface and an opposite second surface. At least one of the first surface and second surface having a light absorbing polymer layer adhered thereon.

Abstract: A portable electronic apparatus includes a main body, a camera device, and a supplementary light device. The camera device and the supplementary light device are fixed on the main body. The supplementary light device includes a light module, a lens module, and a motor. The light module includes a circuit board, a light source, and a heat sink opposite to the light source. The lens module includes a lens barrel and a plurality of lenses received in the lens module. The motor drives the lens module to change the intensity distribution of the light from the light module.

Abstract: A lens includes a central optical portion, a peripheral portion surrounding the central optical portion, a first ZnS coating formed on the central optical portion and the peripheral portion at one side of the lens, and a first MgF2 coating formed the central optical, the peripheral portion being free of MgF2 coating formed thereon. The optical thickness of the first ZnS coating is one quarter of a wavelength of predetermined light passing therethrough. The optical thickness of the first MgF2 coating is one quarter of the wavelength of the predetermined light.

Abstract: A micro-electromechanical system (MEMS) includes a micro-electromechanical chip, a printed circuit board and a metal wire. The metal wire electrically connects the micro-electromechanical chip and the printed circuit board. A connection distance and a connection angle are defined between the micro-electromechanical chip and the printed circuit board.

Abstract: A package structure and method for making devices of system-in-a-package (SiP). Substrates with integrated and assembled elements can be aligned and pre-bonded together, and fluidic encapsulating materials is applied to seal the rest opening of pre-bonded interface of substrates. Three dimensional and protruding microstructures, elements, and MFMS devices can be accommodated and protected inside a spatial space formed by the bonded substrates. By applying the technologies of flip-chip, chip-scale-packaging, and wafer-level-packaging in conjunction with present invention, then plural elements and devices can be packaged together and become a system device in wafer-level-system-in-a-package (WLSiP) format.