Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.

Abstract: A method for bandwidth allocation is to be implemented by a base station (BS) that communicates with a plurality of reconfigurable intelligent surfaces (RISs). The method comprising steps of: receiving a plurality of join messages respectively from a plurality of user equipments (UEs) via the RISs, the join messages being transmitted simultaneously by the UEs in a contention area according to a map message; and according to the join messages, grouping the UEs into at least one group by allocating a frequency band within the contention area to each of the at least one group, wherein those of the UEs in the same group share the same frequency band.

Abstract: A display device includes a display module, a cover plate, and a light shielding film. The display module includes a display panel. The display panel has a black matrix pattern that surrounds a display area. The cover plate is configured on the display module. The light shielding film is adhered to at least one of the display module and the cover plate and located between the display module and the cover plate. The light shielding film is substantially located outside the display area, and an inter-medium is configured between the light shielding film and the cover plate and between the display module and the cover plate.

Abstract: A display device includes a display module, a cover plate, and a light shielding film. The display module includes a display panel. The display panel has a black matrix pattern that surrounds a display area. The cover plate is configured on the display module. The light shielding film is adhered to at least one of the display module and the cover plate and located between the display module and the cover plate. The light shielding film is substantially located outside the display area, and an inter-medium is configured between the light shielding film and the cover plate and between the display module and the cover plate.