Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.

Abstract: The present application discloses an image capturing system and a method for adjusting focus. The image capturing system includes an image-sensing module, a plurality of processors, a display panel, and an audio acquisition module. A first processor is configured to detect objects in a preview image sensed by the image-sensing module and attach identification labels to the objects detected. The display panel shows the preview image along with the identification labels. The audio acquisition module converts an analog signal of a user's voice into digital voice data. One of the processors is configured to parse the digital voice data into user intent data. A second processor is configured to select a target from the detected objects in the preview image according to the user intent data and the identification labels of the detected objects, and control the image-sensing module to perform a focusing operation with respect to the target.

Abstract: The present application discloses an image capturing system and a method for adjusting focus. The image capturing system includes a first image-sensing module, a plurality of processors, a display panel, and a second image-sensing module. A first processor detects objects in the preview image sensed by the first image-sensing module and attach labels to the detected objects. The display panel displays the preview image with the labels of the objects detected. The second image-sensing module acquires user’s gaze data. A second processor selects a target in the preview image according to a gazed region on the display panel that the user is looking at, and controls the first image-sensing module to focus on the target. The first processor, the second processor, and/or a third processor detect the gazed region according to the user’s gaze data.

Abstract: A vacuum system for semiconductor fabrication. The system includes a vacuum chamber for performing a semiconductor fabrication process, a vacuum source, and a piping system fluidly connecting the vacuum chamber to the vacuum source. In one embodiment, the piping system is configured without a horizontal flow path section of piping. In some embodiments, the piping system includes a first piping branch and a second piping branch. The first and second piping branches preferably have a symmetrical configuration with respect to the vacuum source. In yet other embodiments, the first and second piping branches preferably each include a throttle valve.

Abstract: A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by an electrostatic chuck that is to hold the wafer. The at least two different voltages are applied to hold the respective portions of the wafer while performing a fabrication process on the wafer.

Abstract: A vacuum system for semiconductor fabrication. The system includes a vacuum chamber for performing a semiconductor fabrication process, a vacuum source, and a piping system fluidly connecting the vacuum chamber to the vacuum source. In one embodiment, the piping system is configured without a horizontal flow path section of piping. In some embodiments, the piping system includes a first piping branch and a second piping branch. The first and second piping branches preferably have a symmetrical configuration with respect to the vacuum source. In yet other embodiments, the first and second piping branches preferably each include a throttle valve.

Abstract: A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by an electrostatic chuck that is to hold the wafer. The at least two different voltages are applied to hold the respective portions of the wafer while performing a fabrication process on the wafer.

Abstract: A method for cleaning the noise in an image obtains an image having an interested pixel and a predetermined number of neighboring pixels for each of red, green and blue, then calculates an adjusted value for the interested pixel based on the existing value of the interested pixel and the values of the predetermined number of neighboring pixels. This calculation is carried out for each of red, green and blue using the same predetermined number of neighboring pixels.