Patents by Inventor Yi-Pin Lin

Yi-Pin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12144113
    Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: November 12, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Chi-Min Chang, Ming-Hao Wu, Yi-Pin Lin, Tung-Chang Lin, Jun-Rui Huang
  • Publication number: 20240371980
    Abstract: A method for making a semiconductor device includes: forming a first gate stack over a first fin; forming a first gate spacer extending along a side of the first gate stack; forming a second gate spacer over the first gate spacer; forming a third gate spacer over the second gate spacer, the third gate spacer; forming a source/drain region adjacent the third gate spacer; depositing an interlayer dielectric (ILD) over the source/drain region, the ILD including a third dielectric material; and removing at least a portion of the second gate spacer to form a void, while exposing a top surface of the ILD. The void includes a vertical portion extending between the first gate spacer and the source/drain region, and between the first gate spacer and the ILD. The void includes a horizontal portion extending beneath the source/drain region.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsu Ming Hsiao, Ming-Jhe Sie, Hsiu-Hao Tsao, Hong Pin Lin, Che-fu Chen, An Chyi Wei, Yi-Jen Chen
  • Patent number: 12121920
    Abstract: A microstructured passage module for aerosolizer is disclosed. The module includes a plate overlaid by a cover, an entrance, an exit, a plurality of protrusions and a plurality of pillars. The protrusions and pillars project from and are integral parts of the plate. Further, the plate can be divided into a first zone proximate to the entrance and a second zone proximate to the exit. The protrusions are arranged into parallel rows in a direction from the entrance to the exit and form parallel passages therebetween in the first zone for the liquid to flow along. The protrusions in each column are spaced from one another by tunnels. The pillars are interposingly disposed in the second zone and define certain channels therebetween. Moreover, a plurality of pillars further disposed in the passages increase a flow resistance for the liquid flowing through the passages.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: October 22, 2024
    Assignee: MICROBASE TECHNOLOGY CORP.
    Inventors: Shu-Pin Hsieh, Yi-Tong Chen, Yi-Ting Lin, Po-Chuan Chen
  • Patent number: 12115215
    Abstract: Provided is an immunogenic composition including a peptide, wherein consecutive amino acids of the peptide include at least amino acids of SEQ ID NO:1 and one or more adjuvants. Also provided is a method of vaccinating a subject against Borrelia burgdorferi, including administering to the subject an effective amount of the immunogenic composition.
    Type: Grant
    Filed: August 17, 2023
    Date of Patent: October 15, 2024
    Assignee: Health Research, Inc.
    Inventors: Yi-Pin Lin, Kaspars Tars
  • Patent number: 12090182
    Abstract: Disclosed herein is a method for preventing or alleviating particulate matter-induced lung injury. The method includes administering to a subject in need thereof a pharmaceutical composition including at least one heat-killed lactic acid bacterial strain that is selected from the group consisting of Lactobacillus plantarum CB102 which is deposited at the Deutsche Sammlung von Mikroorganismen und Zellkulturen (DSMZ) GmbH under an accession number DSM 33894, Lactobacillus acidophilus JCM 1132, Bifidobacterium longum CB108 which is deposited at the DSMZ GmbH under an accession number DSM 33895, Bifidobacterium animalis subsp. lactis JCM 10602, and combinations thereof.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: September 17, 2024
    Assignee: CHAMBIO CO., LTD.
    Inventors: Meei-Yn Lin, Hung-Pin Chiu, Yi-Heng Chiu
  • Patent number: 12068398
    Abstract: A method, for making a semiconductor device, includes forming a first fin over a substrate. The method includes forming a dummy gate stack on the first fin. The method includes forming a first gate spacer along a side of the dummy gate stack. The first gate spacer includes a first dielectric material. The method includes forming a second gate spacer along a side of the first gate spacer. The second gate spacer includes a semiconductor material. The method includes forming a source/drain region in the first fin adjacent the second gate spacer. The method includes removing at least a portion of the second gate spacer to form a void extending between the first gate spacer and the source/drain region.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsu Ming Hsiao, Ming-Jhe Sie, Hsiu-Hao Tsao, Hong Pin Lin, Che-fu Chen, An Chyi Wei, Yi-Jen Chen
  • Publication number: 20240207382
    Abstract: Provided is an immunogenic composition including a peptide, wherein consecutive amino acids of the peptide include at least amino acids 186-193 of SEQ ID NO:1 and one or more adjuvants. In an example, the peptide is covalently linked to an amino acid sequence including SEQ ID NO:2.
    Type: Application
    Filed: August 17, 2023
    Publication date: June 27, 2024
    Applicants: Health Research, Inc., Latvian Biomedical Research and Study Center
    Inventors: Yi-Pin LIN, Kaspars TARS
  • Patent number: 11989005
    Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: May 21, 2024
    Assignee: MediaTek Inc.
    Inventors: Bo-Jr Huang, Jia-Wei Fang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu, Yi-Pin Lin, Wen-Wen Hsieh, Min-Shu Wang
  • Patent number: 11895772
    Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: February 6, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chi-Min Chang, Ching-Sheng Chen, Jun-Rui Huang, Wei-Yu Liao, Yi-Pin Lin
  • Patent number: 11792918
    Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
    Type: Grant
    Filed: November 21, 2021
    Date of Patent: October 17, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Wei Wang, Heng-Ming Nien, Ching-Sheng Chen, Yi-Pin Lin, Shih-Liang Cheng
  • Patent number: 11771750
    Abstract: Provided is an immunogenic composition including a peptide, wherein consecutive amino acids of the peptide include at least amino acids 186-193 of SEQ ID NO:1 and one or more adjuvants. In an example, the peptide is covalently linked to an amino acid sequence including SEQ ID NO:2. Also provided is a method of vaccinating a subject against Borrelia burgdorferi, including administering to the subject an effective amount of the immunogenic composition.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: October 3, 2023
    Assignees: HEALTH RESEARCH, INC., LATVIAN BIOMEDICAL RESEARCH AND STUDY CENTER
    Inventors: Yi-Pin Lin, Kaspars Tars
  • Publication number: 20230262890
    Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
    Type: Application
    Filed: September 7, 2022
    Publication date: August 17, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Chi-Min Chang, Ming-Hao Wu, Yi-Pin Lin, Tung-Chang Lin, Jun-Rui Huang
  • Publication number: 20230262893
    Abstract: A circuit board, including a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and multiple second conductive vias, is provided. The first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via. The second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path.
    Type: Application
    Filed: August 23, 2022
    Publication date: August 17, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Jun-Rui Huang, Ming-Hao Wu, Yi-Pin Lin, Tung-Chang Lin
  • Publication number: 20230114681
    Abstract: Systems, devices, apparatuses, components, methods, and techniques for media a simple user interface that can facilitate discovery of contextually relevant media content with minimal navigation are provided. For example, the disclosed user interface may present contextually relevant categories, sub-categories and media content items while concurrently playing a media content item predicted to likely be selected by the user.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 13, 2023
    Applicant: Spotify AB
    Inventors: Achal Varma, Arjun Shantanu Narayen, Katherine Yi-Pin Lin, Björn Håkan Lindberg, Jason Allen Russell
  • Publication number: 20220386460
    Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
    Type: Application
    Filed: July 15, 2021
    Publication date: December 1, 2022
    Inventors: Chi-Min CHANG, Ching-Sheng CHEN, Jun-Rui HUANG, Wei-Yu LIAO, Yi-Pin LIN
  • Publication number: 20220334558
    Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.
    Type: Application
    Filed: September 30, 2021
    Publication date: October 20, 2022
    Inventors: Bo-Jr Huang, Jia-Wei Fang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu, Yi-Pin Lin, Wen-Wen Hsieh, Min-Shu Wang
  • Publication number: 20220280627
    Abstract: Provided is an immunogenic composition including a peptide, wherein consecutive amino acids of the peptide include at least amino acids 186-193 of SEQ ID NO:1 and one or more adjuvants. In an example, the peptide is covalently linked to an amino acid sequence including SEQ ID NO:2.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 8, 2022
    Applicant: Health Research, Inc.
    Inventor: Yi-Pin LIN
  • Publication number: 20220240375
    Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
    Type: Application
    Filed: October 28, 2021
    Publication date: July 28, 2022
    Inventors: Ching-Sheng CHEN, Chi-Min CHANG, Yi-Pin LIN, Jun-Rui HUANG
  • Publication number: 20220240368
    Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
    Type: Application
    Filed: November 21, 2021
    Publication date: July 28, 2022
    Inventors: Pei-Wei WANG, Heng-Ming NIEN, Ching-Sheng CHEN, Yi-Pin LIN, Shih-Liang CHENG
  • Patent number: D1044812
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: October 1, 2024
    Assignee: Sunrex Technology Corp.
    Inventors: Shih-Pin Lin, Chun-Chieh Chen, Yi-Wen Tsai, Ling-Cheng Tseng, Ching-Yao Huang, Yu-Shuo Yang, Yu-Xiang Geng, Cheng-Yu Chuang, Chi-Shu Hsu