Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: The invention provides a method and associated processor for improving software execution of an electronic device. The method may comprise: by a processor of the electronic device, identifying whether a target program is classified, according to whether the target program relates to an user interface of the electronic device, as one of suppressible programs; and, based on whether at least one suppression condition is satisfied, performing at least one suppressing operation on one or more of the suppressible programs.

Abstract: An input method includes following steps: recording a single-stroke input, converting the recorded single-stroke input into a vector combination defined by one or more pre-defined vectors, and performing user input recognition according to the vector combination. The vector based recognition scheme using certain distinguishable vectors may offer a higher recognition rate and/or a lower misjudgment rate. Moreover, since one user input may be immediately recognized at the end of one single-stroke input, the response time can be reduced to enhance the user experience.