Patents by Inventor Yi-Ren Chen

Yi-Ren Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088148
    Abstract: A semiconductor device includes a substrate, a stack of semiconductor nanosheets, a dielectric wall, and a gate structure. The substrate includes a nanosheet mesa, and the stack of semiconductor nanosheets is disposed on the nanosheet mesa. The dielectric wall crosses through the nanosheet mesa and the stack of semiconductor nanosheets. The gate structure wraps the stack of semiconductor nanosheets and crosses over the dielectric wall, wherein a top of the dielectric wall has a recess.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Ren Chen, Chung-Ting Li, Shih-Hsun Chang
  • Patent number: 11930056
    Abstract: An embodiment for automatically controlling peripheral devices based on online meeting participant information. The embodiment may detect participants of an online meeting and generate a participant information table. The embodiment may generate a participant group table including one or more preliminary participant groups based on the participant information. The embodiment may generate and send audio through peripheral devices associated with at least one participant in each of the one or more preliminary participant groups to identify the participants in physically shared meeting spaces. The embodiment may update the participant group table to include confirmed participant groups based on the identified participants in the physically shared meeting spaces. The embodiment may determine a presenter for each of the confirmed participant groups and update the participant information.
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: March 12, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jing Ren, Jing Wen Chen, Zhao Yu Wang, Xizhuo Zhang, Yi Jie Ma
  • Patent number: 11894448
    Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first region and a second region; a first semiconductor mesa formed on the semiconductor substrate within the first region; a second semiconductor mesa formed on the semiconductor substrate within the second region; and a field effect transistor (FET) formed on the semiconductor substrate. The FET includes a first doped feature of a first conductivity type formed in a top portion of the first semiconductor mesa; a second doped feature of a second conductivity type formed in a bottom portion of the first semiconductor mesa, the second semiconductor mesa, and a portion of the semiconductor substrate between the first and second semiconductor mesas; a channel in a middle portion of the first semiconductor mesa and interposed between the source and drain; and a gate formed on sidewall of the first semiconductor mesa.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Harry-Hak-Lay Chuang, Yi-Ren Chen, Chi-Wen Liu, Chao-Hsiung Wang, Ming Zhu
  • Publication number: 20230157738
    Abstract: Systems, devices and methods are provided for implanting medical devices into patients. The systems, devices and methods are particularly useful for orthopedic implants, such as spinal implants that facilitate fusion of bone segments. A fixation assembly for an implant comprises a screw having a head and a shaft, and a washer having at least one outer surface with one or more frictional elements for engaging a surface of the implant. The shaft includes one or more projections that cooperate with the washer to prevent the washer from sliding back down the screw, while allowing for easy application of the washer to ensure optimal placement and desired contact with the screw head. The washer and/or the screw head may also include interlocking cams that create a wedge effect that inhibits the screw from backing out or loosening from a hole in bone or other tissue.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 25, 2023
    Inventors: Avery LANMAN, Sara M. LAYTON, Shawn H. CULBERTSON, Yi Ren CHEN
  • Publication number: 20220285224
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack over the substrate. The semiconductor device structure includes a spacer over a side of the gate stack. The semiconductor device structure includes a dielectric layer over the substrate. The dielectric layer has a first recess, the dielectric layer has an upper portion and a first lower portion, the upper portion is over the first recess, the first recess is between the first lower portion and the spacer, and the upper portion has a convex curved sidewall.
    Type: Application
    Filed: May 24, 2022
    Publication date: September 8, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Heng TSAI, Chun-Sheng LIANG, Pei-Lin WU, Yi-Ren CHEN, Shih-Hsun CHANG
  • Patent number: 11348841
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack over the substrate, wherein the gate stack has a first portion and a second portion under the first portion, and the first portion is wider than the second portion. The semiconductor device structure includes a first spacer and a second spacer over opposite sides of the gate stack. The first spacer has a first upper portion and a first lower portion, the second spacer has a second upper portion and a second lower portion. The first spacer has a first recess, the first upper portion is between the first recess and the gate stack, the first lower portion is under the first recess, and the first recess has a first inner wall facing away from the gate stack.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: May 31, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Heng Tsai, Chun-Sheng Liang, Pei-Lin Wu, Yi-Ren Chen, Shih-Hsun Chang
  • Patent number: 11320710
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 3, 2022
    Assignee: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Publication number: 20210384327
    Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first region and a second region; a first semiconductor mesa formed on the semiconductor substrate within the first region; a second semiconductor mesa formed on the semiconductor substrate within the second region; and a field effect transistor (FET) formed on the semiconductor substrate. The FET includes a first doped feature of a first conductivity type formed in a top portion of the first semiconductor mesa; a second doped feature of a second conductivity type formed in a bottom portion of the first semiconductor mesa, the second semiconductor mesa, and a portion of the semiconductor substrate between the first and second semiconductor mesas; a channel in a middle portion of the first semiconductor mesa and interposed between the source and drain; and a gate formed on sidewall of the first semiconductor mesa.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 9, 2021
    Inventors: Harry-Hak-Lay Chuang, Yi-Ren Chen, Chi-Wen Liu, Chao-Hsiung Wang, Ming Zhu
  • Patent number: 11194204
    Abstract: A pixel array substrate including a substrate, pixel structures, and transfer lines is provided. The pixel structures are disposed on the substrate. Each pixel structure includes a data line, a gate line, an active device, and a pixel electrode. The active device is electrically connected to the data line and the gate line. The pixel electrode is electrically connected to the active device. The pixel electrode defines alignment domains. The alignment domains have different alignment directions. The transfer lines are arranged in a first direction. Gate lines of the pixel structures are arranged in a second direction. The first direction and the second direction are interlaced. The transfer lines are electrically connected to the gate lines. The pixel structures include a first pixel structure. The transfer lines include a first transfer line. The first transfer line overlaps a boundary between the alignment domains of the first pixel structure.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: December 7, 2021
    Assignee: Au Optronics Corporation
    Inventors: Hung-Che Lin, Min-Tse Lee, Yi-Ren Chen, Yueh-Hung Chung, Sheng-Ju Ho, Yan-Kai Wang, Ya-Ling Hsu, Chien-Huang Liao, Chen-Hsien Liao
  • Patent number: 11194205
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: December 7, 2021
    Assignee: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Patent number: 11126050
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: September 21, 2021
    Assignee: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Patent number: 11126051
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: September 21, 2021
    Assignee: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Patent number: 11101371
    Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first region and a second region; a first semiconductor mesa formed on the semiconductor substrate within the first region; a second semiconductor mesa formed on the semiconductor substrate within the second region; and a field effect transistor (FET) formed on the semiconductor substrate. The FET includes a first doped feature of a first conductivity type formed in a top portion of the first semiconductor mesa; a second doped feature of a second conductivity type formed in a bottom portion of the first semiconductor mesa, the second semiconductor mesa, and a portion of the semiconductor substrate between the first and second semiconductor mesas; a channel in a middle portion of the first semiconductor mesa and interposed between the source and drain; and a gate formed on sidewall of the first semiconductor mesa.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: August 24, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Harry-Hak-Lay Chuang, Yi-Ren Chen, Chi-Wen Liu, Chao-Hsiung Wang, Ming Zhu
  • Publication number: 20210210628
    Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.
    Type: Application
    Filed: March 22, 2021
    Publication date: July 8, 2021
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang
  • Patent number: 10991824
    Abstract: A semiconductor device includes: a fin-shaped structure on the substrate; a shallow trench isolation (STI) around the fin-shaped structure; a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure; a second gate structure on the STI; and a third gate structure on the SDB structure, wherein a width of the third gate structure is greater than a width of the second gate structure.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: April 27, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang
  • Publication number: 20210116764
    Abstract: A pixel array substrate including a substrate, pixel structures, and transfer lines is provided. The pixel structures are disposed on the substrate. Each pixel structure includes a data line, a gate line, an active device, and a pixel electrode. The active device is electrically connected to the data line and the gate line. The pixel electrode is electrically connected to the active device. The pixel electrode defines alignment domains. The alignment domains have different alignment directions. The transfer lines are arranged in a first direction. Gate lines of the pixel structures are arranged in a second direction. The first direction and the second direction are interlaced. The transfer lines are electrically connected to the gate lines. The pixel structures include a first pixel structure. The transfer lines include a first transfer line. The first transfer line overlaps a boundary between the alignment domains of the first pixel structure.
    Type: Application
    Filed: April 9, 2020
    Publication date: April 22, 2021
    Applicant: Au Optronics Corporation
    Inventors: Hung-Che Lin, Min-Tse Lee, Yi-Ren Chen, Yueh-Hung Chung, Sheng-Ju Ho, Yan-Kai Wang, Ya-Ling Hsu, Chien-Huang Liao, Chen-Hsien Liao
  • Publication number: 20210041755
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Publication number: 20210041756
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Publication number: 20210041754
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao
  • Publication number: 20210041753
    Abstract: A pixel array substrate including a substrate, data lines, gate lines, pixels, and transfer lines is provided. The data lines are disposed on the substrate and arranged in a first direction. The gate lines are disposed on the substrate and arranged in a second direction interlaced with the first direction. The pixels are disposed on the substrate, each of which includes an active device electrically connected to one of the data lines and one of the gate lines and a pixel electrode electrically connected to the active device. The transfer lines are arranged in the first direction and electrically connected to the gate lines, respectively. The pixels include first pixels. In a top view of the pixel array substrate, at least one of the pixel electrodes of the first pixels is partially overlapped with one of the transfer lines. A driving method of a pixel array substrate is also provided.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: Au Optronics Corporation
    Inventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Kuang-Hsiang Liao, Yang-Chun Lee, Yan-Kai Wang, Ya-Ling Hsu, Yi-Ren Chen, Hung-Che Lin, Sheng-Ju Ho, Chien-Huang Liao, Chen-Hsien Liao