Abstract: A motion synchronized multi-tier pallet rack and a battery formation apparatus are provided. The pallet rack includes a fixation rack, two movable frames, and two actuators. The movable frames are coupled to two corresponding sides of the fixation rack and each includes telescopic arms, a motor, and a drive rod. The actuators are disposed on other the two corresponding sides of the fixation rack to drive the movable frames to move toward or away from each other. The telescopic arms are kinematically connected to the motor through the drive rod to extend from or retract into the movable frame. The battery formation apparatus includes a motion synchronized multi-tier pallet rack, a conveyor module, a formation cabinet, and a controller. The conveyor module carries a battery module. The controller controls the pallet rack to obtain the battery module from the conveyor module and place the battery module in the formation cabinet.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

Abstract: A battery module includes a casing, and a battery assembly, a frequency converting assembly, and a heat dissipation assembly received in the casing. The heat dissipation assembly includes a heat-conducting unit and a heat-dissipating unit. The heat-dissipating unit includes a first dissipation member independent from the battery assembly and the frequency converting assembly. The battery assembly and the frequency converting assembly are coupled to the first dissipation member via the heat-conducting unit to cause heat generated by the battery assembly and the frequency converting assembly to be conducted to the first dissipation member.

Abstract: An on-chip oscillating method which is able to calibrate a frequency of an on-chip oscillator includes: utilizing the on-chip oscillator to generate a predetermined frequency output; receiving an external data input from an off-chip data source; generating a comparison result by comparing the predetermined frequency output with the external data input; and calibrating the predetermined frequency output by utilizing the comparison result. An on-chip oscillating apparatus which is able to calibrate its frequency includes: the on-chip oscillator, arranged to generate a predetermined frequency output; a receiving unit, arranged for receiving an external data input from an off-chip data source; and a comparison unit, arranged for generating a comparison result for calibrating the predetermined frequency output by comparing a predetermined frequency output with an external data input from an off-chip data source.

Abstract: A self-aligned fabrication process for a nozzle plate of an inkjet print head. A substrate is provided with an activated device and a first film is formed on the substrate. Then, a second film is formed on the first film. Next, the second film is defined to form a convex portion corresponding to the activated device, exposing a part of the surface of the first film. Next, a third film is formed on the exposed surface of the first film, covering the convex portion. The third film on the convex portion is then removed. Next, the convex portion and the first film under the convex portion are etched to form a via.

Abstract: A self-aligned fabrication process for a nozzle plate of an inkjet print head. A substrate is provided with an activated device and a first film is formed on the substrate. Then, a second film is formed on the first film. Next, the second film is defined to form a convex portion corresponding to the activated device, exposing a part of the surface of the first film. Next, a third film is formed on the exposed surface of the first film, covering the convex portion. The third film on the convex portion is then removed. Next, the convex portion and the first film under the convex portion are etched to form a via.