Patents by Inventor Yi RUAN
Yi RUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230369500Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: July 27, 2023Publication date: November 16, 2023Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Patent number: 11777035Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: June 27, 2022Date of Patent: October 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Publication number: 20220328690Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: June 27, 2022Publication date: October 13, 2022Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Patent number: 11374127Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: July 27, 2020Date of Patent: June 28, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Patent number: 11368011Abstract: An intermediate relay maloperation preventing device and method based on an improved recursive wavelet algorithm is provided. The device includes a power supply module, a voltage sampling circuit, an analog-to-digital conversion module, a DSP chip, and a relay maloperation signal shielding module. The voltage sampling circuit is connected to the analog-to-digital conversion module. The analog-to-digital conversion module is connected to the DSP chip. The DSP chip is connected to and controls a relay signal control module. The voltage sampling circuit collects a voltage. An improved recursive wavelet is used to extract a voltage feature. As such, identification of a fault signal and a normal signal is achieved, and real-time fault monitoring is accomplished. The detection method may be easily implemented, exhibits good filtering performance and anti-interference capability, delivers high detection accuracy, and may accomplish real-time online monitoring of intermediate relay faults.Type: GrantFiled: July 31, 2020Date of Patent: June 21, 2022Assignee: WUHAN UNIVERSITYInventors: Yigang He, Jianbo Zhou, Hui Zhang, Liulu He, Weibo Yuan, Yi Ruan, Bing Li
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Patent number: 11328952Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: November 16, 2020Date of Patent: May 10, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan
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Publication number: 20210074581Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan
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Publication number: 20210036503Abstract: An intermediate relay maloperation preventing device and method based on an improved recursive wavelet algorithm is provided. The device includes a power supply module, a voltage sampling circuit, an analog-to-digital conversion module, a DSP chip, and a relay maloperation signal shielding module. The voltage sampling circuit is connected to the analog-to-digital conversion module. The analog-to-digital conversion module is connected to the DSP chip. The DSP chip is connected to and controls a relay signal control module. The voltage sampling circuit collects a voltage. An improved recursive wavelet is used to extract a voltage feature. As such, identification of a fault signal and a normal signal is achieved, and real-time fault monitoring is accomplished. The detection method may be easily implemented, exhibits good filtering performance and anti-interference capability, delivers high detection accuracy, and may accomplish real-time online monitoring of intermediate relay faults.Type: ApplicationFiled: July 31, 2020Publication date: February 4, 2021Applicant: WUHAN UNIVERSITYInventors: Yigang HE, Jianbo ZHOU, Hui ZHANG, Liulu HE, Weibo YUAN, Yi RUAN, Bing LI
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Patent number: 10840134Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: April 22, 2019Date of Patent: November 17, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-yi Ruan
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Publication number: 20200357922Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: July 27, 2020Publication date: November 12, 2020Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Patent number: 10727350Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: July 27, 2018Date of Patent: July 28, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Patent number: 10666715Abstract: A system, method and program product for managing incidents in a complex IT environment. A system is described that includes: a discovery module that analyzes an IT infrastructure and generates a topology of components and users; a monitoring module that compares ongoing activities of the IT infrastructure with a pattern repository to identify potential problems; a relationship manager that generates relationship maps of components and users based on the topology, determines whether an identified potential problem comprises an incident, and in response to detecting an incident: correlates the incident with a root cause, and determines a responsible admin and set of impacted users based on the relationship maps; and an operation engine that notifies the responsible admin and set of impacted users of the incident.Type: GrantFiled: May 8, 2017Date of Patent: May 26, 2020Assignee: International Business Machines CorporationInventors: Xiao Ling Chen, Xue Feng Gao, Fei Li, Ren Yi Ruan, Qing Feng Zhang
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Publication number: 20190252246Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: April 22, 2019Publication date: August 15, 2019Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan
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Patent number: 10269627Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: August 25, 2017Date of Patent: April 23, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan
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Patent number: 10199500Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: August 2, 2016Date of Patent: February 5, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Publication number: 20180350993Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: July 27, 2018Publication date: December 6, 2018Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Publication number: 20180324062Abstract: A system, method and program product for managing incidents in a complex IT environment. A system is described that includes: a discovery module that analyzes an IT infrastructure and generates a topology of components and users; a monitoring module that compares ongoing activities of the IT infrastructure with a pattern repository to identify potential problems; a relationship manager that generates relationship maps of components and users based on the topology, determines whether an identified potential problem comprises an incident, and in response to detecting an incident: correlates the incident with a root cause, and determines a responsible admin and set of impacted users based on the relationship maps; and an operation engine that notifies the responsible admin and set of impacted users of the incident.Type: ApplicationFiled: May 8, 2017Publication date: November 8, 2018Inventors: Xiao Ling Chen, Xue Feng Gao, Fei Li, Ren Yi Ruan, Qing Feng Zhang
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Publication number: 20180040732Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: August 2, 2016Publication date: February 8, 2018Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Publication number: 20170372948Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: August 25, 2017Publication date: December 28, 2017Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan
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Publication number: 20170256445Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: March 2, 2016Publication date: September 7, 2017Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan