Patents by Inventor Yi-Sen LIN

Yi-Sen LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Side-view light emitting diode package structure
    Patent number: 10510931
    Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: December 17, 2019
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
    Inventors: Hou-Te Lin, Yi-Sen Lin, Chin-Fu Cheng, Wen-Liang Tseng, Pin-Chuan Chen
  • SIDE-VIEW LIGHT EMITTING DIODE PACKAGE STRUCTURE
    Publication number: 20190319173
    Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.
    Type: Application
    Filed: May 7, 2018
    Publication date: October 17, 2019
    Inventors: Hou-Te LIN, Yi-Sen LIN, Chin-Fu CHENG, Wen-Liang TSENG, Pin-Chuan CHEN