Patents by Inventor Yi-Shao Lin

Yi-Shao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240383095
    Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.
    Type: Application
    Filed: July 26, 2024
    Publication date: November 21, 2024
    Inventors: Shih-Chung CHEN, Yi-Shao LIN, Sheng-Tai PENG, Ya-Jen SHEUH, Hung-Lin CHEN, Ren-Dou LEE
  • Patent number: 12138735
    Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: November 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Chung Chen, Yi-Shao Lin, Sheng-Tai Peng, Ya-Jen Sheuh, Hung-Lin Chen, Ren-Dou Lee
  • Publication number: 20200164482
    Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.
    Type: Application
    Filed: September 3, 2019
    Publication date: May 28, 2020
    Inventors: Shih-Chung Chen, Yi-Shao Lin, Sheng-Tai Peng, Ya-Jen Sheuh, Hung-Lin Chen, Ren-Dou Lee