Patents by Inventor Yi-Shen CHIEN

Yi-Shen CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10927842
    Abstract: A cooling fan module includes a fan frame, a light emitting part installed in the fan frame, an LED controller installed in the fan frame and electrically connected to the light emitting part, a fan body, and an external connector. The fan body includes a supporting stand detachably connected to the fan frame, a blade set installed on the supporting stand and can rotate with respect to the supporting stand, and a fan connector fixed to the supporting stand and electrically connected to the blade set. The external connector is fixed to the fan frame. The external connector can be electrically plugged in the fan connector to send a first signal; the external connector is electrically connected to the LED controller to send a second signal. Therefore, the cooling fan module has the advantages of easy assembly and reduced incorrect connection.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: February 23, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventors: Chun-Hung Lin, Yi-Shen Chien
  • Publication number: 20200032807
    Abstract: A cooling fan module includes a fan frame, a light emitting part installed in the fan frame, an LED controller installed in the fan frame and electrically connected to the light emitting part, a fan body, and an external connector. The fan body includes a supporting stand detachably connected to the fan frame, a blade set installed on the supporting stand and can rotate with respect to the supporting stand, and a fan connector fixed to the supporting stand and electrically connected to the blade set. The external connector is fixed to the fan frame. The external connector can be electrically plugged in the fan connector to send a first signal; the external connector is electrically connected to the LED controller to send a second signal. Therefore, the cooling fan module has the advantages of easy assembly and reduced incorrect connection.
    Type: Application
    Filed: July 25, 2018
    Publication date: January 30, 2020
    Inventors: Chun-Hung LIN, Yi-Shen CHIEN
  • Publication number: 20080308257
    Abstract: A heat dissipating assembly for dissipating heat of a heat source is provided. The heat dissipating assembly includes a body, at least one circulation pipe, and a working fluid. The body has a chamber defined therein and least one pipeline formed in a wall of the body. The body further has at least one first orifice in communication with the chamber of the body, and at least one second orifice in communication with the pipeline. The circulation pipe has two end portions respectively connected to the first orifice and the second orifice. The working fluid is accommodated in the chamber of the body, wherein the working fluid flows into the circulation pipe through the first orifice, and flows into the pipeline through the second orifice to flow back to the chamber of the body, thereby forming a two phase circulation loop.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 18, 2008
    Applicant: Cooler Master Co., Ltd.
    Inventors: Ji-Ping Peng, Yi-Shen Chien
  • Publication number: 20080024990
    Abstract: A water block heat-dissipating structure includes a first cover body, a second cover body, and a hollow seat body. The first cover body has a first board body and a plurality of first heat-dissipating fins formed on the first board body. The second cover body has a second board body, a plurality of second heat-dissipating fins formed on the second board body, and at least one water inlet and at least one water outlet respectively penetrated through the second board body, wherein the first heat-dissipating fins and the second heat-dissipating fins are alternate each other. The hollow seat body is sealed and disposed between the first board body and the second board body for completely sealing the first heat-dissipating fins and the second heat-dissipating fins.
    Type: Application
    Filed: July 31, 2006
    Publication date: January 31, 2008
    Inventors: Yu-Huang Peng, Yi-Shen Chien
  • Publication number: 20070163270
    Abstract: A liquid cooling system has a thermoelectric cooling module, a heat dissipating assembly, a water block and multiple flexible guide tubes with liquid flows inside. The thermoelectric cooling module has a cold surface and a hot surface. The water block has a contacting surface attached to a processor of a computer. The guide tubes are mounted between the thermoelectric cooling module, the heat dissipating assembly and the water block. With the thermoelectric cooling module, the liquid cooling system can cool a processor of computer hardware with high efficiency, and is able to dissipate extraordinary heat generated by the processor.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 19, 2007
    Applicant: COOLER MASTER CO., LTD
    Inventors: Yi-Shen CHIEN, I-Ta HSU