Patents by Inventor Yi Shien CHEN

Yi Shien CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11936238
    Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: March 19, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsin-Chih Chen, Hung-Chieh Lin, Chao-Lung Kuo, Yi-Ping Hsieh, Chien-Shien Lee
  • Patent number: 11923353
    Abstract: A method includes forming a release film over a carrier, forming a polymer buffer layer over the release film, forming a metal post on the polymer buffer layer, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, and decomposing a first portion of the release film. A second portion of the release film remains after the decomposing. An opening is formed in the polymer buffer layer to expose the metal post.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu
  • Publication number: 20230178893
    Abstract: A communication device includes an RF (Radio Frequency) module, an antenna structure, a first switch element, a second switch element, a plurality of first impedance elements, and a plurality of second impedance elements. The antenna structure is coupled to the RF module. The antenna structure includes a first radiation element and a second radiation element. The first switch element is coupled to the first radiation element. The first switch element is switchable between the first impedance elements. The second switch element is coupled to the second radiation element. The second switch element is switchable between the second impedance elements.
    Type: Application
    Filed: January 24, 2022
    Publication date: June 8, 2023
    Inventors: Cheng-Chieh YANG, Yi Shien CHEN