Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: A circuit for sensing a multi-level cell (MLC) flash memory is disclosed. The circuit comprises a plurality of first decoding units, a second decoding unit and a data latch. Each of the first decoding units provides a timing information and includes a controlled transistor to allow a current to pass therethrough, and a capacitor to be charged by the current or to discharge through the controlled transistor. The second decoding unit provides a latch signal and includes a controlled transistor to allow a current to pass therethrough, the magnitude of the current being associated with data in an MLC, and a capacitor to be charged by the current or to discharge through the controlled transistor. The data latch, in response to the timing information from each of the first decoding units and the latch signal from the second decoding unit, determines the data in the MLC.