Patents by Inventor Yi-Shun Huang

Yi-Shun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190065648
    Abstract: A method for establishing an aging model of a device is provided. The device is measured to obtain degradation information of the device under an operating condition, wherein the device is a physical device. The degradation information is partitioned into a permanent degradation portion and an impermanent degradation portion. The impermanent degradation portion is differentiated by time to obtain a differential value. The aging model is obtained according to the differential value. When the differential value is greater than zero, a degradation of the device increases over time, and when the differential value is less than zero, the degradation of the device decreases over time.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 28, 2019
    Inventors: Yi-Shun HUANG, Wai-Kit LEE, Ya-Chin LIANG, Cheng HSIAO, Juan-Yi CHEN, Li-Chung HSU, Ting-Sheng HUANG, Ke-Wei SU, Chung-Kai LIN, Min-Chie JENG
  • Patent number: 10216879
    Abstract: A method for establishing an aging model of a device is provided. The device is measured to obtain degradation information of the device under an operating condition, wherein the device is a physical device. The degradation information is partitioned into a permanent degradation portion and an impermanent degradation portion. The impermanent degradation portion is differentiated by time to obtain a differential value. The aging model is obtained according to the differential value. When the differential value is greater than zero, a degradation of the device increases over time, and when the differential value is less than zero, the degradation of the device decreases over time.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: February 26, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Shun Huang, Wai-Kit Lee, Ya-Chin Liang, Cheng Hsiao, Juan-Yi Chen, Li-Chung Hsu, Ting-Sheng Huang, Ke-Wei Su, Chung-Kai Lin, Min-Chie Jeng
  • Patent number: 10113593
    Abstract: An encoder with oil gas prevention structure including a base, a shaft, a bearing, a cover and an encoding device is provided. The base includes a body and a through hole configured on the body. The shaft is disposed within the though hole. The bearing holds the shaft and is disposed within the through hole, and includes an inner ring and an outer ring wherein the inner ring is set against the first section, and the outer ring is set against a circumference of the through hole. The cover holds the shaft and adjacent to the bearing. The encoding device holds the shaft and is disposed on the cover, and includes a code disc rotatably disposed on the shaft wherein the cover is located between the bearing and the code disc. Therefore, the code disc is prevented from being contaminated by the leaking oil gas from the bearing.
    Type: Grant
    Filed: August 5, 2017
    Date of Patent: October 30, 2018
    Assignee: HIWIN MIKROSYSTEM CORP.
    Inventors: Wei-Kai Tseng, Jheng-Ying Lin, Yi-Shun Huang, Hsin-Wei Tsai
  • Patent number: 10019545
    Abstract: A method includes receiving input information related to devices of an integrated circuit. A first simulation of the integrated circuit is performed over a first time period. Average temperature changes of the devices over the first time period are calculated. A second simulation of the integrated circuit is performed over a second time period using the average temperature changes of the devices. The first simulation and the second simulation are executed by a processor unit.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: July 10, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Min-Chie Jeng, Chung-Kai Lin, Ke-Wei Su, Yi-Shun Huang, Ya-Chin Liang, Cheng Hsiao, Juan Yi Chen, Wai-Kit Lee
  • Patent number: 9829351
    Abstract: An encoding device includes a sensing unit having a signal transmitting element and a signal receiving element. The signal transmitting element and the signal receiving element are respectively disposed on different carrier members. Accordingly, when performing the rectification and alignment processes between the signal receiving element and the signal unit, the other components are prevented from hindering the rectification and alignment processes, whereby the rectification and alignment processes can be easily performed.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 28, 2017
    Assignee: HIWIN MIKROSYSTEM CORP.
    Inventors: Yan-Shiang Wang, Yi-Shun Huang
  • Publication number: 20170219387
    Abstract: An encoding device includes a sensing unit having a signal transmitting element and a signal receiving element. The signal transmitting element and the signal receiving element are respectively disposed on different carrier members. Accordingly, when performing the rectification and alignment processes between the signal receiving element and the signal unit, the other components are prevented from hindering the rectification and alignment processes, whereby the rectification and alignment processes can be easily performed.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 3, 2017
    Inventors: Yan-Shiang WANG, Yi-Shun HUANG
  • Publication number: 20150363526
    Abstract: A method includes receiving input information related to devices of an integrated circuit. A first simulation of the integrated circuit is performed over a first time period. Average temperature changes of the devices over the first time period are calculated. A second simulation of the integrated circuit is performed over a second time period using the average temperature changes of the devices. The first simulation and the second simulation are executed by a processor unit.
    Type: Application
    Filed: June 13, 2014
    Publication date: December 17, 2015
    Inventors: Min-Chie Jeng, Chung-Kai Lin, Ke-Wei Su, Yi-Shun Huang, Ya-Chin Liang, Cheng Hsiao, Juan Yi Chen, Wai-Kit Lee
  • Patent number: 9141735
    Abstract: The present disclosure provides systems for predicting semiconductor reliability. In an embodiment a method for predicting the semiconductor reliability includes receiving a degradation parameter input of a semiconductor device and using a degradation equation to determine a plurality of bias dependent slope values for degradation over a short time period according to the degradation parameter input. The plurality of slope values include at least two different slope values for degradation over time. The system accumulates the plurality of slope values and projects the accumulated slope values over a long time period to determine a stress effect for the semiconductor device.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: September 22, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jia-Lin Lo, Ke-Wei Su, Min-Chie Jeng, Feng-Ling Hsiao, Cheng Hsiao, Yi-Shun Huang, Yi-Chun Chen
  • Patent number: 8370774
    Abstract: A method includes determining a mapping between model parameters and electrical parameters of integrated circuits. The model parameters are configured to be used by a simulation tool. A set of electrical parameters is provided, and the mapping is used to map the set of electrical parameters to a set of model parameters.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: February 5, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Ming Tsai, Ke-Wei Su, Cheng Hsiao, Min-Chie Jeng, Jia-Lin Lo, Feng-Ling Hsiao, Yi-Shun Huang
  • Publication number: 20120054709
    Abstract: A method includes determining a mapping between model parameters and electrical parameters of integrated circuits. The model parameters are configured to be used by a simulation tool. A set of electrical parameters is provided, and the mapping is used to map the set of electrical parameters to a set of model parameters.
    Type: Application
    Filed: August 30, 2010
    Publication date: March 1, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Ming Tsai, Ke-Wei Su, Cheng Hsiao, Min-Chie Jeng, Jia-Lin Lo, Feng-Ling Hsiao, Yi-Shun Huang
  • Publication number: 20110313735
    Abstract: The present disclosure provides systems for predicting semiconductor reliability. In an embodiment a method for predicting the semiconductor reliability includes receiving a degradation parameter input of a semiconductor device and using a degradation equation to determine a plurality of bias dependent slope values for degradation over a short time period according to the degradation parameter input. The plurality of slope values include at least two different slope values for degradation over time. The system accumulates the plurality of slope values and projects the accumulated slope values over a long time period to determine a stress effect for the semiconductor device.
    Type: Application
    Filed: June 18, 2010
    Publication date: December 22, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd. ("TSMC")
    Inventors: Jia-Lin Lo, Ke-Wei Su, Min-Chie Jeng, Feng-Ling Hsiao, Cheng Hsiao, Yi-Shun Huang, Yi-Chun Chen
  • Publication number: 20080277257
    Abstract: A low-noise cost-effective keyboard includes keys arranged in rows and columns in a housing. Each key has a mounting member affixed to the housing, at least one button, at least one connecting member integrally connected between the mounting member and the at least one button in a manner that a top surface of the at least one button is higher in elevation than the top surface of the mounting member, and at least one stop flange protruding from a side of the button opposite to the connecting member in a manner that an end edge of the at least one stop flange is lower in elevation than a bottom surface of the button and the stop flange of one key suspends beneath one button of another key.
    Type: Application
    Filed: September 5, 2007
    Publication date: November 13, 2008
    Applicant: Universal Scientific Industrial Co., LTD.
    Inventors: Chia-Ching HUANG, Yi-Shun Huang