Patents by Inventor Yi Sung

Yi Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level package and method of manufacturing the same
    Publication number: 20090308640
    Abstract: Provided is a wafer level package including a first substrate that has circuit patterns provided on the top surface thereof and first vias formed therein, the first vias being electrically connected to the circuit patterns; and a second substrate that is bonded to the bottom surface of the first substrate through anodic bonding and has second vias formed therein.
    Type: Application
    Filed: September 12, 2008
    Publication date: December 17, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kyu Jeung, Yi Sung