Patents by Inventor Yi Tai Wang

Yi Tai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Publication number: 20040130075
    Abstract: A method for manufacturing shoe soles includes preparing a mold device having a mold cavity formed by an inner peripheral portion for receiving materials to form the shoe soles. The materials are vulcanized and stirred and then disposed into the mold cavity of the mold device, and are then heated and melted to molten status. The mold cavity of the mold device is vacuumed to uniformly apply the materials into depressions of the inner peripheral portion of the mold device, and thus for allowing the molten materials to effectively form spatial patterns on the outer peripheral portion of the shoe soles.
    Type: Application
    Filed: January 3, 2003
    Publication date: July 8, 2004
    Inventor: Yi Tai Wang