Abstract: An aerosol generating apparatus is disclosed. The apparatus includes a liquid container, an adaptor and a driving element. The liquid container includes a perforated membrane through which a liquid can permeate. The liquid container further includes a first mating element. The adaptor includes a second mating element. The driving element includes a piezoelectric element coupled to a substrate. The driving element is accommodated by the adaptor and the substrate includes an aperture and a projection. The first and second mating elements are adapted to detachably and slidably mate with each other such that the aperture of the substrate aligns proximately to the center of the perforated membrane. The first and second mating elements are further adapted for relative movement along a sliding axis. The projection is adapted to press against the perforated membrane.

Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.

Abstract: A method of three-dimensionally integrating elements such as singulated die or wafers and an integrated structure having connected elements such as singulated dies or wafers. Either or both of the die and wafer may have semiconductor devices formed therein. A first element having a first contact structure is bonded to a second element having a second contact structure. First and second contact structures can be exposed at bonding and electrically interconnected as a result of the bonding. A via may be etched and filled after bonding to expose and form an electrical interconnect to interconnected first and second contact structures and provide electrical access to this interconnect from a surface.

Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.

Abstract: The invention relates generally to photoconductive nanocomposite for near-infrared detection, and in particular, to cost-effective and highly photoresponsive photoconductive nanocomposite for near-infrared detection. In particular, the photoconductive nanocomposite comprises a photoconductive composite film of poly(3-hexyl-thiophene-2,5-diyl) (P3HT) mixed with NaYF4:Yb,Er nanophosphors. A method of forming an optoelectronic device cmprising the photoconductive nanocomposite is also disclosed herein.

Abstract: An aerosol generating apparatus is disclosed. The apparatus includes a liquid container, an adaptor detachably engaged with the liquid container, and a driving element accommodated by the adaptor. A perforated membrane, through which a liquid can pass through, is disposed at an exit of the liquid container. Moreover, the perforated membrane faces the driving element. The driving element includes a substrate coupled with a piezoelectric element. The substrate includes an aperture that corresponds to the perforated membrane when the liquid container and the adaptor are engaged so as to receive liquid. Moreover, when the liquid container and the adaptor are engaged, the perforated membrane is in contact with the substrate at the proximity of the aperture, which is about the substrate's center. The adaptor is configured to contact the substrate's periphery only. The resulting apparatus generates aerosol at a desired efficiency with less energy needed.

Abstract: A locking structure and a system using the same are provided. The locking structure includes a rotating unit, a first switch, a sheet and a second switch. The sheet includes a recess and contact to the first switch or the rotating unit. The second switch includes a protrusion movably disposed within the recess.

Abstract: A method of three-dimensionally integrating elements such as singulated die or wafers and an integrated structure having connected elements such as singulated dies or wafers. Either or both of the die and wafer may have semiconductor devices formed therein. A first element having a first contact structure is bonded to a second element having a second contact structure. First and second contact structures can be exposed at bonding and electrically interconnected as a result of the bonding. A via may be etched and filled after bonding to expose and form an electrical interconnect to interconnected first and second contact structures and provide electrical access to this interconnect from a surface.

Abstract: A method of three-dimensionally integrating elements such as singulated die or wafers and an integrated structure having connected elements such as singulated dies or wafers. Either or both of the die and wafer may have semiconductor devices formed therein. A first element having a first contact structure is bonded to a second element having a second contact structure. First and second contact structures can be exposed at bonding and electrically interconnected as a result of the bonding. A via may be etched and filled after bonding to expose and form an electrical interconnect to interconnected first and second contact structures and provide electrical access to this interconnect from a surface. Alternatively, first and/or second contact structures are not exposed at bonding, and a via is etched and filled after bonding to electrically interconnect first and second contact structures and provide electrical access to interconnected first and second contact structure to a surface.

Abstract: An aerosol generating apparatus with interchangeable parts is disclosed. The aerosol generating apparatus includes a holder for accommodating a structure plate and an oscillation generator. The structure plate includes an inlet surface, an outlet surface, a projection extending from the face of the inlet surface, and a through hole. The through hole penetrates the structure plate. The oscillation generator is coupled with and vibrates the structure plate. A reservoir for providing a liquid medicament is also disclosed. The reservoir is detachably engaged with the holder and includes a membrane with a plurality of orifices. During aerosolization, the liquid medicament passes through the plurality of orifices. When the reservoir is engaged with the holder, the membrane of the reservoir is in contact with the projection extending from the face of the inlet surface. In addition, the oscillation generator vibrates the membrane through the projection on the inlet surface.

Abstract: A locking structure and a system using the same are provided. The locking structure includes a rotating unit, a first switch, a sheet and a second switch. The sheet includes a recess and contact to the first switch or the rotating unit. The second switch includes a protrusion movably disposed within the recess.

Abstract: A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

Abstract: A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

Abstract: An electrical module and a device using the same are provided. The electrical module comprises a base, a composite component and a pressing sheet. The composite component is disposed on the base and comprises a pad and a conductive sheet. The conductive sheet is embedded in the pad, and the pressing sheet presses on the pad. The pad comprises a main body and a protrusion. The main body has a surface. The protrusion is disposed on the surface of the main body and is compressed between the surface of the main body and the base.

Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.

Abstract: A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

Abstract: One or more snapshots of data stored over a period of time are maintained in a hybrid storage device comprising a magnetic disk and a solid state disk, wherein a selected snapshot stores information that allows recovery of data that is stored in the hybrid storage device at a selected point in time of the period of time. The hybrid storage device receives an input/output (I/O) command from a computational device. A category of a plurality of categories to which the I/O command belongs is determined, wherein the plurality of categories comprise writing to an unused block, writing to a used block, reading from an unused block, and reading from a used block. In response to determining the category to which the I/O command belongs, the I/O command is handled by one of the magnetic disk and the solid state disk based on the determined category.

Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.

Abstract: A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.