Abstract: This invention provides a lithographic process for multi-etching steps by using single reticle, wherein the develop step is performed next to a bake step after the photoresist layer has been exposed, such that a photoresist residue is formed on the peripheral region around a transformed pattern of the photoresist. Because the photoresist residue has thinner thickness compared to the photoresist layer, this kind of developed photoresist layer can be used as the very mask for multi-etching steps.

Abstract: A process of producing a thin film transistor includes forming a gate line on a substrate by first exposure and development processes. A source electrode, a drain electrode and a semiconductor channel are formed by second exposure and development processes. An island-shaped transistor is formed by third exposure and development processes. A protection layer with a contact hole therein is formed by fourth exposure and development processes. A pixel electrode is formed by fifth exposure and development processes to connect to the contact hole.

Abstract: A method of manufacturing a gate, a thin film transistor and a pixel. First, a patterned mask layer is formed on a substrate. The mask layer exposes an area for forming the gate. A gate is formed on the exposed area of the substrate and then the mask layer is removed. The method produces a gate having a well-defined profile. When the method is applied to form a transistor or a pixel, coverage of a subsequently form film layer is improved and point discharge is prevented.

Abstract: A TFT fabrication method includes: forming a gate insulation layer, a semiconductor layer and a metal layer on a substrate in sequence, which cover a gate; patterning the metal layer and the semiconductor layer; forming a patterned first passivation layer on the substrate and exposing the patterned metal layer; forming a pixel electrode layer on the substrate to cover the patterned first passivation layer and the patterned metal layer; forming a patterned photoresist layer on the substrate and exposing the pixel electrode layer above the gate; etching the pixel electrode layer and the patterned metal layer to form a patterned pixel electrode layer, a source, and a drain to form a channel region on the patterned semiconductor layer; forming a second passivation layer on the substrate; and removing the patterned photoresist layer to lift off the second passivation layer, thereby exposing the patterned pixel electrode layer.

Abstract: A TFT fabrication method includes: forming a gate insulation layer, a semiconductor layer and a metal layer on a substrate in sequence, which cover a gate; patterning the metal layer and the semiconductor layer; forming a patterned first passivation layer on the substrate and exposing the patterned metal layer; forming a pixel electrode layer on the substrate to cover the patterned first passivation layer and the patterned metal layer; forming a patterned photoresist layer on the substrate and exposing the pixel electrode layer above the gate; etching the pixel electrode layer and the patterned metal layer to form a patterned pixel electrode layer, a source, and a drain to form a channel region on the patterned semiconductor layer; forming a second passivation layer on the substrate; and removing the patterned photoresist layer to lift off the second passivation layer, thereby exposing the patterned pixel electrode layer.

Abstract: A Thin Film Transistor (TFT) manufacture method, comprising manufacture of a gate, a gate isolation layer, a channel layer, and a source/drain. Wherein, the manufacture of the channel layer comprises: forming a first a-Si layer by using a low deposition rate (LDR) (Chemical Vapor Deposition, CVD); forming a second a-Si layer by using a high deposition rate (HDR); and forming an N+Mixed a-Si layer. When the first a-Si layer is formed in the present invention, the flux ratio of H2/SiH4 is adjusted to a range from 0.40 to 1.00 to increase the number of defects in the first a-Si layer. When the TFT is irradiated by the light, the photo leakage current generated in the channel layer is trapped in the defects in the first a-Si layer. Therefore, the TFT photo leakage current can be significantly reduced.

Abstract: A process of producing a thin film transistor includes forming a gate line on a substrate by first exposure and development processes. A source electrode, a drain electrode and a semiconductor channel are formed by second exposure and development processes. An island-shaped transistor is formed by third exposure and development processes. A protection layer with a contact hole therein is formed by fourth exposure and development processes. A pixel electrode is formed by fifth exposure and development processes to connect to the contact hole.

Abstract: A Thin Film Transistor (TFT) manufacture method, comprising manufacture of a gate, a gate isolation layer, a channel layer, and a source/drain. Wherein, the manufacture of the channel layer comprises: forming a first a-Si layer by using a low deposition rate (LDR) (Chemical Vapor Deposition, CVD); forming a second a-Si layer by using a high deposition rate (HDR); and forming an N+Mixed a-Si layer. When the first a-Si layer is formed in the present invention, the flux ratio of H2/SiH4 is adjusted to a range from 0.40 to 1.00 to increase the number of defects in the first a-Si layer. When the TFT is irradiated by the light, the photo leakage current generated in the channel layer is trapped in the defects in the first a-Si layer. Therefore, the TFT photo leakage current can be significantly reduced.

Abstract: This invention provides a lithographic process for multi-etching steps by using single reticle, wherein the develop step is performed next to a bake step after the photoresist layer has been exposed, such that a photoresist residue is formed on the peripheral region around a transformed pattern of the photoresist. Because the photoresist residue has thinner thickness compared to the photoresist layer, this kind of developed photoresist layer can be used as the very mask for multi-etching steps.

Abstract: A Thin Film Transistor (TFT) manufacture method, comprising manufacture of a gate, a gate isolation layer, a channel layer, and a source/drain. Wherein, the manufacture of the channel layer comprises: forming a first a-Si layer by using a low deposition rate (LDR) (Chemical Vapor Deposition, CVD); forming a second a-Si layer by using a high deposition rate (HDR); and forming an N+Mixed a-Si layer. When the first a-Si layer is formed in the present invention, the flux ratio of H2/SiH4 is adjusted to a range from 0.40 to 1.00 to increase the number of defects in the first a-Si layer. When the TFT is irradiated by the light, the photo leakage current generated in the channel layer is trapped in the defects in the first a-Si layer. Therefore, the TFT photo leakage current can be significantly reduced.

Abstract: A Thin Film Transistor (TFT) manufacture method, comprising manufacture of a gate, a gate isolation layer, a channel layer, and a source/drain. Wherein, the manufacture of the channel layer comprises: forming a first a-Si layer by using a low deposition rate (LDR) (Chemical Vapor Deposition, CVD); forming a second a-Si layer by using a high deposition rate (HDR); and forming an N+Mixed a-Si layer. When the first a-Si layer is formed in the present invention, the flux ratio of H2/SiH4 is adjusted to a range from 0.40 to 1.00 to increase the number of defects in the first a-Si layer. When the TFT is irradiated by the light, the photo leakage current generated in the channel layer is trapped in the defects in the first a-Si layer. Therefore, the TFT photo leakage current can be significantly reduced.