Patents by Inventor Yi Tsai Lu

Yi Tsai Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer and semiconductor package
    Patent number: 8110931
    Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: February 7, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiao Chuan Chang, Tsung Yueh Tsai, Yi Shao Lai, Ho Ming Tong, Jian Cheng Chen, Wei Chi Yih, Chang Ying Hung, Cheng Wei Huang, Chih Hsing Chen, Tai Yuan Huang, Chieh Ting Chen, Yi Tsai Lu
  • WAFER AND SEMICONDUCTOR PACKAGE
    Publication number: 20100007004
    Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.
    Type: Application
    Filed: July 10, 2009
    Publication date: January 14, 2010
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsiao Chuan CHANG, Tsung Yueh Tsai, Yi Shao Lai, Ho Ming Tong, Jian cheng Chen, Wei Chi Yih, Chang Ying Hung, Cheng Wei Huang, Chih Hsing Chen, Tai Yuan Huang, Chieh Ting Chen, Yi Tsai Lu