Abstract: A method of performing power saving control on a display device includes: generating, by a timing controller of the display device, a power saving start indication and a power saving end indication in response to changing of a refresh rate of the display device; receiving, by a source driver of the display device, the power saving start indication and the power saving end indication; in response to the power saving start indication, allowing a part of circuitry of the source driver to be powered down during a vertical blanking interval; and in response to the power saving end indication, allowing the powered down part of circuitry of the source driver to be woken up during the vertical blanking interval.

Abstract: A package structure includes at least one semiconductor die, a plurality of hollow cylinders, an insulating encapsulant, a redistribution layer and through holes. The plurality of hollow cylinders is surrounding the at least one semiconductor die. The insulating encapsulant has a top surface and a bottom surface opposite to the top surface, wherein the insulating encapsulant encapsulates the at least one semiconductor die and the plurality of hollow cylinders. The redistribution layer is disposed on the top surface of the insulant encapsulant and over the at least one semiconductor die. The through holes are penetrating through the plurality of hollow cylinders.

Abstract: An OLED including an anode, a cathode, and an organic layer between the anode and the cathode, where the organic layer includes a compound having the formula [LA]3-nIr[LB]n is disclosed.

Abstract: A compound having a structure of Formula I In Formula I, M is Pd or Pt; each of X1 to X12 is independently C or N; ring A is a 5-membered or 6-membered ring; K1 and K2 are selected from a direct bond, O, S, and NR; L1 is an organic linker; Y1 is selected from O, S, BR, PR, Se and NRY; each R, RY, RA, RB, RC, and RD is hydrogen or a substituent; and any two substituents can be joined or fused to form a ring. Further provided are OLEDs and related consumer products that utilize these compounds.

Abstract: Novel Iridium complexes having three different bidentate ligands useful for phosphorescent emitters in OLEDs are disclosed. At least one of the three different bidentate ligands is a carbene ligand.

Abstract: Provided is a new composition of matter for phosphorescent emitters containing a chelating ligand comprised of a fused heterocyclic structure containing boron. The disclosed ligands form two bonds to the metal forming a 6-membered chelate and can be further substituted to form tridentate or tetradentate ligands.

Abstract: A method of performing power saving control on a display device includes: generating, by a timing controller of the display device, a power saving start indication and a power saving end indication in response to changing of a refresh rate of the display device; receiving, by a source driver of the display device, the power saving start indication and the power saving end indication; in response to the power saving start indication, allowing a part of circuitry of the source driver to be powered down during a vertical blanking interval; and in response to the power saving end indication, allowing the powered down part of circuitry of the source driver to be woken up during the vertical blanking interval.

Abstract: A semiconductor structure according to the present disclosure includes a substrate, a first base fin and a second base fin arising from the substrate, an isolation structure disposed between the first base fin and the second base fin, first channel members disposed over the first base fin, second channel members disposed over the second base fin, a region isolation feature extending into the substrate, a first gate structure wrapping around each of the first channel members, second gate structure wrapping around each of the second channel members, a first gate cut feature extending through the first gate structure and into the isolation feature, and a second gate cut feature extending though the second gate structure and into the isolation feature. Each of the first gate cut feature and the second gate cut feature are spaced apart from the region isolation feature.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: A compound comprising a first bidentate ligand LA, wherein LA comprises a structure of Formula I; wherein Z is selected from the group consisting of O, S, NR, BR, CRKRL, C?CRKRL, SiRKRL, —CRKRLCRMRN—, —SiRKRLSiRMRN—, —CRKRLO—, —SiRKRLO—, and —CRK?CRL—; wherein ring A, ring B, and ring C are each independently a 5-membered carbocyclic ring, 5-membered heterocyclic ring, 6-membered carbocyclic ring or 6-membered heterocyclic ring; wherein LA is coordinated to a metal M forming a 5-membered chelate ring; wherein M is selected from the group consisting of Ir, Pt, Pd, Ru, Rh, Os, Re, Cu, Ag, and Au; wherein RA, RB, and RC each represent mono to the maximum allowable substitution, or no substitution; wherein each R, RK, RL, RM, RN, RA, RB, and RC is independently a hydrogen or a substituent selected from the group consisting of deuterium, halogen, alkyl, cycloalkyl, heteroalkyl, heterocycloalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, germyl, boryl, selenyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, a

Abstract: A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

Abstract: Disclosed herein are novel single-stranded anti-sense oligonucleotides (ASOs) capable of reducing the transcription of thioredoxin domain containing protein 5 (TXNDC5) mRNA. Also disclosed is use of the single-stranded ASOs as disclosed herein for manufacturing medicaments suitable for treating a disease associated with upregulation of TXNDC5. Accordingly, a pharmaceutical composition comprising the disclosed ASO molecules is provided; as well as a method of treating a subject suffering from TXNDC5-mediated disease via administering to the subject the disclosed single-stranded ASO molecules.

Abstract: A heteroleptic compound of formula Ir(LA)m(LB)n(LC)p is provided wherein LA has a structure of Formula IA, or Formula IB, LB has a structure of Formula II, and LC is a bidentate ligand; and wherein m is 1 or 2; n is 1 or 2; and p is 0 or 1; and m+n+p=3 In Formulae I and II, moieties A and D are heterocyclic ring or a polycyclic ring system; each of X1 to X12 is C or N; Ring B is connected to moiety A by a C; at least one of X9 to X12 is N; Y is a linking group that forms a 5-membered ring; each R, R?, R?, RA, RB, RC, RD, and RE is hydrogen or a General Substituent as defined herein; LA forms a 5-membered chelate ring with Ir. Formulations, OLEDs, and consumer products containing the compound are also provided.

Abstract: An imaging lens assembly includes a plurality of plastic lens elements, a plastic lens barrel, a retaining element, a glue material and a first void structure. The plastic lens barrel includes a plate portion and a tube portion. The plate portion has a central hole, and an optical axis of the imaging lens assembly passing through the central hole. The tube portion is extended from the plate portion which is parallel with the optical axis and defining an inner space and the plastic lens elements is disposed in the inner space. The glue material is disposed between one of the plastic lens elements and the tube portion of the plastic lens barrel, and surrounds the one of the plastic lens elements. The first void structure is extended from the central hole to the tube portion. The plastic lens elements are including a first lens element.

Abstract: A compound comprising a first ligand LA comprising a structure of Formula I, is provided. In Formula I, each of moiety A and moiety B is a monocyclic ring or a polycyclic fused ring system; each of X1 to X4 and Z1 to Z4 is C or N; at least one of X1 to X4 is N; each of K1 and K2 is a direct bond or a linker; Y is a linker; each R, R?, R?, R?, RA, RB, and RC is hydrogen or a substituent; LA is coordinated to a metal M; and at least one of five conditions related to X1 to X4 and/or RC is met. Formulations, OLEDs, and consumer products containing the compound are also provided.

Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A compound semiconductor device includes a substrate, a channel layer on the substrate, a barrier layer on the channel layer, a passivation layer on the barrier layer, and a contact area recessed into the passivation layer and the barrier layer. The channel layer is partially exposed at a bottom of the contact area. Abi-layer silicide film is disposed on the contact area.

Abstract: A compound having the formula Ir(LA)n(LB)3-n, having the structure of Formula I is provided. In the structure of Formula I, each of A1 through A8 is independently carbon or nitrogen; at least one of A1 through A8 is nitrogen; ring B is bonded to ring A through a C—C bond; the iridium is bonded to ring A through an Ir—C bond; X is O, S, or Se; each of R1 through R5 are independently selected from a variety of substituents, which may be linked for form a ring; n is an integer from 1 to 3; and at least one R2 adjacent to ring C is not hydrogen. Formulations and devices, such as OLEDs, that include the first compound are also provided.

Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.

Abstract: An imaging lens assembly includes optical elements and a light path folding mechanism. The light path folding mechanism is disposed on the optical axis to fold an optical axis at least once, and includes a light folding element, a light blocking structure and a nanostructure layer. The light folding element includes a reflecting surface, an incident surface and an exit surface. The reflecting surface is configured to fold an incident light path towards an exit light path. The light blocking structure is disposed on at least one of the incident surface and the exit surface, and includes a main light blocking portion located on a peripheral portion closest to the optical axis on a cross section passing through the optical axis. The nanostructure layer is continuously distributed over at least one of the incident surface and the exit surface and the main light blocking portion.