Patents by Inventor Yi-Tsang Lee

Yi-Tsang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110263187
    Abstract: The present invention relates to a wire saw and a method for fabricating the same. The method for fabricating a wire saw according to the present invention includes: providing a core wire; coating an intermediate layer over the core wire, and embedding a plurality of abrasives in the intermediate layer; and plating a metal protective layer over the abrasives. Accordingly, the present invention can resolve the conventional problem of abrasives in the plating bath aggregating during electroplating deposition, so as to enhance cutting quality and precision.
    Type: Application
    Filed: April 5, 2011
    Publication date: October 27, 2011
    Inventors: Yen-Kang Liu, Yi-Tsang Lee, Chien-Wei Kao