Abstract: In an embodiment, a device includes: a dielectric fin on a substrate; a low-dimensional layer on the dielectric fin, the low-dimensional layer including a source/drain region and a channel region; a source/drain contact on the source/drain region; and a gate structure on the channel region adjacent the source/drain contact, the gate structure having a first width at a top of the gate structure, a second width at a middle of the gate structure, and a third width at a bottom of the gate structure, the second width being less than each of the first width and the third width.

Abstract: A memory cell is disclosed which includes a conductive layer, an insulating layer disposed atop the conducting layer, a semiconductor layer disposed atop the insulating layer, a first electrode coupled to the semiconductor layer, a second electrode coupled to the semiconductor layer, wherein the first and second electrodes are separated from one another and wherein the semiconductor layer extends beyond the first and second electrodes forming a first wing, a third electrode coupled to the conductive layer, a first magnetic tunnel junction (MTJ) disposed on the first wing, and a first read electrode coupled to the first MTJ.