Patents by Inventor Yi-Tung Lin

Yi-Tung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming bonding pad opening
    Patent number: 7585754
    Abstract: A method of forming a bonding pad opening is provided. A passivation layer and a mask layer are sequentially formed on a substrate having a bonding pad formed thereon. Thereafter, the passivation layer is etched to form an opening with use of an anti-reflection coating (ARC) layer of the bonding pad as an etching stop layer. Next, a dry removal process is performed to remove the mask layer. Afterwards, a wet cleaning process is performed to remove the residual mask layer or a polymer produced by previous manufacturing processes. Thereafter, the ARC layer is removed through performing an etching process with use of the passivation layer as a hard mask layer, so as to form the bonding pad opening.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: September 8, 2009
    Assignee: Winbond Electronics Corp.
    Inventors: Wen-Shun Lo, Chih-Jung Ni, Yi-Tung Lin
  • METHOD OF FORMING BONDING PAD OPENING
    Publication number: 20090181542
    Abstract: A method of forming a bonding pad opening is provided. A passivation layer and a mask layer are sequentially formed on a substrate having a bonding pad formed thereon. Thereafter, the passivation layer is etched to form an opening with use of an anti-reflection coating (ARC) layer of the bonding pad as an etching stop layer. Next, a dry removal process is performed to remove the mask layer. Afterwards, a wet cleaning process is performed to remove the residual mask layer or a polymer produced by previous manufacturing processes. Thereafter, the ARC layer is removed through performing an etching process with use of the passivation layer as a hard mask layer, so as to form the bonding pad opening.
    Type: Application
    Filed: January 10, 2008
    Publication date: July 16, 2009
    Applicant: WINBOND ELECTRONICS CORP.
    Inventors: Wen-Shun Lo, Chih-Jung Ni, Yi-Tung Lin
  • Incremental offset measurement instrument
    Patent number: 6772528
    Abstract: An incremental offset measuring instrument is provided. The incremental offset measuring instrument includes a main base; a specimen seat mounted on the main base for resting a specimen; a measuring tool assembly for measuring the specimen; and a movable assembly mounted on the main base, wherein the movable assembly carries the measuring tool assembly, thereby achieving the goal of measuring the specimen.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: August 10, 2004
    Assignee: Nan Ya Technology Corporation
    Inventors: Ming Fa Tsai, Shan Chang Wang, Yi-Tung Lin
  • Incremental offset measurement instrument
    Publication number: 20040016140
    Abstract: An incremental offset measuring instrument is provided. The incremental offset measuring instrument includes a main base; a specimen seat mounted on the main base for resting a specimen; a measuring tool assembly for measuring the specimen; and a movable assembly mounted on the main base, wherein the movable assembly carries the measuring tool assembly, thereby achieving the goal of measuring the specimen.
    Type: Application
    Filed: July 23, 2002
    Publication date: January 29, 2004
    Applicant: Nan Ya Technology Corporation
    Inventors: Ming Fa Tsai, Shan Chang Wang, Yi-Tung Lin