Patents by Inventor Yi Tzu LIN

Yi Tzu LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Memory Arrays Including Continuous Line-Shaped Random Access Memory Strips and Method Forming Same
    Publication number: 20220336530
    Abstract: A device includes a first plurality of conductive strips have lengthwise directions in a first direction, a selector array overlapping the first plurality of conductive strips, an electrode array overlapping the selector array, a plurality of memory strips over the electrode array, and a second plurality of conductive strips overlapping the plurality of memory strips. The plurality of memory strips and the second plurality of conductive strips have lengthwise directions in a second direction perpendicular to the first direction.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: Yi-Tzu Lin, Kuo-Chyuan Tzeng, Kao-Chao Lin, Chang-Chih Huang
  • Memory arrays including continuous line-shaped random access memory strips and method forming same
    Patent number: 11404480
    Abstract: A device includes a first plurality of conductive strips have lengthwise directions in a first direction, a selector array overlapping the first plurality of conductive strips, an electrode array overlapping the selector array, a plurality of memory strips over the electrode array, and a second plurality of conductive strips overlapping the plurality of memory strips. The plurality of memory strips and the second plurality of conductive strips have lengthwise directions in a second direction perpendicular to the first direction.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: August 2, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Tzu Lin, Kuo-Chyuan Tzeng, Kao-Chao Lin, Chang-Chih Huang
  • Line-Shaped Memory and Method Forming Same
    Publication number: 20210202579
    Abstract: A device includes a first plurality of conductive strips have lengthwise directions in a first direction, a selector array overlapping the first plurality of conductive strips, an electrode array overlapping the selector array, a plurality of memory strips over the electrode array, and a second plurality of conductive strips overlapping the plurality of memory strips. The plurality of memory strips and the second plurality of conductive strips have lengthwise directions in a second direction perpendicular to the first direction.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 1, 2021
    Inventors: Yi-Tzu Lin, Kuo-Chyuan Tzeng, Kao-Chao Lin, Chang-Chih Huang
  • Thermal dissipation device and semiconductor package device including the same
    Patent number: 10074586
    Abstract: A thermal dissipation device includes a main body and a support member. The main body has an upper surface, a lower surface opposite to the upper surface, and a lateral surface. The main body defines an injection hole extending through the main body, and includes an inner ring protruding from the upper surface and adjacent to the injection hole and an outer ring protruding from the upper surface and adjacent to the lateral surface. The support member connects to the lateral surface of the main body. An upper surface of the inner ring is higher than an upper surface of the outer ring. A first intersection point between the inner ring and the upper surface of the main body is higher than a second intersection point between the outer ring and the upper surface of the main body.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: September 11, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pin Hung Chiu, Yu Li Chung, Shu Ling Su, Yi Tzu Lin
  • THERMAL DISSIPATION DEVICE AND SEMICONDUCTOR PACKAGE DEVICE INCLUDING THE SAME
    Publication number: 20180138105
    Abstract: A thermal dissipation device includes a main body and a support member. The main body has an upper surface, a lower surface opposite to the upper surface, and a lateral surface. The main body defines an injection hole extending through the main body, and includes an inner ring protruding from the upper surface and adjacent to the injection hole and an outer ring protruding from the upper surface and adjacent to the lateral surface. The support member connects to the lateral surface of the main body. An upper surface of the inner ring is higher than an upper surface of the outer ring. A first intersection point between the inner ring and the upper surface of the main body is higher than a second intersection point between the outer ring and the upper surface of the main body.
    Type: Application
    Filed: March 9, 2017
    Publication date: May 17, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pin Hung CHIU, Yu Li CHUNG, Shu Ling SU, Yi Tzu LIN