Patents by Inventor Yi-Tzu PENG

Yi-Tzu PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYESTER AND COATING MATERIAL
    Publication number: 20230167231
    Abstract: A polyester is formed by reacting a plurality of monomers. The monomers include 7 to 20 parts by mole of (a) aliphatic triol monomer, 40 to 80 parts by mole of (b) first diol monomer, 12 to 40 parts by mole of (c) second diol monomer, and 100 parts by mole of (d) aliphatic diacid monomer or aliphatic anhydride monomer. The (b) first diol monomer has a chemical structure of wherein each R1 is the same. The (c) second diol monomer has a chemical structure of wherein R6 is different from R7.
    Type: Application
    Filed: February 24, 2022
    Publication date: June 1, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chang HUANG, Yi-Che SU, Wen-Yang CHEN, Yi-Tzu PENG
  • Polymer and coating material
    Patent number: 10787590
    Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 29, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Wei Liao, Wei-Cheng Tang, Yi-Tzu Peng, Ya-Tin Yu, Yi-Che Su
  • POLYMER AND COATING MATERIAL
    Publication number: 20200208006
    Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
    Type: Application
    Filed: December 26, 2018
    Publication date: July 2, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Wei LIAO, Wei-Cheng TANG, Yi-Tzu PENG, Ya-Tin YU, Yi-Che SU
  • Resin composition and coating material using the same
    Patent number: 9695333
    Abstract: A resin composition formed by reacting a polyester-polyacid oligomer with a poly-epoxy oligomer is provided. The functionality of the resin composition is between 4 and 10. The weight average molecular weight of the resin composition is between 3,000 and 20,000 g/mol.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: July 4, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Cheng Tang, Su-Mei Chen Wei, Yi-Che Su, Ya-I Hsu, Yi-Tzu Peng
  • RESIN COMPOSITION AND COATING MATERIAL USING THE SAME
    Publication number: 20160185895
    Abstract: A resin composition formed by reacting a polyester-polyacid oligomer with a poly-epoxy oligomer is provided. The functionality of the resin composition is between 4 and 10. The weight average molecular weight of the resin composition is between 3,000 and 20,000 g/mol.
    Type: Application
    Filed: July 23, 2015
    Publication date: June 30, 2016
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Cheng TANG, Su-Mei Chen WEI, Yi-Che SU, Ya-I HSU, Yi-Tzu PENG