Patents by Inventor YI-WAN WANG

YI-WAN WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CAMERA MODULE HAVING EMBEDDED ELECTRONIC ELEMENT AND ELECTRONIC DEVICE HAVING THE SAME
    Publication number: 20240219817
    Abstract: A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.
    Type: Application
    Filed: August 24, 2023
    Publication date: July 4, 2024
    Inventors: MING-HSUN LEE, YI-WAN WANG