Patents by Inventor Yi Wang

Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962526
    Abstract: A method for obtaining a quantity of resource elements in a communication process, comprising: determines a downlink control information format of downlink control information, obtains, based on the downlink control information format, a quantity of resource elements occupied by a demodulation reference signal (DMRS); and determines a size of transport block (TBS) based on the quantity of resource elements occupied by the DMRS.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: April 16, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Ting Wang, Yongzhao Cao, Yi Wang, Hao Tang, Zhenfei Tang
  • Patent number: 11961814
    Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11962100
    Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.
    Type: Grant
    Filed: August 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Inpaq electronic Co., Ltd.
    Inventors: Ta-Fu Cheng, Shou-Jen Li, Cheng-Yi Wang, Chih-Ming Su
  • Publication number: 20240118313
    Abstract: A probe head includes upper, middle and lower dies having upper, middle and lower guiding holes respectively, and a plurality of spring probes. The spring probe includes upper and lower abutting sections disposed in the upper and lower guiding holes, a spring section connecting the upper and lower abutting sections, and a barrel disposed on the periphery of the spring section and inserted in the middle guiding hole. The spring probes include adjacent first and second probes whose barrels has first and second outer diameters and are accommodated in first and second middle guiding holes having first and second widths. The difference between the first width and outer diameter and/or the difference between the second width and outer diameter is larger than or equal to 10 micrometers, and/or the difference between the first and second outer diameters is larger than or equal to 5 ?m.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 11, 2024
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, WEN-YI WANG, CHIH-WEI WEN
  • Publication number: 20240118916
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deployment of a container in a network-constrained environment. An example apparatus includes interface circuitry, machine readable instructions, and programmable circuitry to at least one of instantiate or execute the machine readable instructions to access a first unencrypted shared file, access a second encrypted file, create a third file by integrating contents of the first file and the second file, the third file being a Virtual Execution Environment (VEE) image, store the third file, and deploy the third file to a container runtime environment for execution.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Yi Wang, Yih Leong Sun, Patrick L. Connor
  • Publication number: 20240120295
    Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.
    Type: Application
    Filed: January 30, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Hsien Lee, Yun-Chung Wu, Pei-Wei Lee, Fu Wei Liu, Jhao-Yi Wang
  • Patent number: 11953521
    Abstract: Provided is a probe card, comprising a guide plate and a shielding structure of single-layer or multi-layer. The guide plate comprises an upper surface, a lower surface, and at least one guide hole passing through the upper surface and the lower surface, and the guide hole is provided with an inner wall surface. At least one layer of the shielding structure is made of an electromagnetic absorption material or an electromagnetic reflection material, and the shielding structure is not connected to a ground. Each layer of the shielding structure is formed on the inner wall surface of the guide hole by means of atomic layer deposition or atomic layer etching, and a thickness of each layer is less than 1000 nm.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: April 9, 2024
    Assignee: BAO HONG SEMI TECHNOLOGY CO., LTD.
    Inventors: Chao-Cheng Ting, Li-Hong Lu, Huai-Yi Wang, Lung-Chuan Tsai
  • Publication number: 20240110791
    Abstract: A system is disclosed including at least one memory including computer program instructions, which when executed by at least one processor, cause the system to at least generate, based on a plurality of images from a camera, a first map including a first plurality of features; generate, based on data from a light ranging sensor, a second map including a second plurality of features; and determine, based on a comparison of the first plurality of features and the second plurality of features, a position of the first map relative to the second map. A corresponding method and non-transitory computer-readable medium are also provided.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 4, 2024
    Inventors: Yi LUO, Yi WANG, Ke XU
  • Publication number: 20240114507
    Abstract: A user equipment (UE) configured for operation in a fifth-generation new radio (5G NR) system may be configured for multi physical downlink shared channel (PDSCH) scheduling and may decode a first downlink control information (DCI) and a second DCI received from a gNodeB (gNB). The first DCI may schedule multiple PDSCHs and the second DCI may schedule one or more PDSCHs. The UE may check the timing relations of the scheduled PDSCHs for validity when the first DCI and the second DCI end at a same symbol. When the multiple PDSCHs scheduled by the first DCI and the one or more PDSCHs scheduled by the second DCI are determined to have overlapping time spans, the UE may identify all the PDSCHs scheduled by the first DCI the second DCI as invalid.
    Type: Application
    Filed: May 10, 2022
    Publication date: April 4, 2024
    Inventors: Yingyang Li, Debdeep Chatterjee, Dae Won Lee, Yi Wang, Gang Xiong
  • Patent number: 11944627
    Abstract: The present disclosure provides methods for treating hematological malignancies and Ewings sarcoma using menin inhibitors. Compositions for use in these methods are also provided.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: April 2, 2024
    Assignee: KURA ONCOLOGY, INC.
    Inventors: Francis Burrows, Linda V. Kessler, Liansheng Li, Pingda Ren, Yi Wang, Tao Wu, Jingchuan Zhang
  • Patent number: 11947835
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for controlling, by an on-chip memory controller, a plurality of hardware components that are configured to perform computations to access a shared memory. One of the on-chip memory controller includes at least one backside arbitration controller communicatively coupled with a memory bank group and a first hardware component, wherein the at least one backside arbitration controller is configured to perform bus arbitrations to determine whether the first hardware component can access the memory bank group using a first memory access protocol; and a frontside arbitration controller communicatively coupled with the memory bank group and a second hardware component, wherein the frontside arbitration controller is configured to perform bus arbitrations to determine whether the second hardware component can access the memory bank group using a second memory access protocol different from the first memory access protocol.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: April 2, 2024
    Assignee: Black Sesame Technologies Inc.
    Inventors: Zheng Qi, Yi Wang, Yanfeng Wang
  • Patent number: 11946345
    Abstract: A device and a method for experimental exploitation of natural gas hydrates in full-sized production wells are provided. The device includes a full-diameter well, and the full-diameter well includes a heating circulation tube, a temperature sensor tube, an upper sealing unit and a lower sealing unit. Perforations are provided along a body of the full-diameter well. A reactor includes an upper cover, a lower cover, and a reactor body. The method is conducted by using the device and the reactor. The device and method allow simulation of sand-control wellbores in actual exploitation of natural gas hydrates, and realize horizontal and vertical sand-control experiments.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: April 2, 2024
    Assignee: GUANGZHOU INSTITUTE OF ENERGY CONVERSION, CHINESE ACADEMY OF SCIENCES
    Inventors: Xiaosen Li, Zhaoyang Chen, Yi Wang, Zhiming Xia, Gang Li, Yu Zhang
  • Publication number: 20240105397
    Abstract: A method for preparing a supercapacitor with good cycling stability uses NiO@CoMoO4/NF, an activated carbon plate, a KOH solution (6 mol/L), and polypropylene as raw materials, and is implemented through preparation of an NiO@CoMoO4/NF electrode and assembly of the supercapacitor, wherein the NiO@CoMoO4/NF is the anode of the supercapacitor, the activated carbon plate is the cathode of the supercapacitor, the KOH solution is the electrolyte, and the polypropylene is an isolation plate. The NiO@CoMoO4/NF electrode in the supercapacitor of the present disclosure treated with the ductile material can better adapt to volume changes during the charging and discharging process. After 10,000 cycles of charging and discharging, the capacity of the present disclosure has not faded and still maintains 100% of the maximum capacity, with a high specific capacitance of 79.4 F/g, an energy density of 35.7 Wh/kg, and a functional density of 899.5 W/kg.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Applicant: CHONGQING UNIVERSITY OF ARTS AND SCIENCES
    Inventors: Liangliang TIAN, Hanwen OU, Wenyao YANG, Yi WANG
  • Publication number: 20240106611
    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Embodiments of the present invention provide a method for transmitting a signal, comprising: selecting a starting position of the signal from a set of candidate starting positions for transmitting the signal; determining a symbol mapping of the signal based on a selected starting position or a set of candidate starting positions of the signal; and transmitting the signal is based on the symbol mapping. The embodiment of the invention also provides a corresponding apparatus.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 28, 2024
    Inventors: Yi WANG, Yingyang LI, Shichang ZHANG
  • Patent number: 11943747
    Abstract: A method and an apparatus in a wireless communication system are provided. Configuration information is received on resource pools in multiple carriers for a vehicle to everything (V2X) sidelink communication. At least one carrier is selected for transmission among the multiple carriers. An order of the at least one carrier is determined according to a decreasing order based on a highest priority of a sidelink traffic channel. A set of candidate resources associated with each of the at least one carrier is determined according to the determined order. A candidate resource is excluded from the set of candidate resources, in case that the candidate resource is not supported due to a limitation of a user equipment (UE) in supported carrier combinations.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: March 26, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Yingyang Li, Shichang Zhang, Yi Wang
  • Patent number: 11942398
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Patent number: 11941711
    Abstract: Disclosed is a centralized cloud energy storage system for massive and distributed users and a transaction settlement method thereof, a storage medium, and a terminal. The system includes: a centralized energy storage facility invested and operated by a cloud energy storage service provider; the massive and distributed users; and a power network and a user energy management system connecting the centralized energy storage facility with the massive and distributed users. A user sends a charging and discharging request to the cloud energy storage service provider through the user energy management system, and the cloud energy storage service provider issues a charging and discharging instruction to the centralized cloud energy storage system.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 26, 2024
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Ning Zhang, Jingkun Liu, Yi Wang, Chongqing Kang
  • Patent number: 11943126
    Abstract: Using a traffic monitoring service to detect traffic pattern shifts can include obtaining netflow data and routing data for core routers. Based on the netflow data and the routing data, an augmented traffic matrix can be generated. A router-level analysis can be performed on the augmented traffic matrix to identify a pair of core routers that are associated with a traffic pattern shift in the network. An entity-level analysis can be performed on the pair of core routers to identify an entity that is responsible for the traffic pattern shift in the network. Traffic shift data that identifies the pair of core routers and the entity that is responsible for the traffic pattern shift in the network can be output.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: March 26, 2024
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Carlos Oliveira, Harpreet Ahluwalia, Tzuu-Yi Wang
  • Patent number: 11941327
    Abstract: One embodiment of the present invention sets forth a technique for performing machine learning. The technique includes applying one or more placement rules to a floorplan of a building to generate a set of candidate column locations in the floorplan. The technique also includes selecting, using a first reinforcement learning (RL) agent, one or more column locations from the set of candidate column locations based on a structural stability of the one or more column locations. The technique further includes outputting the floorplan that includes the one or more column locations as a structural design for the building.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: March 26, 2024
    Assignee: AUTODESK, INC.
    Inventors: Yi Wang, Mehdi Nourbakhsh
  • Patent number: D1022484
    Type: Grant
    Filed: January 20, 2024
    Date of Patent: April 16, 2024
    Inventor: Yi Wang