Abstract: A three-dimensional imaging device includes a lens group configured for gathering light beams to output a first light beam and a second light beam towards a first direction; a beam-splitting prism group provided on a side of the lens group that outputs the light beams for transmitting and reflecting a first light beam and a second light beam; a polarizer group including at least three polarizers provided on a side of the beam-splitting prism group that outputs a light beam; the polarizer group is configured for converting the transmitted light beam or the reflected light beam into a polarized light of a preset polarization angle; and a sensor group including at least three sensors, a position of each sensor corresponds to a position of each polarizer, each sensor is configured to obtain the polarized light of the preset polarization angle output from each polarizer to form an image.

Abstract: A variable focus flashlight module including a first lens, a second lens, a third lens, and a light source module sequentially from a magnified side to a minified side along an optical axis of the variable focus flashlight module is provided. The first lens has a negative refracting power. The second lens has a positive refracting power. The third lens has a positive refracting power. The light source module includes multiple light emitting elements arranged in an array. A total length of the variable focus flashlight module is a constant value, and a ratio of a focal length of the second lens to a focal length of the third lens falls within a range of 1.78 to 3.02.

Abstract: A projection device including a first micro light emitting diode (micro LED) panel, a second micro LED panel, a color combiner prism, and a projection lens is provided. The first micro LED panel includes multiple first micro LEDs arranged in an array. The second micro LED panel includes multiple second micro LEDs and multiple third micro LEDs arranged in an array. The first micro LEDs, the second micro LEDs, and the third micro LEDs respectively emit a first color light, a second color light, and a third color light that are different from each other. The color combiner prism is disposed on a path of the first color light, the second color light, and the third color light to generate an image light. The projection lens is disposed on the path of the image light, and the image light passes through the projection lens and then exits the projection device.

Abstract: A pulse pressure measuring apparatus including a plurality of pressing elements, a plurality of pressure sensors, and a processing unit is provided. The pressing elements are used to press the site to be measured, and each pressing element has a position coordinate Pi (i=1, 2, 3 . . . ). The pressure sensors are configured to respectively measure pressure on the pressing elements to generate measured values of pressure intensity Ii (i=1, 2, 3 . . . ) at the position coordinates Pi (i=1, 2, 3 . . . ). The processing unit utilizes the position coordinates Pi (i=1, 2, 3 . . . ) and the measured values of pressure intensity Ii (i=1, 2, 3 . . . ) to determine the blood vessel locus.

Abstract: The disclosure provides an illumination device including a light-emitting element array, a lens array, an infrared light-emitting element array, at least one light sensing element, and a control unit. The light-emitting element array includes a plurality of micro light-emitting diodes arranged in an array. The lens array includes a plurality of lenses. The infrared light-emitting element array includes a plurality of infrared micro light-emitting diodes arranged in an array form, and the infrared micro light-emitting diodes are respectively configured in the light-emitting element array. Each infrared micro light-emitting diode and the at least one light sensing element are configured to provide a plurality of ranging data. The control unit controls each micro light-emitting diode to generate a plurality of light beams according to the ranging data so as to form a plurality of illumination light beams, and the illumination light beams illuminate a target in a pixelated form.

Abstract: An illuminating device including a light-emitting element array and a plurality of light-diffusing elements is provided. The light-emitting element array includes a plurality of discrete light-emitting areas. The plurality of light-diffusing elements respectively correspond to the light-emitting areas, and each light-diffusing element includes a light-entering surface and a light-exiting surface. The light beams emitted by the light-emitting areas respectively enter the corresponding light-diffusing element via the corresponding light-entering surface. After the light beams respectively leave the corresponding light-diffusing element via the corresponding light-exiting surface, the light beams respectively form a plurality of illumination beams. The illumination beams appear in an array form for illumination.

Abstract: An imaging lens, sequentially including a first lens element to a seventh lens element from an object side to an image side along an optical axis, is provided. The first lens element has positive refracting power. The second lens element has negative refracting power. The third lens element and the fourth lens element form a cemented lens element, and the cemented lens element has positive refracting power. The fifth lens element has positive refracting power. The sixth lens element has positive refracting power. The seventh lens element has negative refracting power.

Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each with field of view through a microlens determined by optical characteristics of the microlens and locations of the microlens and openings of upper and lower mask layers. Many photodiode groups have fields of view outwardly splayed from a center-direct field of view. A diameter of openings of the upper mask layer distant from the group having a center-direct field of view is larger than openings of a photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing openings in the upper mask layer of photodiode groups with outwardly splayed fields of view larger than openings in the upper mask layer associated with photodiode groups having center-direct field of view.

Abstract: A thermal image endoscope system includes a thermal image endoscope catheter and a control device. The thermal image endoscope catheter including: a tube body; a thermal image capturing assembly and a disposing component are positioned at a head part of the tube body, the thermal image capturing assembly captures a thermal image from a shooting area; the disposing component has a disposing area and the disposing area is inside the shooting area; a towing component is connected to the head part. The control device including: a driving component is connected to a towing component, a controller actuates the driving component according to a disposing command received by a receiving component to drive the towing component to tow the head part, and actuates a gate of a light guide assembly to selectively couple or decouple a light pipe of the light guide assembly to the disposing component.

Abstract: An eyeshade structure for bilirubin detection includes a body, a first detection module, and a second detection module. The body includes a bottom plate and a side wall. The side wall is connected to the bottom plate and forms an accommodating space with the bottom plate. The first detection module is arranged on the bottom plate. The second detection module is arranged on the bottom plate and is adjacent to the first detection module. The first detection module and the second detection module each include a circuit board, a light-emitting element, an inner photographing element, and an outer photographing element. The circuit board is connected to the bottom plate. The light-emitting element is electrically connected to the circuit board. The inner photographing element is electrically connected to the circuit board. The outer photographing element is electrically connected to the circuit board.

Abstract: An image capturing lens sequentially includes a first lens to a seventh lens from an object side to an image side along an optical axis. The first lens has a positive refracting power. The second lens has a negative refracting power. The third lens has a positive refracting power. The fourth lens has a negative refracting power. The fifth lens has a positive refracting power. The fourth lens and the fifth lens form a cemented lens. The sixth lens has a positive refracting power. The seventh lens has a negative refracting power.

Abstract: A VR equipment includes a casing, and an optical module, an eye movement module, and a display module located inside the casing. The optical module includes a lens barrel and first to fourth lenses located in the lens barrel and arranged in sequence from an object plane to an image plane along an optical axis. The eye movement module is located between the first and second lenses. The eye movement module has a light-emitting unit and a receiving unit. The light-emitting unit emits a detection light to human eyes which is then reflected. The reflected detection light is reflected at an object side surface of the second lens and then enters the receiving unit after passing through an object side surface and an image side surface of the first lens. The display module is at an image side surface of the fourth lens. The display module displays an image.

Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each with field of view through a microlens determined by optical characteristics of the microlens and locations of the microlens and openings of upper and lower mask layers. Many photodiode groups have fields of view outwardly splayed from a center-direct field of view. A diameter of openings of the upper mask layer distant from the group having a center-direct field of view is larger than openings of a photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing openings in the upper mask layer of photodiode groups with outwardly splayed fields of view larger than openings in the upper mask layer associated with photodiode groups having center-direct field of view.

Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each having a field of view determined by pinholes of upper and lower mask layers and a metal layer, each field of view being through a microlens. Many photodiode groups have fields of view outwardly splayed from a group having a center-direct field of view. A diameter of pinholes of the metal layer distant from the group having a center-direct field of view have larger diameter than a pinhole of the photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing a pinhole in the metal layer of photodiode groups with outwardly splayed fields of view larger than a pinhole associated with of photodiode groups having a center-direct field of view.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: Methods and systems for modulating a manufactured light source are disclosed. Methods and systems of the present disclosure include sensor assemblies having first and second light sensors to retrieve light spectrum data at a target location, such as from a surface in an interior space at a home, office, or commercial building, that also receives daylight exposure. The first light sensor retrieves the light spectrum data within a spectrum of the manufactured light source. The second light sensor retrieves light spectrum data outside of the spectrum of the manufactured light source, yet within the spectrum of daylight. The light spectrum data is used to define spectral characteristics at the target location, such as a ratio of daylight to the manufactured light source, phase of daylight, and average overall quantity, which are used to maximize light-associated benefits of the spectral composition for the occupants at the target location, such as humans, plants, and animals.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A near-eye display device includes (a) a display unit for displaying a display image, (b) a viewing unit for presenting the display image to the eye and transmitting ambient light from an ambient scene toward the eye, and (c) an eye imaging unit including (i) an illumination module for generating at least three infrared light beams propagating along at least three different, non-coplanar directions, respectively, (ii) a first beamsplitter interface, disposed between the display unit and the viewing unit, for merging at least a portion of each of the infrared light beams with visible display light to direct each portion toward the eye via the viewing unit, and (iii) a camera for imaging, via the viewing unit and the first beamsplitter interface, pupil of the eye and reflections of the infrared light beams incident on the eye, to form one or more images indicative of gaze direction of the eye.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.