Patents by Inventor Yi-Wen Liu

Yi-Wen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087567
    Abstract: A package substrate is provided, in which a thinner second dielectric layer is formed on one side of a circuit structure including a first dielectric layer, so as to prevent large stress difference between two opposite sides of the circuit structure, thereby preventing the package substrate from warpage problems. A method of fabricating the package substrate is also provided.
    Type: Application
    Filed: September 10, 2024
    Publication date: March 13, 2025
    Inventors: Jiun-Hua CHIUE, Yin-Ju CHEN, Yi-Wen LIU, Min-Yao CHEN, Andrew C. CHANG
  • Publication number: 20250044708
    Abstract: In a method of forming a pattern, a photo resist layer is formed over an underlying layer, the photo resist layer is exposed to an actinic radiation carrying pattern information, the exposed photo resist layer is developed to form a developed resist pattern, a directional etching operation is applied to the developed resist pattern to form a trimmed resist pattern, and the underlying layer is patterned using the trimmed resist pattern as an etching mask.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 6, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ru-Gun LIU, Huicheng CHANG, Chia-Cheng CHEN, Jyu-Horng SHIEH, Liang-Yin CHEN, Shu-Huei SUEN, Wei-Liang LIN, Ya Hui CHANG, Yi-Nien SU, Yung-Sung YEN, Chia-Fong CHANG, Ya-Wen YEH, Yu-Tien SHEN
  • Patent number: 12216077
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Yi-Shao Liu, Fei-Lung Lai
  • Patent number: 12039744
    Abstract: A fluorescence image registration method includes obtaining at least one fluorescence image of a biochip. An interior local area is selected. Sums of pixel values in the interior local area along a first direction and a second direction are obtained. A plurality of first template lines is selected to find a minimum total value of the sums of pixel values corresponding to the first template lines. Pixel-level correction is performed on a local area of the track line to obtain pixel-level track cross. Other track crosses on the biochip is obtained, and the pixel-level correction is performed on the other track crosses. The position of the pixel-level track line is corrected by a center-of-gravity method to obtain the subpixel-level position of the track line. The subpixel-level positions of all sites uniformly distributed on the biochip is obtained.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: July 16, 2024
    Assignee: MGI Tech Co., Ltd.
    Inventors: Mei Li, Yu-Xiang Li, Yi-Wen Liu
  • Publication number: 20240145398
    Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Liang HSU, Wan-Rou CHEN, Hsin-Yin CHANG, Tsung-Li LIN, Hsiu-Jung LI, Chiu-Lien LI, Fu-Quan XU, Yi-Wen LIU, Chih-Chieh SUN
  • Publication number: 20230298188
    Abstract: A fluorescence image registration method includes obtaining at least one fluorescence image of a biochip. An interior local area is selected. Sums of pixel values in the interior local area along a first direction and a second direction are obtained. A plurality of first template lines is selected to find a minimum total value of the sums of pixel values corresponding to the first template lines. Pixel-level correction is performed on a local area of the track line to obtain pixel-level track cross. Other track crosses on the biochip is obtained, and the pixel-level correction is performed on the other track crosses. The position of the pixel-level track line is corrected by a center-of-gravity method to obtain the subpixel-level position of the track line. The subpixel-level positions of all sites uniformly distributed on the biochip is obtained.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Inventors: MEI LI, YU-XIANG LI, YI-WEN LIU
  • Publication number: 20230230912
    Abstract: An electronic package is provided, which includes a substrate structure and an electronic element and a passive element disposed on the substrate structure, where a die placement area and a functional area separated from each other are defined on a surface of a substrate body of the substrate structure, so that a routing layer is arranged with linear conductive traces with a smaller width in the die placement area, and a sheet-shaped circuit with a larger width and electrically connected to the linear conductive traces is arranged in the functional area, so as to reduce a metal area on the surface of the substrate body, thereby avoiding the problem of warpage caused by stress concentration in the die placement area.
    Type: Application
    Filed: December 8, 2022
    Publication date: July 20, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wan-Rou CHEN, Yi-Wen LIU, Hsiu-Jung LI, Yi-Chen CHI, Tsung-Li LIN
  • Patent number: 11682125
    Abstract: A fluorescence image registration method includes obtaining at least one fluorescence image of a biochip. An interior local area. Sums of pixel values in the interior local area along a first direction and a second direction are obtained. A plurality of first template lines is selected to find a minimum total value of the sums of pixel values corresponding to the first template lines. Pixel-level correction is performed on a local area of the track line to obtain a pixel-level track cross. Other track crosses on the biochip is obtained, and the pixel-level correction is performed on the other track crosses. The position of the pixel-level track line is corrected by a center-of-gravity method to obtain the subpixel-level position of the track line. The subpixel-level positions of all sites uniformly distributed on the biochip is obtained.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: June 20, 2023
    Assignee: MGI Tech Co., Ltd.
    Inventors: Mei Li, Yu-Xiang Li, Yi-Wen Liu
  • Patent number: 11435391
    Abstract: The present disclosure provides a dual-sided wafer imaging apparatus and methods thereof. The dual-sided wafer imaging apparatus includes one or more load ports, one or more mechanical arms for transporting a wafer, a wafer transfer stage, a first line scan camera mounted below the wafer transfer stage, a second line scan camera mounted above the wafer transfer stage, a first optical lens mounted on the first line scan camera, a second optical lens mounted on the second line scan camera, and line light sources respectively mounted below and above the wafer transfer stage. The load ports are configured for an automated load operation or unload operation of a wafer pod of an automated transport equipment. The wafer transfer stage includes vacuum suction points in contact with a backside of the wafer, and the wafer transfer stage further includes a drive motor producing a linear reciprocating motion for moving the wafer.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: September 6, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Ying-Chuan Wang, Yi-Wen Liu, Shih-Chih Lin, Jih-Cheng Huang
  • Publication number: 20210223308
    Abstract: The present disclosure provides a dual-sided wafer imaging apparatus and methods thereof. The dual-sided wafer imaging apparatus includes one or more load ports, one or more mechanical arms for transporting a wafer, a wafer transfer stage, a first line scan camera mounted below the wafer transfer stage, a second line scan camera mounted above the wafer transfer stage, a first optical lens mounted on the first line scan camera, a second optical lens mounted on the second line scan camera, and line light sources respectively mounted below and above the wafer transfer stage. The load ports are configured for an automated load operation or unload operation of a wafer pod of an automated transport equipment. The wafer transfer stage includes vacuum suction points in contact with a backside of the wafer, and the wafer transfer stage further includes a drive motor producing a linear reciprocating motion for moving the wafer.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Inventors: YING-CHUAN WANG, YI-WEN LIU, SHIH-CHIH LIN, JIH-CHENG HUANG
  • Publication number: 20210019895
    Abstract: A fluorescence image registration method includes obtaining at least one fluorescence image of a biochip. An interior local area. Sums of pixel values in the interior local area along a first direction and a second direction are obtained. A plurality of first template lines is selected to find a minimum total value of the sums of pixel values corresponding to the first template lines. Pixel-level correction is performed on a local area of the track line to obtain a pixel-level track cross. Other track crosses on the biochip is obtained, and the pixel-level correction is performed on the other track crosses. The position of the pixel-level track line is corrected by a center-of-gravity method to obtain the subpixel-level position of the track line. The subpixel-level positions of all sites uniformly distributed on the biochip is obtained.
    Type: Application
    Filed: April 10, 2018
    Publication date: January 21, 2021
    Inventors: MEI LI, YU-XIANG LI, YI-WEN LIU
  • Patent number: 10856066
    Abstract: The invention discloses an earphone device comprising a first case, a first speaker unit, a first recording unit, and a second recording unit. The first speaker unit, disposed inside the first case, emits a first testing sound signal according to a test command. The first recording unit, disposed inside the first case, records a first environment sound signal according to a record command or a noise cancelling command. The second recording unit, disposed inside the first case, records a first feedback sound signal, related to the first testing sound signal, according to the test command.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: December 1, 2020
    Assignee: XROUND INC.
    Inventors: Peng Lee, Yi-Wen Liu
  • Publication number: 20200160882
    Abstract: An audio detection device and an audio detection method are provided. The audio processing device includes a first audio input device, a second audio input device and an audio processing circuit. The first audio input device is utilized for acquiring a first audio signal and converting first audio signal to a first digital audio signal. The second audio input device is utilized for acquiring a second audio signal and converting second audio signal to a second digital audio signal. The second audio input device is disposed close adjacent to a sound source. A distance between second audio input device and sound source is shorter than a distance between first audio input device and sound source. The audio processing circuit is utilized for performing an echo cancellation process on the first digital audio signal according to second digital audio signal so as to generate a digital audio detection signal.
    Type: Application
    Filed: December 18, 2018
    Publication date: May 21, 2020
    Inventor: Yi-Wen Liu
  • Patent number: 10568551
    Abstract: A hearing diagnosis device and a hearing diagnosis method are provided. The device includes a storage unit, an otoacoustic emission detecting module, and a hearing diagnosis management module. The storage unit stores a hearing diagnosis image sample database and a hearing information sample database. The otoacoustic emission detecting module is configured to perform an otoacoustic emission detecting operation by playing a test audio to an ear of a user to obtain a first hearing diagnosis image corresponding to the ear. The hearing diagnosis management module is configured to perform a hearing diagnosis operation according to the first hearing diagnosis image, a plurality of hearing diagnosis image samples of the hearing diagnosis image sample database, and a plurality of hearing information samples, respectively corresponding to the hearing diagnosis image samples, of the hearing information sample database, so as to determine first hearing information of the ear.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: February 25, 2020
    Assignee: National Tsing Hua University
    Inventors: Hau-Tieng Wu, Pa-Chun Wang, Yi-Wen Liu
  • Publication number: 20190289387
    Abstract: The invention discloses an earphone device comprising a first case, a first speaker unit, a first recording unit, and a second recording unit. The first speaker unit, disposed inside the first case, emits a first testing sound signal according to a test command. The first recording unit, disposed inside the first case, records a first environment sound signal according to a record command or a noise cancelling command. The second recording unit, disposed inside the first case, records a first feedback sound signal, related to the first testing sound signal, according to the test command.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 19, 2019
    Inventors: Peng LEE, Yi-Wen LIU
  • Patent number: 10405255
    Abstract: A dynamic crossband link method is provided, which includes utilizing a local forwarding module to transmit and receive packet data to and from a client device via a first frequency band; obtaining a plurality of communication quality indicators corresponding to a plurality of uplink forwarding modules; and determining to transmit the packet data to a wireless access device and receive the packet data from the wireless access device via one of the plurality of uplink forwarding modules according to the plurality of communication quality indicators.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: September 3, 2019
    Assignee: U-MEDIA Communications, Inc.
    Inventors: Chia-Ching Huang, Yi-Wen Liu
  • Patent number: 10303222
    Abstract: A handle structure including a base portion, a stop portion and a grip portion is provided. The grip portion is connected between the base portion and the stop portion. The handle structure has a cavity therein, the cavity has a bottom surface, and the bottom surface of the cavity is inclined to an axial direction of the grip portion.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: May 28, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Chi Wang, Li-Fang Chen, Yi-Wen Liu, Chen-Hsien Cheng
  • Publication number: 20180368741
    Abstract: A hearing diagnosis device and a hearing diagnosis method are provided. The device includes a storage unit, an otoacoustic emission detecting module, and a hearing diagnosis management module. The storage unit stores a hearing diagnosis image sample database and a hearing information sample database. The otoacoustic emission detecting module is configured to perform an otoacoustic emission detecting operation by playing a test audio to an ear of a user to obtain a first hearing diagnosis image corresponding to the ear. The hearing diagnosis management module is configured to perform a hearing diagnosis operation according to the first hearing diagnosis image, a plurality of hearing diagnosis image samples of the hearing diagnosis image sample database, and a plurality of hearing information samples, respectively corresponding to the hearing diagnosis image samples, of the hearing information sample database, so as to determine first hearing information of the ear.
    Type: Application
    Filed: September 27, 2017
    Publication date: December 27, 2018
    Applicant: National Tsing Hua University
    Inventors: Hau-Tieng Wu, Pa-Chun Wang, Yi-Wen Liu
  • Publication number: 20180275723
    Abstract: A handle structure including a base portion, a stop portion and a grip potion is provided. The grip portion is connected between the base portion and the stop portion. The handle structure has a cavity therein, the cavity has a bottom surface, and the bottom surface of the cavity is inclined to an axial direction of the grip potion.
    Type: Application
    Filed: August 28, 2017
    Publication date: September 27, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Chi Wang, Li-Fang Chen, Yi-Wen Liu, Chen-Hsien Cheng
  • Publication number: 20180184354
    Abstract: A dynamic crossband link method is provided, which includes utilizing a local forwarding module to transmit and receive packet data to and from a client device via a first frequency band; obtaining a plurality of communication quality indicators corresponding to a plurality of uplink forwarding modules; and determining to transmit the packet data to a wireless access device and receive the packet data from the wireless access device via one of the plurality of uplink forwarding modules according to the plurality of communication quality indicators.
    Type: Application
    Filed: February 23, 2018
    Publication date: June 28, 2018
    Inventors: Chia-Ching Huang, Yi-Wen Liu