Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.

Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.

Abstract: In an embodiment, a method of forming a structure includes forming a first transistor and a second transistor over a first substrate; forming a front-side interconnect structure over the first transistor and the second transistor; etching at least a backside of the first substrate to expose the first transistor and the second transistor; forming a first backside via electrically connected to the first transistor; forming a second backside via electrically connected to the second transistor; depositing a dielectric layer over the first backside via and the second backside via; forming a first conductive line in the dielectric layer, the first conductive line being a power rail electrically connected to the first transistor through the first backside via; and forming a second conductive line in the dielectric layer, the second conductive line being a signal line electrically connected to the second transistor through the second backside via.

Abstract: A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.

Abstract: A touchpad press device includes a support unit having two first sides interconnecting between two second sides, and first engaging members proximate to the second sides. A touch unit with a touch switch is disposed above the support unit, and a transmission unit is disposed between the support unit and the touch unit. The transmission unit includes peripheral plates, each of which is disposed above one of the second sides and has second engaging members, and a pressing plate to trigger the touch switch. When one of the peripheral plates is pressed downward through the touch unit, the other peripheral plate turns upward so that the second engaging members thereof engage the respective first engaging members to limit the other peripheral plate from moving further upward.

Abstract: A touch input device includes a frame unit, a circuit unit and a touch pad. The circuit unit includes a circuit board, a dome-shaped actuating member including an actuating portion and a resilient metal sheet connected between the actuating portion and the circuit board, and a noise reduction member having a main body connected to the resilient metal sheet, made of an elastic material and formed with a recess surrounding the actuating portion. A touch surface of the touch pad is touchable to push the circuit unit toward the block member, such that the actuating portion contacts the block member to deform the resilient metal sheet to electrically connect the actuating portion with the circuit board.

Abstract: A touch input device includes a base board, a circuit module having a free end portion and a connecting end portion, a metallic connecting member and an annular, metallic frame. The connecting member includes a positioning portion fixedly mounted to the connecting end portion of the circuit module, and an elastic arm extending from the positioning portion away from the connecting end portion and toward a free end portion in such a way to define a coupling groove that indents away therefrom. The frame is spaced apart from the circuit module and includes a coupling portion that is embossed from a side of the frame proximate to the connecting member, and that has a coupling block coupled to the coupling groove of the elastic arm.

Abstract: The present invention is directed to an exposure parameter compensation method and an imaging device. A capture-mode image capturing step is performed to obtain a first image and a second image according to a first exposure time and a second exposure time respectively based on a first light sensitivity and a predetermined time. The first image and the second image are operated on to result in a difference image. The first light sensitivity is replaced with a second light sensitivity, which is then recorded.

Abstract: The present invention is directed to a light sensitivity calibration method and an imaging device. An exposure step is performed to obtain a light sensitivity according to a predetermined time. A time adjustment step is performed to adjust the predetermined time according to the light sensitivity, thereby obtaining an adjusted time. The predetermined time is replaced with the adjusted time and the exposure and time adjustment steps are repeatedly performed, until the adjusted time converges within a predetermined range.

Abstract: The present invention is directed to an exposure parameter compensation method and an imaging device. A capture-mode image capturing step is performed to obtain a first image and a second image according to a first exposure time and a second exposure time respectively based on a first light sensitivity and a predetermined time. The first image and the second image are operated on to result in a difference image. The first light sensitivity is replaced with a second light sensitivity, which is then recorded.

Abstract: The present invention is directed to a light sensitivity calibration method and an imaging device. An exposure step is performed to obtain a light sensitivity according to a predetermined time. A time adjustment step is performed to adjust the predetermined time according to the light sensitivity, thereby obtaining an adjusted time. The predetermined time is replaced with the adjusted time and the exposure and time adjustment steps are repeatedly performed, until the adjusted time converges within a predetermined range.

Abstract: The present invention is directed to an image compensation method and system. A first frame of a plurality of first pixels is provided. A compensation step is performed on the first pixels to generate a second frame of a plurality of second pixels, wherein any two of the adjacent second pixels have a same distance therebetween. A frame resizing step is performed before and/or after the compensation step.

Abstract: A method of photoresist removal with concomitant de-veiling is provided. The method employs a plasma formed from a gas chemistry comprising O2, NH3 and a fluorine-containing gas, such as CF4. The method is particularly suitable for use in MEMS fabrication processes, such as inkjet printhead fabrication.