Abstract: The present disclosure relates to a bit-width control method of bi-directional optical flow (BDOF) for coding a video signal. The method includes obtaining a first reference picture I(0) and a second reference picture I(1) associated with a video block, obtaining first prediction samples I(0)(i,j) of the video block from a reference block in the first reference picture I(0), obtaining second prediction samples I(1)(i,j) of the video block from a reference block in the second reference picture I(1), controlling internal bit-widths of the BDOF by deriving internal bit-widths of intermediate parameters, obtaining motion refinements for samples in the video block based on the BDOF being applied to the video block based on the first prediction samples I(0)(i,j) and the second prediction samples I(1)(i,j), and obtaining bi-prediction samples of the video block based on the motion refinements.

Abstract: A method and a computing device are provided for video coding. The method may include deriving parameter ? and parameter ? for a CCLM mode by using a predetermined number of neighboring reconstructed luma samples and chroma samples in a CU; and generating a final chroma predictor for the chroma samples of the CU by using the parameter ? and the parameter ?.

Abstract: An electronic apparatus performs a method of decoding video data, comprising: receiving, from the video signal, a picture frame including a first component, and a second component; determining a classifier for the first component based on a first set of one or more samples of the second component associated with a respective sample of the first component and a second set of one or more samples of the first component associated with the respective sample of the first component; determining a sample offset for the respective sample of the first component according to the classifier; and modifying a value of the respective sample of the first component based on the determined sample offset. In some embodiments, the first component is a luma component and the second component is a chroma component, and the classifier is determined by a combination of a band offset classifier and edge offset classifier.

Abstract: Primer layers having improved reflectivity and thermal insulation properties are provided for use in microencapsulated thermal imaging sheets. Primer layers having a polymeric binder, of about 3% to about 60% by weight, relative to the total weight of the primer layer, of a white particulate, a primer substrate, and hollow particulate particles improve the reflectivity, color development, color density, and thermal insulation of microcapsule imaging sheets including the same. A black back-coat applied to the substrate on a side opposite the primer layer further enhances the Dmax and E10 of microcapsule imaging sheets and prevents premature exposure of microcapsule imaging sheets in stacked media.

Abstract: An electronic apparatus performs a method of decoding video data. The method comprises: receiving, from the video signal, a picture frame that includes a first component, and a second component; determining a classifier for the first component based on a first set of one or more samples of the second component associated with a respective sample of the first component; determining a sample offset for the respective sample of the first component according to the classifier; and modifying a value of the respective sample of the first component based on the determined sample offset, wherein the first component and the second component are chroma components. The picture frame further includes a third component, and the classifier for the first component is additionally based on a second set of one or more samples of the third component associated with the respective sample of the first component.

Abstract: A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is then formed over the first redistribution structure, and a die is attached to the first redistribution structure active-side down. The second component includes a second redistribution structure, which is then attached to the through via. A molding compound is deposited between the first redistribution structure and the second redistribution structure and further around the sides of the second component.

Abstract: An electronic apparatus performs a method of video encoding. The method comprises: obtaining a video picture that includes a first component and a second component; determining a plurality of offsets associated with the second component; utilizing a sample value of the first component to obtain a class index associated with the second component; selecting an offset from the plurality of offsets for the second component according to the class index; and obtaining a sample value of the second component based on the selected offset, wherein utilizing the sample value of the first component to obtain the class index associated with the second component comprises: utilizing a first sample value of the first component to obtain a first parameter; utilizing a second sample value of the first component to obtain a second parameter; and obtaining the class index according to the first parameter and the second parameter.

Abstract: A computing device performs a method of decoding video data by acquiring a video bitstream including data associated with multiple encoded pictures, each picture including multiple rows of coding tree units (CTUs) and each CTU including one or more coding units (CUs). A data buffer storing a plurality of history-based motion vector predictors is used for encoding the rows of CTUs and the decoding process resets the buffer before decoding a first CU of a current row of CTUs. For a current CU of the row of CTUs, a motion vector candidate list is constructed from exploiting spatial and temporal correlation of motion vectors of neighbouring code units as well as the history-based motion vector predictors in the buffer. Finally, one motion vector predictor is selected, from the motion vector candidate list, for decoding the current CU and the buffer is updated based on the selected one.

Abstract: A semiconductor package is provided. The semiconductor package includes a redistribution structure, a semiconductor die, and an interposer structure. The interposer structure includes an insulating base having a first surface facing the semiconductor die and a second surface opposite to the first surface and conductive features formed over the insulating base. The conductive features include first portions on the first surface of the insulating base and vertically overlapping the semiconductor die, second portions on the first surface of the insulating base and located outside a projection area of the semiconductor die in a top view, third portions on the second surface of the insulating base and vertically overlapping the semiconductor die, and fourth portions on the second surface of the insulating base and located outside the projection area of the semiconductor die in the top view. The interposer structure includes capping layers and dielectric features.

Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video coding. The method for video coding includes: receiving, by a decoder, a Sequence Parameter Set (SPS) range extension flag that indicates whether a syntax structure, sps_range_extension, is present in Slice Head (SH) Raw Byte Sequence Payload (RBSP) syntax structures based on a value of the SPS range extension flag.

Abstract: A method of decoding video data and an electronic apparatus for performing the method are provided. The method includes: receiving, from the video signal, a picture frame that includes a first component, and a second component; determining a classifier for the first component based on a first set of one or more samples of the second component associated with a respective sample of the first component; determining a sample offset for the respective sample of the first component according to the classifier; and modifying a value of the respective sample of the first component based on the determined sample offset, the first component being a luma component and the second component being a first chroma component.

Abstract: A package structure includes a redistribution structure, a first semiconductor die, a first passive component, a second semiconductor die, a first insulating encapsulant, a second insulating encapsulant, a second passive component and a global shielding structure. The redistribution structure includes dielectric layers and conductive layers alternately stacked. The first semiconductor die, the first passive component and the second semiconductor die are disposed on a first surface of the redistribution structure. The first insulating encapsulant is encapsulating the first semiconductor die and the first passive component. The second insulating encapsulant is encapsulating the second semiconductor die, wherein the second insulating encapsulant is separated from the first insulating encapsulant. The second passive component is disposed on a second surface of the redistribution structure.

Abstract: A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is then formed over the first redistribution structure, and a die is attached to the first redistribution structure active-side down. The second component includes a second redistribution structure, which is then attached to the through via. A molding compound is deposited between the first redistribution structure and the second redistribution structure and further around the sides of the second component.

Abstract: A touch light-emitting module and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit board has a top surface on which a touch-control IC and a luminous unit that is electrically connected are disposed. The touch-control conductor includes a hollowed portion. The touch-control conductor is coated, on the bottom thereof, with a conductive material to combine with the top surface of the printed circuit board, so that the touch-control IC and the luminous unit are located in the hollowed portion. An encapsulation resin is then injected into a space between the printed circuit board and the hollowed portion to complete encapsulation. As such, the present invention offers a simplified structure to achieve an effect of minimization, and also simplifies the manufacturing process and reduces the working time to thereby enhance the yield.

Abstract: A semiconductor device includes a substrate; an interconnect structure over the substrate; a first passivation layer over the interconnect structure; a first conductive pad, a second conductive pad, and a conductive line disposed over the first passivation layer and electrically coupled to conductive features of the interconnect structure; a conformal second passivation layer over and extending along upper surfaces and sidewalls of the first conductive pad, the second conductive pad, and the conductive line; a first conductive bump and a second conductive bump over the first conductive pad and the second conductive pad, respectively, where the first conductive bump and the second conductive bump extend through the conformal second passivation layer and are electrically coupled to the first conductive pad and the second conductive pad, respectively; and a dummy bump over the conductive line, where the dummy bump is separated from the conductive line by the conformal second passivation layer.

Abstract: An integrated circuit includes a first circuit with m first units coupled in parallel, any of the first units including one or more first transistors coupled in series, and a second circuit with n second units coupled in parallel, any of the second units including one or more second transistors coupled in series. A gate terminal of the first circuit is coupled to a gate terminal of the second circuit. M and n are different positive integers.

Abstract: A fan assembly including a fan frame and an impeller. The fan frame includes a frame body and a first peripheral protruding plate and has an air inlet and an air outlet. The first peripheral protruding plate protrudes from a side of the frame body and forms an air channel together with the frame body. The first peripheral protruding plate is configured to reduce a noise made by the fan assembly. The air inlet is in fluid communication with the air outlet via the air channel. The impeller is rotatably disposed on the frame body and located in the air channel. The protruding height of the first peripheral protruding plate relative to the frame body ranges from 50 to 100 percent of an overall axial thickness of the impeller.

Abstract: The present disclosure relates to a method for deriving constructed affine merge candidates. The method includes acquiring one or more control point sets from a decoder. The decoder determines whether a reference index of each control point for the control point set index within the control point set associated with a reference index pointing into a reference picture in a first reference picture list is greater than or equal to zero and each is equal to each other. The decoder also determines whether a reference index of each control point for the control point set index within the control point set associated with a reference index pointing into a reference picture in a second reference picture list is greater than or equal to zero and each is equal to each other. The decoder determines that an affine motion model is available based on the determination result.

Abstract: A display device includes a display and a detection module. The display includes a display surface and a casing, and the casing exposes the display surface. The detection module includes a pivoting component and a sensing component. The pivoting component is disposed on the casing and includes a bearing. The sensing component includes a sensor and a sensing surface. The sensing component is disposed on the bearing and is configured to rotate about an axis of the bearing so that the sensing surface faces the display surface. The sensor is configured to provide a position sensing signal for determining whether the sensing component has rotated to a detection position. A display calibration method is also provided.