Patents by Inventor YI-WUN CHEN

YI-WUN CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230111086
    Abstract: A cold plate is provided and includes: a casing formed with an accommodating groove; a base coupled to the casing to define an action space together with the casing, where the action space communicates with the accommodating groove; a heat transfer structure disposed on an inner side of the base for transferring a heat energy generated by a heat source in contact with an outer side of the base to a working medium in the action space; and a pump having a stator disposed in the accommodating groove.
    Type: Application
    Filed: August 22, 2022
    Publication date: April 13, 2023
    Inventors: Yi-Wun Chen, Ming-Yuan Chiang, Chien-Yu Chen, Mu-Shu Fan
  • Publication number: 20230096271
    Abstract: A system can receive first input data indicative of first user input identifying a first diagnostic state of a computing system. The system can, based on the first input data, determine a second diagnostic state of the computing system, the second diagnostic state comprising information of the first diagnostic state. The system can present a first indication of the second diagnostic state via a user interface. The system can receive second input data indicative of second user input confirming the second diagnostic state. The system can determine a recommended action based on the second diagnostic state. The system can present a second indication of the recommended action via the user interface.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Landon Martin Chambers, Ravi Shukla, Jeffrey Scott Vah, Yi-Wun Chen
  • Publication number: 20220174833
    Abstract: A bolster is provided and includes a bottom plate including a side plate extending upwards from a side of the bottom plate and a holding portion bending inwards from an edge of the side plate, a pillar vertically provided on the bottom plate and adjacent to the holding portion, and a torsion bar including two end portions and a main body portion, where one of the two end portions is fixed in the pillar and restricted by the holding portion, and the main body portion is restricted by the side plate. The bolster can effectively reduce warpage and deformation of the bottom plate.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 2, 2022
    Inventors: Chien-Yu Chen, Yi-Wun Chen, Yun-Kuei Lin
  • Publication number: 20170231116
    Abstract: A heat dissipating device and a method for increasing heat conduction of the heat dissipating device are provided. The heat dissipating device at least includes a fin group, a heat conduction block with a coupling region and plural heat pipes. Firstly, the heat conduction block is placed in the fin group. Then, first-part pipe bodies of at least portions of the plural heat pipes are placed in the coupling region. The exposed surfaces of the first-part pipe bodies are partially protruded over an outer edge surface of the heat conduction block. Then, in response to an external force, the exposed surfaces of the first-part pipe bodies are located beside and coplanar or nearly coplanar with the outer edge surface of the heat conduction block. The contact area of the first-part pipe bodies in the coupling region is increased, and thus the heat dissipating efficiency is enhanced.
    Type: Application
    Filed: July 18, 2016
    Publication date: August 10, 2017
    Inventors: AN-CHIH WU, CHE-CHIA CHANG, YI-WUN CHEN
  • Patent number: D848960
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 21, 2019
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Mu-Shu Fan, Che-Chia Chang, Yi-Wun Chen
  • Patent number: D848961
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: May 21, 2019
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Mu-Shu Fan, Che-Chia Chang, Yi-Wun Chen, Yu-Ting Chang, Wan-Chi Hsiao