Patents by Inventor Yi Xiu Xie

Yi Xiu Xie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12388030
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: August 12, 2025
    Assignee: NXP B.V.
    Inventors: Tzu Ya Fang, Yen-Chih Lin, Jian Nian Chen, Moly Lee, Yi Xiu Xie, Vanessa Wyn Jean Tan, Yao Jung Chang, Yi-Hsuan Tsai, Xiu Hong Shen, Kuan Lin Huang
  • Publication number: 20240038683
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 1, 2024
    Inventors: Tzu Ya Fang, Yen-Chih Lin, Jian Nian Chen, Moly Lee, Yi Xiu Xie, Vanessa Wyn Jean Tan, Yao Jung Chang, Yi-Hsuan Tsai, Xiu Hong Shen, Kuan Lin Huang