Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: An electric knife includes a cutter blade, a handle, and a drive unit and a driven unit mounted inside the handle. The drive unit includes a first movable sleeve. The driven unit includes a second movable sleeve. The cutter blade is set on the second movable sleeve. The drive unit and the driven unit are connected through a link, so that the drive unit can drive the second movable sleeve of the driven unit and the cutter blade to reciprocate along an axis.

Abstract: An electric knife includes a cutter blade, a handle, and a drive unit and a driven unit mounted inside the handle. The drive unit includes a first movable sleeve. The driven unit includes a second movable sleeve. The cutter blade is set on the second movable sleeve. The drive unit and the driven unit are connected through a link, so that the drive unit can drive the second movable sleeve of the driven unit and the cutter blade to reciprocate along an axis.

Abstract: A transceiver module including an adaptor and a PCB is provided. The PCB, connected with the adaptor, has a first signal layer, a second signal layer and a singular ground layer wherein the singular ground layer is set between the first signal layer and the second signal layer. The first signal layer includes a first transmitter circuit region and a first receiver circuit region. The second signal layer includes a second transmitter circuit region and a second receiver circuit region. The singular ground layer includes a ground portion of a third receiver circuit electrically connected with the ground signals of the first and the second receiver circuit region. Beside, the projection area of the singular ground layer onto the first signal layer substantially covers the first transmitter the first receiver circuit region. The ground portion of the third receiver circuit is electrically connected with a ground of the adaptor.

Abstract: A light detecting circuit includes a power source circuit, an optoelectronic component, a switch and a Trans Impedance Amplifier (TIA) circuit. The power source circuit provides an electric signal. When the optoelectronic component is biased at a bias voltage, the optoelectronic component generates a corresponding current according to the received light density. The switch has a trigger receiver. After the trigger receiver receives a trigger signal, the switch turns on and the optoelectronic component is biased at the bias voltage. The TIA circuit transforms the corresponding current to a corresponding voltage and then calculates the corresponding voltage to obtain the light density.

Abstract: A signal detector comprises a signal translator, a data signal detector, a clock signal detector and an inputting control circuit for detecting abnormal clock and data signals. The signal translator respectively converts differential data signals and differential clock signal into a single data signal and a single clock signal. The data signal detector outputs a data detecting signal according to the single data signal. The clock signal detector outputs a clock detecting signal according to the single clock signal. The interrupting control circuit receives the data detecting signal and outputs a shutdown signal when the single data signal is at high voltage level over a predefined ratio. The interrupting control circuit also receives the clock detecting signal and outputs the shutdown signal when the single clock signal abnormally disappears.

Abstract: A transceiver module including an adaptor and a PCB is provided. The PCB, connected with the adaptor, has a first signal layer, a second signal layer and a singular ground layer wherein the singular ground layer is set between the first signal layer and the second signal layer. The first signal layer includes a first transmitter circuit region and a first receiver circuit region. The second signal layer includes a second transmitter circuit region and a second receiver circuit region. The singular ground layer includes a ground portion of a third receiver circuit electrically connected with the ground signals of the first and the second receiver circuit region. Beside, the projection area of the singular ground layer onto the first signal layer substantially covers the first transmitter the first receiver circuit region. The ground portion of the third receiver circuit is electrically connected with a ground of the adaptor.

Abstract: A method for making a laser driver circuit for burst mode is described. The method includes the following steps: First, a continuous mode laser driver circuit is selected, the chip having a temperature compensation output, a bias current setting input, and a reference current setting input. Next, the temperature compensation signal is converted to a reference current setting signal via a first bias adjustment circuit, and the reference current setting signal is input to the reference current setting input. Then, the bias current setting input is connected to ground via a second bias adjustment circuit. The reference current setting signal automatically adjusts the high level and the low level of the eye diagram of the laser according to the environmental temperature, so that the high level and the low level are kept stable to reduce the bit error rate in transmission.

Abstract: A light detecting circuit includes a power source circuit, an optoelectronic component, a switch and a Trans Impedance Amplifier (TIA) circuit. The power source circuit provides an electric signal. When the optoelectronic component is biased at a bias voltage, the optoelectronic component generates a corresponding current according to the received light density. The switch has a trigger receiver. After the trigger receiver receives a trigger signal, the switch turns on and the optoelectronic component is biased at the bias voltage. The TIA circuit transforms the corresponding current to a corresponding voltage and then calculates the corresponding voltage to obtain the light density.

Abstract: A signal detector comprises a signal translator, a data signal detector, a clock signal detector and an inputting control circuit for detecting abnormal clock and data signals. The signal translator respectively converts differential data signals and differential clock signal into a single data signal and a single clock signal. The data signal detector outputs a data detecting signal according to the single data signal. The clock signal detector outputs a clock detecting signal according to the single clock signal. The interrupting control circuit receives the data detecting signal and outputs a shutdown signal when the single data signal is at high voltage level over a predefined ratio. The interrupting control circuit also receives the clock detecting signal and outputs the shutdown signal when the single clock signal abnormally disappears.

Abstract: A method for making a laser driver circuit for burst mode is described. A continuous mode laser driver circuit can be used in burst mode transmission system by using the method. The method is described as follows. First, a continuous mode laser driver chip is selected, the chip has a temperature compensation output and a pulse width adjustment input. Next, the temperature compensation signal from the temperature compensation output is converted to a pulse width adjustment signal using an eye diagram adjustment circuit, and the pulse width adjustment signal is sent to the pulse width adjustment input. The pulse width adjustment signal automatically adjusts the cross points of the eye diagram of the laser according to the environmental temperature, so that the cross points are sustained at a predetermined level to reduce the Bit Error Rate.

Abstract: A laser driver circuit for burst mode transmission is equipped in a transmitter at a client side within a P2MP (Point to Multipoint) optical network. The laser driver circuit utilizes a laser driver chip for a continuous mode. The selected laser driver chip is capable of working under an open-loop situation. A burst signal containing time slot information is fed to the switch connected to the laser driver chip. If the burst signal is enabled, a resistor of a predetermined value is connected to the laser driver chip via the switch so that normal driving current is generated for data transmission. If the burst signal is disabled, another resistor whose value is greater than the predetermined value is connected to the laser driver chip via the switch so that no or almost no driving current is generated, thereby avoid the signal collision problem of the channel shared by multiple clients.

Abstract: This invention includes a Clock Signal Detector and a Data Signal Detector. The Clock Signal Detector is designed to utilize a combination of a signal converter, rectifying-filtering circuit, and an inverter to prevent undetected signal interruption. With which, when a Clock signal interruption occurs that causes the signal converter and rectifying-filtering circuit unable to output clock and D.C. potential signals correspondingly, the inverter outputs a high potential signal as a warning for the detected abnormality in the clock signals. Through this warning, this signal detector can effectively prevent undetected interruptions during clock signal transmission through fiber optics or other wires, and, as a result, avoid time and resource wastages. The Data Signal Detector is designed to utilize a set of devices containing a signal converter, an integral charger, and an inverter.

Abstract: A method for making a laser driver circuit for burst mode is described. A continuous mode laser driver circuit can be used in burst mode transmission system by using the method. The method is described as follows. First, a continuous mode laser driver chip is selected, the chip has a temperature compensation output and a pulse width adjustment input. Next, the temperature compensation signal from the temperature compensation output is converted to a pulse width adjustment signal using an eye diagram adjustment circuit, and the pulse width adjustment signal is sent to the pulse width adjustment input. The pulse width adjustment signal automatically adjusts the cross points of the eye diagram of the laser according to the environmental temperature, so that the cross points are sustained at a predetermined level to reduce the Bit Error Rate.

Abstract: A method for making a laser driver circuit for burst mode is described. The method includes the following steps: First, a continuous mode laser driver circuit is selected, the chip having a temperature compensation output, a bias current setting input, and a reference current setting input. Next, the temperature compensation signal is converted to a reference current setting signal via a first bias adjustment circuit, and the reference current setting signal is input to the reference current setting input. Then, the bias current setting input is connected to ground via a second bias adjustment circuit. The reference current setting signal automatically adjusts the high level and the low level of the eye diagram of the laser according to the environmental temperature, so that the high level and the low level are kept stable to reduce the bit error rate in transmission.

Abstract: A laser driver circuit for burst mode transmission is equipped in a transmitter at a client side within a P2MP (Point to Multipoint) optical network. The laser driver circuit utilizes a laser driver chip for a continuous mode. The selected laser driver chip is capable of working under an open-loop situation. A burst signal containing time slot information is fed to the switch connected to the laser driver chip. If the burst signal is enabled, a resistor of a predetermined value is connected to the laser driver chip via the switch so that normal driving current is generated for data transmission. If the burst signal is disabled, another resistor whose value is greater than the predetermined value is connected to the laser driver chip via the switch so that no or almost no driving current is generated, thereby avoid the signal collision problem of the channel shared by multiple clients.