Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.

Abstract: An optoelectronic semiconductor device includes a substrate, a first type semiconductor structure, a second type semiconductor structure, an active structure and a contact structure. The first type semiconductor structure is located on the substrate and has a first protrusion part with a first thickness and a platform part with a second thickness. The second type semiconductor structure is located on the first type semiconductor structure. The active structure is between the first type semiconductor structure and the second type semiconductor structure. The contact structure is disposed between the first type semiconductor structure and the substrate. The second thickness of the platform part is in a range of 0.01 ?m to 1 ?m.

Abstract: In some embodiments, the present disclosure relates to a method of forming an integrated chip. The method includes forming a bottom electrode layer over a substrate and forming a seed layer over the bottom electrode layer. A ferroelectric switching layer is formed over the bottom electrode layer and to contact the seed layer. The ferroelectric switching layer is formed to have a first region with a first crystal phase and a second region with a different crystal phase. A top electrode layer is formed over the ferroelectric switching layer. One or more patterning processes are performed on the bottom electrode layer, the seed layer, the ferroelectric switching layer, and the top electrode layer to form a ferroelectric random access memory (FeRAM) device.

Abstract: A solution for preserving extracellular vesicles/exosomes has a carrier solvent selected from a group consisting of polysorbate 80, sucrose, and polyethylene glycol 3350/4000; and a stabilizer selected from a group consisting of salts, amino acids, and amino acid salts; wherein the pH of the preservation solution ranges from 5 to 7.4.

Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.

Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.

Abstract: Some implementations described herein provide a method that includes forming a set of fins of a device, where the set of fins comprises an isolation fin disposed between a first fin and a second fin of the set of fins. The method also includes forming an isolation structure on at least one side of the isolation fin, with the isolation fin providing electrical isolation between the first fin and the second fin of the set of fins. Additionally, or alternatively, some implementations described herein provide a method that includes forming a funnel-shaped isolation structure between a first set of fins and a second set of fins. Additionally, or alternatively, some implementations described herein provide a method that includes forming, after forming a first gate structure and a second gate structure, an isolation structure between the first gate structure and the second gate structure.

Abstract: An air conditioning apparatus includes a housing, a cooling module, a cover, and a joint unit. The housing has a first side wall, a second side wall and a base, wherein one side of the first side wall and one side of the second side wall are respectively connected to opposite sides of the base; the first side wall, the second side wall and the base join together to define an accommodating space, a first gate, a second gate and a third gate thereamong; the cooling module is disposed in the accommodating space; the cover is disposed on the first gate; and the joint unit is disposed on the surface of the first side wall, the second side wall, the base or the cover.

Abstract: An air-conditioning device includes a plurality of duct modules and a power module. The duct modules each have a temperature-adjusting unit, an air flow-guiding unit and an energy transmission module. The temperature-adjusting unit is disposed at the second end of the duct module, and has opposing first and second side surfaces. The air flow-guiding unit is disposed at the duct module. The energy transmission module is disposed between the temperature-adjusting unit and the air flow-guiding unit. The power module provides operational power for the duct modules. The air flow-guiding unit guides air flow to enter from the first end of the duct modules. The energy transmission strength of the air flow is enhanced from the energy transmission module. The air flow passes through the first or second side surface of the temperature-adjusting unit, and exists from the second end of the duct modules.

Abstract: An air conditioning device includes a duct module and a heat exchange module. The duct module includes a temperature control unit disposed at a second region of the duct module, a first air flow guide unit disposed between a first region and the second region of the duct module, and a first liquid energy conducting element disposed at the first region of the duct module. The heat exchange module has a delivery duct, an accommodating case, a driver unit, a second air flow guide unit, a heat exchanger and a second liquid energy conducting element. The driver unit drives condensed water to pass through the delivery duct. The second air flow guide unit provides an air flow to the heat exchanger for exhausting waste heat. The second liquid energy conducting element performs heat exchange to cool down.

Abstract: An air conditioning device is provided, including an air duct module having a temperature adjusting unit, an energy conduction component, an airflow guiding unit and a control module. The temperature adjusting unit is disposed in the air duct module and has a first side configured for generating a first temperature range and a second side configured for generating a second temperature range. The airflow guiding unit is disposed in the air duct module. The energy conduction component is disposed in the air duct module configured for conducting the energy generated by the first side or the second side of the temperature adjusting unit. The control module is configured for controlling on-off operations or configurations of the temperature adjusting unit and the airflow guiding unit.

Abstract: An air-conditioning device is provided, having a plurality of duct modules and a power module. Each of duct modules has a first end, a second end opposite to the first end, a temperature adjusting unit, and a first airflow guiding unit. The temperature adjusting unit has a first side configured for generating a first temperature range and a second side opposite to the first side configured for generating a second temperature range. The first airflow guiding unit is disposed at the first end or the second end of the duct module configured for guiding an airflow to enter through the first end, pass through the first side or the second side, and exit from the second end. The power module provides power required for operations of the temperature adjusting unit and the first airflow guiding unit.

Abstract: An air circulating structure includes a housing having first, second and third sidewalls. The second and third sidewalls are positioned in a receiving space defined by the first sidewall and the second sidewall is positioned between the first and third sidewalls. The first sidewall has an opening and bending portions are formed at ends of the first sidewall and bending inward. Further, guiding elements are disposed on sides of the second sidewall facing the receiving space and positioned between the third sidewall and the bending portions. As such, air ducts are formed between the second sidewall and the first sidewall, the third sidewall, the guiding elements, the bending portions, respectively, and air vents are formed in junctions of the guiding elements with the bending portions and the third sidewall, thereby forming circulating air in the air ducts and vents to effectively improve the temperature regulating efficiency of an air-conditioning device.

Abstract: An air circulating structure includes a housing having first, second and third sidewalls. The second and third sidewalls are positioned in a receiving space defined by the first sidewall and the second sidewall is positioned between the first and third sidewalls. The first sidewall has an opening and bending portions are formed at ends of the first sidewall and bending inward. Further, guiding elements are disposed on sides of the second sidewall facing the receiving space and positioned between the third sidewall and the bending portions. As such, air ducts are formed between the second sidewall and the first sidewall, the third sidewall, the guiding elements, the bending portions, respectively, and air vents are formed in junctions of the guiding elements with the bending portions and the third sidewall, thereby forming circulating air in the air ducts and vents to effectively improve the temperature regulating efficiency of an air-conditioning device.

Abstract: A printing steel plate having a stress dispersion structure. Along a printing direction, at least one stress dispersion structure is additionally arranged on each of two sides adjacent to a plurality of blanking holes arranged into a pattern of a printed subject on the printing steel plate, the stress dispersion structure is formed by a plurality of stress buffer holes, and the stress buffer holes are visible holes that cannot be penetrated by ink on the printing steel plate.

Abstract: A metal template structure at least includes a frame, a supporting stainless wire cloth is disposed at an inner edge of the frame, a metal template is disposed on the supporting stainless wire cloth, and falling holes arranged in a printing shape are disposed on the metal template. The present invention is characterized in that: a feeding guide portion extends upwards from an upper periphery of each falling hole, an aperture of the feeding guide portion is greater than an aperture of the falling hole, and a periphery of the feeding guide portion and a periphery of the falling hole are connected in different forms such as a right angle surface, an inclined surface or a concave surface. By using a large aperture of the feeding guide portion and increasing the feeding guide portion, the thickness of the metal template is increased, so that more slurry can pass through the falling holes smoothly during printing, thereby achieving optimal falling effect.