Abstract: A three-dimensional ultrasonic imaging method includes transmitting an ultrasonic wave to a fetal head; receiving an ultrasonic echo, obtaining an ultrasonic echo signal, and obtaining the three-dimensional volume data of the fetal head according to the ultrasonic echo signal; according to the characteristics of a median sagittal section of the fetal head, detecting the median sagittal section in the three-dimensional volume data; and displaying the median sagittal section.

Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.

Abstract: A method and system for real-time calculating a microseismic focal mechanism based on deep learning is provided, which belongs to the technical field of microseismic monitoring. The method includes: creating a training dataset, the training data including simulated DAS microseismic strain data and a focal mechanism corresponding to the simulated DAS microseismic strain data; training a focal mechanism calculation model by using the training dataset, with the simulated DAS microseismic strain data as an input and the focal mechanism corresponding to the simulated DAS microseismic strain data as a target output, so as to obtain a trained focal mechanism calculation model; collecting DAS microseismic strain data by a surface and downhole DAS acquisition system; performing preprocess operations such as removing abnormally large values on the DAS microseismic strain data; inputting the preprocessed DAS microseismic strain data into a trained focal mechanism calculation model to obtain a focal mechanism.

Abstract: The present disclosure provides a method for two-phase partitioning production of a medium-chain fatty acid (MCFA) by dry anaerobic digestion. In the present disclosure, due to a slow heat transfer of the dry anaerobic digestion, a same dry anaerobic digestion device is naturally divided into two phases, and the MCFA is synthesized while producing electron acceptors and electron donors in the same dry anaerobic digestion device. Meanwhile, the dry anaerobic digestion device is provided with a high-efficiency decomposing microbial inoculant on an upper part and inoculated with sludge having a carbon chain extension function on a lower part. In this way, a material residence time is regulated, and cycles of hydrolytic acidification and carbon chain extension are shortened, thereby achieving the high-value conversion of agricultural waste while increasing a conversion rate of organic acids in the dry anaerobic digestion.

Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.

Abstract: An atomization module includes a main fixing member, an auxiliary fixing member, an atomization component and a piezoelectric component. The main fixing member includes a first bonding part, a second bonding part and a connecting part. The first bonding part has a first opening and a first bonding surface surrounding the first opening. The second bonding part is connected to the first bonding part, and the connecting part and the second bonding part surround the first bonding part. The auxiliary fixing member has a second opening and a second bonding surface surrounding the second opening. The piezoelectric component surrounds the first bonding part. The main fixing member has a first adhesive groove, which is jointly defined at least by the main fixing member, the auxiliary fixing member and the atomization component. The first adhesive is provided in the first adhesive groove.

Abstract: Embodiments are generally directed to an adaptive deformable kernel prediction network for image de-noising. An embodiment of a method for de-noising an image by a convolutional neural network implemented on a compute engine, the image including a plurality of pixels, the method comprising: for each of the plurality of pixels of the image, generating a convolutional kernel having a plurality of kernel values for the pixel; generating a plurality of offsets for the pixel respectively corresponding to the plurality of kernel values, each of the plurality of offsets to indicate a deviation from a pixel position of the pixel; determining a plurality of deviated pixel positions based on the pixel position of the pixel and the plurality of offsets; and filtering the pixel with the convolutional kernel and pixel values of the plurality of deviated pixel positions to obtain a de-noised pixel.

Abstract: A wearable device includes a frame element and a dielectric substrate. The frame element includes a first metal element, a second metal element, and a third metal element. A first gap is provided between the first metal element and the second metal element. A second gap is provided between the second metal element and the third metal element. A third gap is provided between the third metal element and the first metal element. The dielectric substrate is surrounded by the first metal element, the second metal element, and the third metal element. A first antenna element is formed by the first metal element. A second antenna element is formed by the second metal element. A third antenna element is formed by the third metal element.

Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.

Abstract: The present disclosure discloses a high-safety ternary positive electrode material and a method for preparing the same; wherein the ternary positive electrode material has a chemical composition of Lia(NixCoyMn1-x-y)1-bMbO2-cAc, wherein 0.75?a?1.2, 0.75?x<1, 0<y?0.15, 1?x?y>0, 0?b?0.01, 0?c?0.2, M is one or more selected from the group consisting of Al, Zr, Ti, Y, Sr, W and Mg, and A is one or more selected from the group consisting of S, F and N; and CMn?(1?x?y)?0.07; CCo?y?0.05; 0?[CMn?(1?x?y)]/(CCo?y)?2.0. The ternary positive electrode material of the present disclosure is a high-nickel single crystal material with gradient concentration; it has the advantages of high capacity and high thermal stability, and the preparation method is simple, and is suitable for large-scale production.

Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.

Abstract: Disclosed herein are an adhesion blocking element, a three-dimensional printing device and a three-dimensional printing method. The adhesion blocking element comprises: one light-transmittable main body comprising a first surface and a second surface which are disposed opposite to each other, and side faces connecting the first surface and the second surface; and a plurality of microstructures arranged on the main body, wherein each microstructure has one cavity formed in the main body and one first open face which is arranged on the first surface of the main body and communicated to the cavity. The present invention decreases the adhesion between the adhesion blocking element and the cured layer by improving the structure of the adhesion blocking element itself, and eliminates the negative pressure adsorption between the cured layer and the adhesion blocking element, so that it is easier to peel the adhesion blocking element off from the cured layer.

Abstract: A method, apparatus and system for training an embedding space for content comprehension and response includes, for each layer of a hierarchical taxonomy having at least two layers including respective words resulting in layers of varying complexity, determining a set of words associated with a layer of the hierarchical taxonomy, determining a question answer pair based on a question generated using at least one word of the set of words and at least one content domain, determining a vector representation for the generated question and for content related to the at least one content domain of the question answer pair, and embedding the question vector representation and the content vector representations into a common embedding space where vector representations that are related, are closer in the embedding space than unrelated embedded vector representations. Requests for content can then be fulfilled using the trained, common embedding space.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: A semiconductor structure and method for manufacturing thereof are provided. The semiconductor structure includes a silicon substrate having a first surface, a III-V layer on the first surface of the silicon substrate and over a first active region, and an isolation region in a portion of the III-V layer extended beyond the first active region. The first active region is in proximal to the first surface. The method includes the following operations. A silicon substrate having a first device region and a second device region is provided, a first active region is defined in the first device region, a III-V layer is formed on the silicon substrate, an isolation region is defined across a material interface in the III-V layer by an implantation operation, and an interconnect penetrating through the isolation region is formed.

Abstract: A knitted component comprising two yarns, forming at least a heel region of an upper for an article of footwear, where one of the yarns comprises a thermoplastic material. The outer surface may include a fused area comprising a first thermoplastic yarn. The inner surface may be at least partially formed with a second yarn and may substantially exclude the thermoplastic material. There may be a transitional area including a reduced amount of thermoplastic material relative to a fused area. The knitted component may include a cushioning material between layers of the knit element.

Abstract: A method includes: training a machine learning model with a plurality of electronic circuit placement layouts; predicting, by the machine learning model, fix rates of design rule check (DRC) violations of a new electronic circuit placement layout; identifying hard-to-fix (HTF) DRC violations among the DRC violations based on the fix rates of the DRC violations of the new electronic circuit placement layout; and fixing, by an engineering change order (ECO) tool, the DRC violations.

Abstract: An optical transceiver includes housing, connector coupler and internal optical connector. Opening of housing is located on a side of housing and connected to accommodation space of housing. Connector coupler includes positioning frame and at least one elastic holding arm. Elastic holding arm protrudes from positioning frame and forms holding space. Positioning frame is located between at least a part of elastic holding arm and opening. Positioning frame is disposed in accommodation space. Positioning recess is located on a side of positioning frame close to opening and connected to holding space. At least a part of internal optical connector is located in holding space to be held in position by elastic holding arm. Positioning recess is configured to position external optical connector so as to allow internal optical connector to be plugged with and optically coupled to external optical connector.

Abstract: A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.

Abstract: Embodiments of the present disclosure provide a DAS same-well monitoring real-time microseismic effective event identification method based on deep learning, including: constructing a DAS-based horizontal well microseismic monitoring system; constructing a training data set, including microseismic event data, pipe wave data and background noise data with different types of labels; constructing a signal identification module; training the signal identification module by using the training data set; preprocessing actual monitoring data, inputting the preprocessed data into the signal identification module to obtain an output result; marking microseismic events identified in the output result, and updating the marked microseismic events into the training data set; and adjusting and updating the signal identification module. The identification method according to the present disclosure can identify microseismic events in DAS same-well monitoring data in real time and efficiently.